Ultrasonic vibration bonding chip mounter

• US 5,884,831 A
• Filed: 04/24/1997
• Issued: 03/23/1999
• Est. Priority Date: 07/05/1996
• Status: Expired due to Term

• Current Assignee: Ultex Corporation
• Original Assignee: Ultex Corporation
• Inventors: Nakai, Seiya, Sato, Shigeru, Katsumi, Mitsugu
• Primary Examiner(s): Ryan, Patrick
• Assistant Examiner(s): Knapp, Jeffrey T.
• Application Number:
  US08/845,372
• Time in Patent Office: 698 Days
• Field of Search: 228/1.1, 228/6.2, 228/9, 228/49.5
• US Class Current: 228/6.2
• CPC Class Codes: B23K 20/10 making use of vibrations, e.g. ultrasonic welding
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H05K 13/046 Surface mounting surface mounted components H05K3/341
• CPC Class Codes: H05K 13/0812 the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Abstract

An ultrasonic vibration bonding chip mounter includes a chip carrying unit arranged above a chip supply unit, a prealignment unit and a mounting unit which are arranged in a row and having a movable table which can move back and forth in a direction parallel to a direction where these units are arranged, a pick-up unit, attached to the movable table, for transferring a chip from the chip supply unit to the prealignment unit, and an ultrasonic vibration bonding unit, attached to the movable table, for transferring the chip from the prealignment unit to a mounting unit so that the chips are transferred from the chip supply unit to the prealignment unit and further to the mounting unit by the reciprocation of the movable table one by one.

Claims

1. An ultrasonic vibration bonding chip mounter comprising:

a chip supply unit for controlling the position of a pallet table so that one to be mounted out of a large number of chips on the pallet table is located at a predetermined pick-up position;

a prealignment unit having a prealignment table for roughly positioning the chip;

a mounting unit for controlling the position of a mount table so that the chip mounting position of a substrate on the mount table is aligned with a predetermined mounting position, the chip supply. unit, the prealignment unit and the mounting unit being arranged in a row at equal intervals;

a chip carrying unit arranged above the chip supply unit, the prealignment unit and the mounting unit and having a movable table whose position is controlled such that it moves back and forth between two positions in a direction where the chip supply unit, the prealignment unit and the mounting unit are arranged;

a pick-up unit having a vertically movable pick-up arm for picking up the chip from the pallet table and placing the chip on the prealignment table;

an ultrasonic vibration bonding unit, movable vertically and having a pick-up function, for picking up the chip from the prealignment table and placing the chip on the mount table by means of a bonding working portion of a resonator connected to a transducer for generating ultrasonic vibration, the pick-up unit and the ultrasonic vibration bonding unit being attached to the movable table of the chip carrying unit with the same space therebetween as the space between the prealignment unit and the chip supply unit and the the space between the prealignment unit and the mounting unit; and

a measuring unit for picking up images of the chip to be mounted and picked up by the bonding working portion of the resonator and the substrate on the mount table when it enters the space between the ultrasonic vibration bonding unit and the mounting unit which face each other in a vertical direction from sideways and outputting an output for aligning the chip and the chip mounting position of the substrate to the mounting unit.

2. An ultrasonic vibration bonding chip mounter comprising:

a chip supply unit having a pallet table on which a chip to be mounted is set at a specified position;

a prealignment unit having a prealignment table for roughly positioning the chip;

a mounting unit for controlling the position of a mount table so that the chip mounting position of a substrate on the mount table is aligned with a predetermined mounting position, the chip supply unit, the prealignment unit and the mounting unit being arranged in a row at equal intervals;

a chip carrying unit arranged above the chip supply unit, the prealignment unit and the mounting unit and having a movable table whose position is controlled such that it moves back and forth between two positions in a direction where the chip supply unit, the prealignment unit and the mounting unit are arranged;

a pick-up unit having a vertically movable pick-up arm for picking up the chip from the pallet table and placing the chip on the prealignment table;

an ultrasonic vibration bonding unit, having a pick-up function and movable vertically, for picking up the chip and placing the chip on the mount table by means of a bonding working portion of a resonator connected to a transducer for generating ultrasonic vibration, the pick-up unit and the ultrasonic vibration bonding unit being attached to the movable table of the chip carrying unit with the same space therebetween as the space between the prealignment unit and the chip supply unit and the space between the prealignment unit and the mounting unit; and

a measuring unit for detecting the chip to be mounted and picked up by the bonding working portion of the resonator and the substrate on the mount table and outputting an output for aligning the chip with the chip mounting position of the substrate to the mounting unit.

3. The ultrasonic vibration bonding chip mounter of claim 2, wherein the chip supply unit has a means for controlling the position of the pallet table so that one of a plurality of chips on the pallet table is set at a predetermined pick-up position.

4. The ultrasonic vibration bonding chip mounter of claim 2, wherein the measuring unit comprises a camera, which enters the space between the ultrasonic vibration bonding unit and the mounting unit which face each other in a vertical direction from sideways, for picking up images of both the chip and the substrate for mounting the chip to obtain the positional relationship between the chip and the chip mounting position of the substrate.