Using implants to lower anneal temperatures
First Claim
1. A method for forming refractory metal silicide at a metal/semiconductor interface, comprising:
- a) implanting a refractory metal in a silicon substrate, to form an implanted region, wherein the refractory metal is selected from the group consisting of titanium, tungsten, tantalum, cobalt and molybdenum;
b) forming a layer of the refractory metal on the implanted region;
c) annealing to form refractory metal silicide, comprising at least silicon and the refractory metal; and
d) implanting an element selected from the group consisting of cobalt, cesium, hydrogen, fluorine, and deuterium at a time selected from the group consisting of the times of prior to implanting the refractory metal and subsequent to annealing.
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Accused Products
Abstract
A method for lowering the anneal temperature required to form a multi-component material, such as refractory metal silicide. A shallow layer of titanium is implanted in the bottom of the contact area after the contact area is defined. Titanium is then deposited over the contact area and annealed, forming titanium silicide. A second embodiment comprises depositing titanium over a defined contact area. Silicon is then implanted in the deposited titanium layer and annealed, forming titanium silicide. A third embodiment comprises combining the methods of the first and second embodiments. In further embodiment, nitrogen, cobalt, cesium, hydrogen, fluorine, and denterium are also implanted at selected times.
46 Citations
26 Claims
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1. A method for forming refractory metal silicide at a metal/semiconductor interface, comprising:
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a) implanting a refractory metal in a silicon substrate, to form an implanted region, wherein the refractory metal is selected from the group consisting of titanium, tungsten, tantalum, cobalt and molybdenum; b) forming a layer of the refractory metal on the implanted region; c) annealing to form refractory metal silicide, comprising at least silicon and the refractory metal; and d) implanting an element selected from the group consisting of cobalt, cesium, hydrogen, fluorine, and deuterium at a time selected from the group consisting of the times of prior to implanting the refractory metal and subsequent to annealing.
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2. A method for forming refractory metal silicide at a metal/semiconductor interface, comprising:
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a) implanting a refractory metal in a silicon substrate, to form an implanted region, wherein the refractory metal is selected from the group consisting of titanium, tungsten, tantalum, cobalt and molybdenum; b) forming a layer of the refractory metal on the implanted region; c) annealing to form refractory metal silicide, comprising at least silicon and the refractory metal; and d) implanting nitrogen into the implanted region at a time selected from the group consisting of prior to annealing and subsequent to annealing, such that the depth of the implanted nitrogen is approximately between 20 to 300 angstroms.
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3. A method for forming a plurality of compounds on a semiconductor substrate, comprising the steps of:
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a) implanting a first element in a semiconductor substrate, comprising a second element, to form a first implanted region; b) depositing a layer of material, comprising the first element, on the first implanted region; c) implanting a third element in the layer of material, to form a second implanted region; and d) annealing to form at least one compound, comprising at least the first and second elements. - View Dependent Claims (4, 5, 6, 7, 8, 9)
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10. A method for forming titanium silicide on a silicon substrate, comprising the steps of:
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a) implanting titanium in a silicon substrate, to form an implanted region; b) forming a layer of titanium on the implanted region; and c) annealing to form titanium silicide. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method for forming a plurality of compounds on a semiconductor substrate, comprising:
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a) implanting a first element in a semiconductor substrate, comprising a second element, to form a first implanted region, wherein the first element comprises a refractory metal selected from the group consisting of titanium, tungsten, tantalum, cobalt, and molybdenum; b) depositing a layer of material, comprising the first element, on the first implanted region; c) implanting a third element in the layer of material, to form a second implanted region, wherein the third element is selected from the group consisting of nitrogen and silicon; and d) annealing to form at least one compound, comprising at least the first and second elements. - View Dependent Claims (17, 18, 19, 20)
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21. A method for forming a plurality of compounds on a semiconductor substrate, comprising:
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a) implanting a first element in a semiconductor substrate, comprising a second element, to form a first implanted region, wherein the first element comprises a refractory metal selected from the group consisting of titanium, tungsten, tantalum, cobalt, and molybdenum; b) depositing a layer of material, comprising the first element, on the first implanted region; c) implanting a third element in the layer of material, to form a second implanted region, wherein the third element is nitrogen; and d) annealing in a nitrogen-containing ambient to form at least two compounds, wherein a first compound comprises at least the first and second elements, further wherein a second compound comprises at least the first and third elements.
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22. A method for forming a plurality of compounds on a semiconductor substrate, comprising:
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a) implanting a first element in a semiconductor substrate, comprising a second element, to form a first implanted region, wherein the first element comprises a refractory metal selected from the group consisting of titanium, tungsten, tantalum, cobalt, and molybdenum; b) depositing a layer of material, comprising the first element, on the first implanted region; c) implanting a third element in the layer of material, to form a second implanted region, wherein the third element is selected from the group consisting of nitrogen and silicon; d) annealing to form at least one compound, comprising at least the first and second elements; and e) implanting a fourth element selected from the group consisting of cobalt, cesium, hydrogen, fluorine, and deuterium at a time selected from the group consisting of the times of prior to implanting the first element, prior to implanting the third element, and subsequent to annealing.
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23. A method for forming titanium silicide on a silicon substrate, comprising:
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a) implanting titanium in a silicon substrate, to form an implanted region, wherein the silicon substrate comprises the bottom of a contact hole, further wherein the contact hole has sides defined by an insulator material selected from the group consisting of borophosphosilicate glass and doped oxides; b) forming a layer of titanium on the implanted region; and c) annealing to form titanium silicide.
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24. A method for forming titanium silicide on a silicon substrate, comprising:
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a) implanting titanium in a silicon substrate, to form an implanted region, wherein the silicon substrate comprises the bottom of a contact hole, further wherein the contact hole has sides defined by an insulator material selected from the group consisting of borophosphosilicate glass and doped oxides; b) forming a layer of titanium on the implanted region; c) annealing to form titanium silicide; and d) implanting nitrogen into the layer of titanium at a time selected from the group consisting of the times of prior to annealing and subsequent to annealing. - View Dependent Claims (25, 26)
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Specification