Structure and fabrication method for interconnecting light emitting diodes with metallization extending through vias in a polymer film overlying the light emitting diodes

• US 5,886,401 A
• Filed: 09/02/1997
• Issued: 03/23/1999
• Est. Priority Date: 09/02/1997
• Status: Expired due to Fees

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Liu, Yung Sheng
• Primary Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US08/921,960
• Time in Patent Office: 567 Days
• Field of Search: 257/678, 257/99, 257/88, 257/98, 257/668, 257/94, 257/723, 257/82, 257/79, 257/81, 372/45, 372/50, 347/238, 347/245, 345/84, 345/82, 345/46, 345/205, 345/206, 345/903, 345/905, 388/14, 388/37, 359/34
• US Class Current: 257/678
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/82039 using a laser
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01024 Chromium [Cr]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01049 Indium [In]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 33/507 : the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting diode (LED) interconnection package includes an LED situated on a substantially transparent substrate, the LED having a contact surface with contact pads and having side surfaces; a polymer film overlying the contact surface and having via openings; a substantially transparent support piece surrounding the side surfaces of the LED and the substrate; and metallization overlying the polymer film and extending through the via openings for interconnecting the contact pads.

Claims

1. A light emitting diode (LED) interconnection package comprising:

an LED grown on a substantially transparent substrate, the LED having a contact surface with contact pads and having side surfaces;

a polymer film overlying the contact surface and having via openings;

a substantially transparent support piece surrounding the side surfaces of the LED and the substrate; and

metallization overlying the polymer film and extending through the via openings for interconnecting the contact pads.

2. The package of claim 1 wherein the support piece comprises an epoxy compound.

3. The package of claim 2 wherein the metallization extends through the via openings to the contact pads.

4. The package of claim 2 wherein the metallization extends through the via openings to bonding pads on the polymer film and wherein solder couples the bonding pads to the contact pads.

5. The package of claim 2 further comprising a reflector situated on a surface of the polymer film facing the LED.

6. The package of claim 2 further comprising a phosphor layer coated on a surface of the epoxy compound facing away from the LED.

7. A light emitting diode (LED) array interconnection package comprising:

a plurality of LEDs grown on substantially transparent substrates, the LEDs having a contact surfaces with contact pads and having side surfaces;

a polymer film overlying the contact surfaces and having via openings;

a substantially transparent support piece surrounding the side surfaces of the LEDs and the substrates; and

metallization overlying the polymer film and extending through the via openings for interconnecting the contact pads.

8. The package of claim 7 wherein the metallization extends through the via openings to the contact pads.

9. The package of claim 7 wherein the metallization extends through the via openings to bonding pads on the polymer film and wherein solder couples the bonding pads to the contact pads.

10. The package of claim 7 further comprising a reflector situated on a surface of the polymer film facing the LED.

11. The package of claim 10 further comprising a phosphor layer coated on a surface of the epoxy compound facing away from the LED.

12. A fabrication method for a interconnecting at least one light emitting diode (LED) having contact pads situated on a contact surface, the method comprising:

attaching the contact surface of the LED and a polymer film;

forming via openings in the polymer film;

applying a substantially transparent support piece around side surfaces of the LED and the substrate; and

applying metallization over the polymer film and through the via openings to interconnect the contact pads.

13. The method of claim 12 wherein applying a substantially transparent support piece around side surfaces of the LED and the substrate comprises molding a substantially transparent epoxy compound.

14. The method of claim 13 wherein applying metallization comprises depositing metallization through the via openings to the contact pads.

15. The method of claim 13 wherein applying metallization comprises applying metallization through the via openings to bonding pads and wherein attaching the contact surface of the LED and the polymer comprises soldering the bonding pads to the contact pads.

16. The method of claim 13 further comprising applying a reflector on a surface of the polymer film facing the LED prior to attaching the contact surface of the LED and the polymer film.

17. The method of claim 16 wherein applying metallization comprises depositing metallization through the via openings to the contact pads.

18. The method of claim 16 wherein applying metallization comprises applying metallization through the via openings to bonding pads on the polymer film and soldering the bonding pads to the contact pads.

19. The method of claim 12, wherein applying the support piece occurs after attaching the contact surface of the LED and the polymer film.

20. The method of claim 12, wherein applying the support piece occurs before attaching the contact surface of the LED and the polymer film.