Wafer support member

• US 5,886,863 A
• Filed: 07/25/1996
• Issued: 03/23/1999
• Est. Priority Date: 05/09/1995
• Status: Expired due to Fees

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: Kuchimachi, Kazuhiro, Nagasaki, Koichi, Kawanabe, Yasunori, Nagano, Saburo, Aida, Hiroshi, Kitazawa, Kenji
• Primary Examiner(s): FLEMING, FRITZ M
• Application Number:
  US08/693,532
• Time in Patent Office: 971 Days
• Field of Search: 361/234, 361/230-235, 279/128
• US Class Current: 361/234
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: H02N 13/00 Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
• CPC Class Codes: Y10T 279/23 with magnetic or electrostatic means

Abstract

A wafer support member comprises a base made of ceramics with thickness of 3 mm or more, a metallic electrode plate with thickness of 0.5 mm or more bonded onto the base, and an attraction surface composed of an aluminum nitride film with thickness of 0.01 to 0.5 mm coated on the surface of the electrode plate. The electrode plate functions as a plasma generating electrode when high frequency voltage is applied to the electrode plate and as an electrostatic attraction electrode when direct-current high voltage is applied to the electrode plate. Also, a wafer holding device for holding a wafer such as semiconductor wafer and glass substrate for liquid crystal is disclosed. The wafer holding device comprises a base body of aluminum nitride sintered body containing resistance heating elements therein. Lead terminals for feeding power to the resistance heating elements are formed in the lower surface of the base body. In one feature, at least the lead terminals and junction thereof are coated with a ceramic film composed of any one of silicon carbide, silicon nitride, sialon, and aluminum nitride. In another feature, the base body has a flat surface for forming an attraction surface, an outer circumference and penetration holes. Each of the penetration holes opens in the flat surface, and has an inner wall. An aluminum nitride film covers the flat surface, the outer circumference, and the inner wall of each of the penetration holes.

Claims

1. A wafer support member comprising:

a ceramic base body,

a plurality of electrode portions with thickness of 0.02 mm or more and maximum length of 5 cm or less on the surface of the ceramic base body, and

a holding surface formed on each electrode portion with an aluminum nitride film with thickness of 0.01 to 0.5 mm.

2. A wafer support member of claim 1, wherein heating resistance elements for heating are buried in the ceramic base body.

3. A wafer support member of claim 1 further comprising a source of direct-current high voltage and high frequency voltage, wherein the electrode portions function as plasma generating electrode, as well as electrostatic attraction electrode, by applying the direct-current high voltage for electrostatic attraction and the high frequency voltage for plasma generation.

4. The wafer support member of claim 1, wherein the ceramic base body is composed of ceramics with the volume resistivity of 10¹⁰ Ω

·

cm or more and thermal conductivity of 20 W/m·

K or more, and the electrode portions are composed of at least one of tungsten, molybdenum and Kovar.

5. A wafer holding device for holding a wafer such as semiconductor wafer and glass substrate for liquid crystal, the wafer holding device comprising:

a base body of aluminum nitride sintered body, the base body defining a lower surface and containing resistance heating elements therein, and

lead terminals for feeding power to the resistance heating elements in the lower surface of the base body, wherein at least the lead terminals and junction thereof are coated with a ceramic film composed of any one of silicon carbide, silicon nitride, sialon, and aluminum nitride.

6. A wafer support member, comprising:

a ceramic body having an attraction surface,

an internal electrode buried in the ceramic body,

a base plate, and

an adhesive layer bonding the ceramic body and the base plate, the adhesive layer comprising at least one of indium and an indium alloy.

7. The wafer support member of claim 6, wherein the adhesive layer is comprised of 40 to less than 100 wt. % of indium and at least one of Sn, Ag, Pb, Zn and Al by greater than 0 to 60 wt. %.

8. An attraction device, comprising:

a base body comprising at least one of a metal and a ceramic,

the base body having a flat surface for forming an attraction surface, an outer circumference and penetration holes, the penetration holes opening in said flat surface, each of the penetration holes having an inner wall,

the outer circumference and the inner wall of each of the penetration holes of the base body defining an angle with the flat surface, the angle being not greater than about 80°

, and

an aluminum nitride film covering the flat surface, the outer circumference, and the inner wall of each of the penetration holes.

9. An attraction device, comprising:

a base body comprising at least one of a metal and a ceramic,

the base body having a flat surface for forming an attraction surface and penetration holes opening in said flat surface, each of the penetration holes having an inner wall,

the base body having an outer circumference with a boundary that is chamfered to a C-form or R-form with the outer circumference and the flat surface, and

an aluminum nitride film covering the flat surface, the outer circumference, and the inner wall of each of the penetration holes.

10. The attraction device of claim 9, wherein a ratio of the chamfered boundary to an overall thickness of the base body is at least 1/16.

11. A wafer support member, comprising:

a metallic electrode plate having a surface and a thickness of not less than 0.5 mm,

a ceramic base body having a thickness of not less than 3 mm,

the metallic electrode plate and the base body being bonded, and

an attraction surface coated with an aluminum nitride film having a thickness of between 0.01 mm and 0.5 mm formed on the surface of the electrode plate.

12. The wafer support member of claim 11, comprising:

heating resistance elements buried in the ceramic base.

13. The wafer support member of claim 11, wherein

the electrode plate comprises a plasma generating electrode to which a high frequency voltage is applied for plasma generation.

14. The wafer support member of claim 11, wherein

the electrode plate comprises an electrostatic attraction electrode to which a direct current high voltage is applied for electrostatic attraction.

15. The wafer support member of claim 11, wherein the base body and electrode plate are partly bonded and form a mutual junction boundary and wherein at least one of helium and argon gas is introduced in the mutual junction boundary.

16. The wafer support member of claim 11, wherein the base body comprises ceramic with a volume resistivity of not less than 10¹⁰ Ω

·

cm and a thermal conductivity of not less than 20 W/m·

K, and the electrode plate comprises at least one of tungsten, molybdenum and Kovar.

17. A wafer support member comprising:

a base made of ceramics with thickness of 3 mm or more,

a metallic electrode plate with thickness of 0.5 mm or more bonded onto the base,

an attraction surface composed of an aluminum nitride film with thickness of 0.01 to 0.5 mm coated on the surface of the electrode plate, and

a source of direct-current high voltage and high frequency voltage,

wherein the electrode plate functions as plasma generating electrode, as well as electrostatic attraction electrode, by applying the direct-current high voltage for electrostatic attraction and the high frequency voltage for plasma generation.