Electrostatic chuck having a combination electrode structure for substrate chucking, heating and biasing
First Claim
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1. An electrostatic chuck comprising:
- a body of dielectric material;
at least one electrode embedded in said body of dielectric material; and
two feedthroughs connected to said at least one electrode for receiving DC voltage for electrostatic chucking, for receiving RF power for RF biasing of the chuck, and for receiving heating current for heating said electrostatic chuck.
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Abstract
An electrostatic chuck including a body of ceramic material, a pair of electrodes embedded in the body of ceramic material, and two feedthroughs connected to each of the electrodes for receiving DC chucking voltage, RF biasing power, and electric heating current. The electrode structure simultaneously provides biasing, chucking and heating of a wafer that is retained by the chuck.
103 Citations
24 Claims
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1. An electrostatic chuck comprising:
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a body of dielectric material; at least one electrode embedded in said body of dielectric material; and two feedthroughs connected to said at least one electrode for receiving DC voltage for electrostatic chucking, for receiving RF power for RF biasing of the chuck, and for receiving heating current for heating said electrostatic chuck. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. Combination electrostatic chuck apparatus, comprising:
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an electrostatic chuck including a body of ceramic material, first and second electrodes embedded in said body of ceramic material, a first pair of feedthroughs connected to said first electrode and a second pair of feedthroughs connected to said second electrode; a DC voltage supply connected to said first electrode through one feedthrough of said first pair of feedthroughs and to said second electrode through one feedthrough of said second pair of feedthroughs for electrostatic chucking of a semiconductor wafer to said body of ceramic material; a RF power supply connected to said first electrode through a first capacitor and through one feedthrough of said first pair of feedthroughs and to said second electrode through a second capacitor and through one feedthrough of said second pair of feedthroughs to couple RF power to said first electrode and said second electrode for RF biasing of said electrostatic chuck; and at least one heating current supply connected to said first pair of feedthroughs to connect RF heating current to said first electrode to heat said chuck. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification