Heat sink device

• US 5,886,870 A
• Filed: 11/06/1996
• Issued: 03/23/1999
• Est. Priority Date: 11/07/1995
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Omori, Akimitsu
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US08/744,827
• Time in Patent Office: 867 Days
• Field of Search: 165/80.2, 165/80.3, 165/185, 174/16.3, 257/706-707, 257/712-713, 257/718-719, 257/722, 361/688, 361/690, 361/697, 361/703-704, 361/707, 361/710, 361/717-718, 361/722
• US Class Current: 361/704
• CPC Class Codes: H01L 2023/405 heatsink to package
• CPC Class Codes: H01L 2023/4062 heatsink to or through board or cabinet
• CPC Class Codes: H01L 2023/4087 Mounting accessories, interposers, clamping or screwing parts
• CPC Class Codes: H01L 23/32 Holders for supporting the complete device in operation, i.e. detachable fixtures H01L23/40 takes precedence
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat sink apparatus including a heat conducting plate which is in contact with an IC device to conduct heat generated in the IC device, cooling fins which are mounted at a center section of the heat conducting plate to radiate the generated heat conducted, and protection pins which are mounted on a periphery of the heat conducting plate to protect the cooling fins. The heat sink apparatus has improved reliability and safety during handling.

Claims

1. A heat sink apparatus for cooling a device, comprising:

a heat conducting plate having a plurality of linear peripheries and first and second surfaces, the first surface adapted to be in contact with the device to be cooled;

cooling fins which are mounted on the second surface of the heat conducting plate to radiate heat generated by the device to be cooled; and

protection pins which are mounted on the second surface along the linear peripheries of the heat conducting plate at intervals smaller than a length of each of the linear peripheries and so as to surround and protect the cooling fins.

2. A heat sink apparatus according to claim 1, wherein a protection pins are circular pins thicker than the cooling fins and having a same height or higher than the cooling fins.

3. A heat sink apparatus according to claim 1, further comprising:

a holding member;

wherein the heat conducting plate is adapted to be mounted on the device to be cooled by the holding member having notches fitted to the protection pins and adapted to hold the heat conducting plate against the device to be cooled so that the heat conducting plate is prevented from moving.

4. A heat sink apparatus according to claim 3, wherein the holding member further includes inclined holding claws which are adapted to act as a spring for holding the heat conducting plate against the device to be cooled with an appropriate pressure.

5. A heat sink apparatus according to claim 4, wherein said holding member is a nearly square frame having a curved spring member which is used to join or integrally form said holding claws on both sides of said square frame.

6. A heat sink apparatus according to claim 5, wherein said frame has an elongated portion bent in the shape of Z on which a pair of engaging notches are formed at the edge of the elongated portion, and said heat sink apparatus further comprises a pair of columns having a peripheral groove which are adapted to be mounted on a printed circuit board, said pair of engaging notches being engaged with said pair of columns at the peripheral grooves thereof.

7. A heat sink apparatus according to claim 1, wherein said protection pins comprise rectangular protection guards which are mounted on the linear peripheries of the heat conducting plate to protect the cooling fins.

8. A heat sink apparatus according to claim 1, wherein said protection pins comprise grid protection guards which are mounted on the linear peripheries of the heat conducting plate to protect the cooling fins.

9. A heat sink apparatus according to claim 8, wherein said protection guards are one of circular, polygonal circular, and polygonal other than a grid.