Data carrier with an electronic module and a method for producing the same

• US 5,888,624 A
• Filed: 11/25/1996
• Issued: 03/30/1999
• Est. Priority Date: 02/04/1994
• Status: Expired due to Term

• Current Assignee: Girsecke & Devrient GmbH
• Original Assignee: Giesecke & Devrient GmbH
• Inventors: Ojster, Albert, Barak, Renee-Lucia, Haghiri, Yahya
• Primary Examiner(s): MULVANEY, ELIZABETH EVANS
• Application Number:
  US08/682,781
• Time in Patent Office: 855 Days
• Field of Search: 428/195, 428/209, 428/211, 428/532, 428/537.5, 428/901, 235/487, 235/488, 235/492
• US Class Current: 428/195.1
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/24934 including paper layer
• CPC Class Codes: Y10T 428/31993 Of paper

Abstract

The invention relates to a data carrier comprising a one- or multilayer card body in which an electronic module is embedded. The layers of the card body consist of paper and/or cardboard and are interconnected for example by thermally activable adhesive or contact adhesive. The cards can be produced by continuous technology, the individual card layers being supplied from endless rolls, provided with the necessary windows for receiving the modules, and finally interconnected. The modules are inserted in the resulting gaps. The individual cards are punched out.

Claims

1. A data carrier formed as an IC card consisting of at least one of paper and cardboard, said data carrier comprising a card body made of at least one of paper and cardboard, and an electronic module for exchanging data with an external device, dimensions of said card body fulfilling ISO standard ISO 7810, said electronic module having contact surfaces for touch contact, and said electronic module being embedded in said card body at such a position that said contact surfaces are located in an area of said data carrier fixed by ISO standard ISO 7816/2.

2. The data carrier of claim 1, wherein said card body comprises a gap for receiving said electronic module and said electronic module is glued into said gap in said card body in a manner offering good protection against splitting of said card body.

3. The data carrier of claim 1, wherein said card body comprises a gap for receiving said electronic module and said electronic module is glued into said gap in said card body with a liquid adhesive.

4. The data carrier of claim 3, wherein said liquid adhesive moistens at least largely an entire wall area of said gap so as to prevent splitting of said card body in said wall area.

5. The data carrier of claim 3, wherein said gap is provided with at least one undercut filled with said liquid adhesive.

6. The data carrier of claim 1, wherein said card body is formed from single-layer cardboard containing a gap for receiving said electronic module.

7. The data carrier of claim 1, wherein said card body has a plurality of layers and at least one of the outermost layers and at least one of the inner layers are provided with a window to form a two-step gap in which said electronic module is embedded.

8. The data carrier of claim 7, wherein said layers are interconnected by adhesive layers formed as one of thermally activable layers and contact adhesive layers.

9. The data carrier of claim 8, wherein one of said adhesive layers connecting said at least one of said outermost layers with said inner layers is exposed in a shoulder area of said two-step gap and serves to connect said electronic module with said card body.

10. The data carrier of claim 1 wherein surfaces of said card body are provided with a surface coating and with a printed image.

11. A data carrier formed as an IC card consisting of at least one of paper and cardboard, the data carrier having a card body made of at least one of paper and cardboard and an electronic module for exchanging data with an external device, dimensions of the card body fulfilling ISO standard ISO 7810, the electronic module being capable of noncontacting communication, and the electronic module being embedded in the card body in such a way that it is surrounded on all sides by paper or cardboard.

12. The data carrier of claim 11, wherein said card body has a plurality of layers, at least one of the layers located between the outermost layers of said card body being provided with a window for receiving said electronic module.

13. The data carrier of claim 12, wherein said layers are interconnected by adhesive layers formed as one of thermally activable layers and contact adhesive layers.

14. The data carrier of claim 12, wherein said electronic module has an anchoring frame located between two of said layers of said card body.

15. The data carrier of claim 14, wherein ones of said layers adjacent said anchoring frame are adhesive layers.

16. The data carrier of claim 11, wherein said card body is provided with a surface coating and a printed image.

17. A method for producing data carriers, comprising the steps of:

(a) supplying cardboard with the thickness of said data carriers from a roll in endless form,

(b) providing said cardboard with punchings at predetermined intervals so that windows arise in the cardboard,

(c) providing said cardboard with debossing in the area of said windows so that depressions with a greater diameter than that of the windows arise in said cardboard in the area of said windows,

(d) inserting electronic modules in the resulting gaps in the cardboard, whereby first areas of said electronic modules bearing contact surfaces for contacting coupling are located in said depressions and second areas of said modules bearing integrated circuits are located in said windows,

(e) gluing said electronic modules in said gaps, and

(f) punching individual data carriers out of said roll.

18. A method for producing data carriers, comprising the steps of:

(a) supplying an upper cover layer, a lower cover layer and at least one core layer of at least one of cardboard and paper each from a roll,

(b) punching windows in said core layer at predetermined intervals, bringing said core layer and said lower cover layer together and gluing them, whereby gaps arise in said core layer at the positions of said windows,

(c) introducing an electronic module for noncontacting communication in said resulting gaps,

(d) bringing said core layer together with said upper cover layer and gluing them together, and

(e) punching individual data carriers out of the resulting band.

19. The method of claim 18, wherein the individual layers are interconnected by thermally activable adhesive layers which are activated by heated laminating rolls.

20. The method of claim 19, wherein:

(a) at least a part of said core layers has through holes which are filled with adhesive from said thermally activable adhesive layers during connection of said card layers so that the layers adjacent said core layers are interconnected indirectly via said adhesive in said through holes,

(b) said through holes are located in the area of the punching edges along which individual cards are punched out in a further step, and

(c) said individual cards are punched out of the resulting sheet or band in such a way that said punching edges extend through said through holes in said core layers.

21. The method of claim 18, wherein the individual layers are interconnected by contact adhesive.

22. A method for producing data carriers, comprising the steps of:

(a) supplying an upper cover layers, a lower cover layer and at least one core layer of at least one of cardboard and paper each from a roll,

(b) providing said core layer and said upper cover layer with windows by punching, the openings in said cover layer being greater than the openings in said core layer,

(c) interconnecting the three layers, yielding a band having two-step gaps at predetermined intervals,

(d) introducing electronic modules in said two-step gaps, whereby parts of said electronic modules bearing contact surfaces for contacting communication are located in the upper areas of said gaps and parts of the electronic modules bearing integrated circuits are located in the lower areas of said gaps, and

(e) punching individual data carriers out of the resulting band.

23. The method of claim 22, wherein said electronic modules are inserted in the card structure before connection of the individual layers, and are glued directly in said resulting gaps during connection of said layers.

24. The method of claim 22, wherein said electronic modules are glued into said gaps after connection of the individual layers.

25. A method for producing data carriers, comprising the steps of:

(a) supplying an upper layer, a lower layer and at least one core layer of at least one of cardboard and paper,

(b) interconnecting the layers, yielding a band or sheet,

(c) cutting in at least said upper cover layer with a cutting tool at predetermined intervals in such a way that the edges of cut include certain areas,

(d) using a milling tool to produce gaps in said areas, whereby the limits of said gaps located in said upper cover layer are fixed by said edges of cut,

(e) introducing electronic modules in the resulting gaps, and

(f) punching individual data carriers out of the resulting band or sheet.

26. A method for producing a data carrier, formed as an IC card and having an embedded electronic module, comprising the steps of:

(a) producing cardboard and

(b) embedding said electronic module in said cardboard during production of said cardboard in step (a).

27. The method of claim 26, wherein said cardboard being produced has a thickness of said IC card.

28. The method of claim 26, further comprising providing said cardboard with at least one cover layer.

29. The method of claim 26, wherein said cardboard is produced as one of a multiple-copy sheet and a multiple-copy web in which a plurality of said electronic modules are incorporated in a matrix arrangement, and individual data carriers are punched out of said multiple-copy sheet or web in such a way that each of said data carriers contains at least one of said electronic modules.

30. The method of claim 26, wherein electronic modules for noncontacting data exchange are embedded in said cardboard, so as to be surrounded by said cardboard positively and on all sides.