Method of trench isolation during the formation of a semiconductor device

• US 5,888,881 A
• Filed: 12/01/1995
• Issued: 03/30/1999
• Est. Priority Date: 03/02/1994
• Status: Expired due to Term

• Current Assignee: Aptina Imaging Corporation (ON Semiconductor Corporation)
• Original Assignee: Micron Technology, Inc.
• Inventors: Figura, Thomas, Jeng, Nanseng
• Primary Examiner(s): DANG, TRUNG Q
• Application Number:
  US08/566,332
• Time in Patent Office: 1,215 Days
• Field of Search: 438/424, 438/425, 438/426, 438/427, 438/430, 438/431, 438/359, 438/296, 438/221
• US Class Current: 438/425
• CPC Class Codes: H01L 21/76205 in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region
• CPC Class Codes: H01L 21/76227 the dielectric materials being obtained by full chemical transformation of non-dielectric materials, such as polycristalline silicon, metals
• CPC Class Codes: H01L 21/763 Polycrystalline semiconductor regions H01L21/76264 takes precedence
• CPC Class Codes: Y10S 148/05 Etch and refill

Abstract

A process for fabricating a recessed field oxide area comprises providing a substrate having isolation stacks and first and second recesses having openings therein, the first recesses being wider than the second recesses. The recesses can have a depth in the approximate range of 200Å-3000Å. Next, the first and second recesses are lined with nitride, and the substrate is blanketed with a conformal material which bridges the openings of the second recesses but not the openings of the first recesses. The conformal material and the nitride is removed from horizontal surfaces of the isolation stacks, and essentially all of the conformal material is removed from the first recesses. At least a portion of the conformal material is left in the second recesses. Subsequent to the step of removing the conformal material, the substrate and the conformal material is oxidized to create field oxide areas at the first and second recesses.

Claims

1. A method for forming an isolation device comprising the following steps:

providing a semiconductor substrate having a surface;

patterning said substrate to expose wide areas and narrow areas of said substrate surface, said areas having a width less than said wide areas;

forming at least one wide recess and at least one narrow recess in said substrate;

forming a conformal film in said wide recess and in said narrow recess;

isotropically etching essentially all of said conformal film from said wide recess and leaving a portion of said conformal film in said narrow recess; and

forming an insulation from said substrate of said wide recess and from said portion of said conformal film in said narrow recess.

2. The method according to claim 1 wherein said conformal film comprises at least one of polysilicon, amorphous silicon, CVD oxide, and silicon-rich oxide.

3. The method according to claim 1 further comprising the step of depositing an oxidation barrier subjacent said conformal film, said oxidation barrier layer comprising a thin nitride film.

4. The method according to claim 1 further comprising forming a pad oxide layer and a nitride layer prior to forming said conformal film.

5. The method according to claim 4 further comprising the step of removing said pad oxide layer and said nitride layer.

6. The method according to claim 1 wherein all of said conformal film is removed from said wide recess during said step of removing said conformal film.

7. A process for isolating active areas of a semiconductor device, comprising the following steps:

creating first and second recesses in a substrate, said first recess being wider than said second recess;

forming a conformal film in said first and second recesses, said conformal film impinging on itself in said second recess and said conformal film not impinging on itself in said first recess;

removing said conformal film such that a portion of said conformal film remains in said second recess and such that all of said conformal film is removed from said first recess; and

forming an insulator from said conformal film which remains in said second recess after said step of removing said conformal film.

8. The process according to claim 7 wherein said second recess has a width less than 0.5 μ

m.

9. The process according to claim 8 wherein said substrate comprises isolation stacks formed from said substrate.

10. The process according to claim 9 wherein said insulator in said second recess is self-limiting.

11. The process according to claim 10 wherein said conformal film comprises at least one of polysilicon, amorphous silicon, oxide, and silicon-rich oxide.

12. The process according to claim 11, wherein said conformal film is deposited in said recesses and said recesses have a depth of from about 200 Å

to about 3000 Å

.

13. A process for fabricating a recessed field oxide area, comprising the following steps:

providing a substrate having isolation stacks and first and second recesses having openings therein, said first recesses being wider than said second recesses;

lining said first and second recesses with an oxidation-resistant material;

blanketing said substrate with a conformal material, said conformal material bridging said openings of said second recesses;

removing said conformal material and said oxidation-resistant material from horizontal surfaces of said isolation stacks, removing essentially all said conformal material from said first recesses, and leaving at least a portion of said conformal material in said second recesses; and

subsequent to said step of removing said conformal material, oxidizing said substrate and said conformal material, thereby creating field oxide areas at said first and second recesses.

14. The process according to claim 13 wherein said conformal material comprises at least one of doped silicon and undoped silicon.

15. The process according to claim 13 wherein said conformal material comprises polysilicon.

16. The process according to claim 13 wherein said conformal film is removed by isotropic etching.

17. The process according to claim 16 wherein said isolation stack comprises pad oxide and nitride.

18. The process of claim 13, further comprising creating nitride spacers during said removal of said oxidation-resistant material.

19. The process of claim 13 wherein all of said conformal material is removed from said first recesses during said step of removing said conformal material.

20. A method used during the formation of a semiconductor device comprising the following steps:

creating first and second recesses in a substrate, said first recess being wider than said second recess;

forming a conformal film in said first and second recesses, said conformal film impinging on itself in said second recess and said conformal film not impinging on itself in said first recess;

isotropically etching said conformal film such that a portion of said conformal film remains in said second recess and such that essentially all of said conformal film is removed from said first recess; and

forming an insulator from said conformal film which remains in said second recess after said step of removing said conformal film.

21. The method according to claim 20 wherein said second recess has a width less than 0.5 μ

m.

22. The method according to claim 21 wherein said substrate comprises isolation stacks formed from said substrate.

23. The method according to claim 22 wherein said insulator in said second recess is self-limiting.

24. The method according to claim 23 wherein said conformal film comprises at least one of polysilicon, amorphous silicon, oxide, and silicon-rich oxide.

25. The method according to claim 24, wherein said conformal film is deposited in said recesses and said recesses have a depth of from about 200 Å

to about 3000 Å

.

26. The method of claim 20 wherein all of said conformal film is removed from said first recess.