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Electronic device pad relocation, precision placement, and packaging in arrays

  • US 5,888,884 A
  • Filed: 01/02/1998
  • Issued: 03/30/1999
  • Est. Priority Date: 01/02/1998
  • Status: Expired due to Term
First Claim
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1. A method for making an array of closely-spaced devices, said method comprising:

  • providing a semiconductor wafer having front and rear major surfaces, the wafer including a plurality of active device regions separated by scribe lanes, with top interconnection pads on the front major surface;

    forming holes through the wafer within the scribe lanes;

    forming an electrically insulating layer on all exposed surfaces of the wafer, including within the holes, with openings in the insulating layer for access to the top interconnection pads;

    metallizing and patterning the wafer and the holes to form bottom interconnection pads and alignment pads on the rear major surface, the bottom interconnection pads electrically connected to corresponding interconnection pads by metallization extending within the holes;

    employing a dicing saw having a kerf width less than the diameter of the holes to saw within at least some of the scribe lanes to separate the wafer into segments each including at least one device active region;

    providing a substrate having at least two electrical connection pads positioned for mating with the alignment pads;

    forming a rigid alignment structure on the substrate and projecting from the substrate for mechanical engagement with the devices; and

    placing the devices on the substrate and attaching the alignment pads to the electrical connection pads, whereby the rigid alignment structure provides accurate position alignment.

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