Method for taping a wall board joint

• US 5,891,282 A
• Filed: 08/20/1997
• Issued: 04/06/1999
• Est. Priority Date: 08/26/1994
• Status: Expired due to Fees

• Current Assignee: E-Z Taping System Incorporated
• Original Assignee: E-Z Taping System Incorporated
• Inventors: Stough, Ronald A., Kozloski, Gary L., Thompson, Edward A.
• Primary Examiner(s): STEMMER, DANIEL J
• Application Number:
  US08/915,385
• Time in Patent Office: 594 Days
• Field of Search: 156/71, 156/94, 52/417
• US Class Current: 156/71
• CPC Class Codes: B32B 29/02 next to a fibrous or filamentary layer
• CPC Class Codes: C09J 2301/18 characterized by perforations in the adhesive tape
• CPC Class Codes: C09J 2400/263 in the substrate
• CPC Class Codes: C09J 2400/283 in the substrate
• CPC Class Codes: C09J 7/21 Paper; Textile fabrics
• CPC Class Codes: E04F 13/042 Joint tapes

Abstract

The joint between two drywall panels is taped with a paper tape which is backed with a pressure sensitive adhesive. After burnishing the applied tape with a metal or other stiff blade, a water-soaked sponge is moved along the burnished tape to soak the outwardly facing paper surface. The drywall mud is then applied to the wetted paper tape to bridge the joint between the panels without raised or protruding portions of the paper tape, thereby presenting a more continuous and aesthetically satisfying bridge between the panels.

Claims

1. A method for applying pressure-sensitive adhesive paper tape to bridge a joint between two adjacent wall board panels, comprising the steps of:

applying a strip of pressure-sensitive adhesive paper tape over a joint between two adjacent wall board panels such that a paper surface faces outwardly;

moving a member along the applied strip to secure the pressure-sensitive adhesive to the wall board panels;

bringing a water-soaked carrier into contact with the tape and moving the carrier along the outwardly facing paper surface to wet the paper surface; and

applying mud to the wetted paper surface.

2. The method of claim 1 wherein the step of applying mud to the wetted paper surface is performed immediately after the step of bringing the water-soaked carrier into contact with the tape, to thereby apply mud to a wet paper surface.

3. The method of claim 1 wherein the step of applying mud to the wetted paper surface is performed after the wetted paper has dried.

4. A method for applying pressure-sensitive adhesive paper tape to bridge a joint between two adjacent wall board panels, comprising the steps of:

applying a strip of pressure-sensitive adhesive backed paper tape over a joint between two adjacent wall board panels such that a paper surface faces outwardly;

applying pressure to the applied strip of paper tape to secure said strip to the adjacent wall board panels;

soaking a sponge with water and pressing the soaked sponge against the applied strip of paper tape, moving the sponge along the length of the paper tape strip; and

coating the wetted paper surface of the strip of tape with mud.

5. The method of claim 4 wherein the step of coating the wetted paper surface with mud is performed immediately after the step of pressing the soaked sponge against the applied tape, to thereby apply mud to a wet paper surface.

6. The method of claim 4 wherein the step of coating the wetted paper surface with mud is performed after the wetted paper has dried.

7. A method for bridging the joint between two adjacent wall board panels, comprising the steps of:

engaging a pressure-sensitive adhesive on a paper tape with the surfaces of the adjacent wall board panels to connect the tape to the wall board panels to extend over ajoint between the two adjacent panels;

burnishing the connected paper tape to the wall board panels;

coating the burnished paper tape with water; and

applying a layer of mud over the water coated paper tape, to form a bridge over the joint in which the tape has a consistent surface without raised areas.