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High density interconnect substrate

  • US 5,891,795 A
  • Filed: 03/18/1996
  • Issued: 04/06/1999
  • Est. Priority Date: 03/18/1996
  • Status: Expired due to Fees
First Claim
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1. A method of manufacturing a high density interlayer interconnects for circuit carrying substrates, comprising:

  • providing a substrate having a first circuit pattern on a major surface thereof;

    attaching a gold or copper ball on a portion of the first circuit pattern by means of a ball bonder;

    forming a polymer dielectric layer directly on the major surface and directly on the circuit pattern such that an upper portion of the ball is revealed;

    depositing a second circuit pattern directly on the polymer dielectric layer in a manner sufficient to electrically and mechanically connect the second circuit pattern to the revealed upper portion of the ball.

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  • 6 Assignments
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