Apparatus for making laminated integrated circuit devices
First Claim
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1. An apparatus for producing laminated integrated circuit cubes, comprising:
- a hermetically sealable oven chamber;
a mechanical press device capable of applying pressure to the cube when the cube is inside the chamber;
at least two conductive heaters for applying conductive heat to at least two portions of said cube, said heaters including an upper heater and a lower heater, each of said heaters comprising a heating element and a cover, said upper heater having structure for contacting said press device, said structure comprising a substantially semispherical surface; and
,means for creating a vacuum in the chamber.
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Abstract
An apparatus for producing laminated integrated circuit cubes includes a hermetically sealable oven chamber. At least one conductive heating device is used to heat the cube to a cure temperature. A vacuum source is connected to the oven chamber to remove gas from between the integrated circuit layers prior to curing. A press device applies pressure to the cube while it is heated under vacuum. A cooling gas is circulated through the oven chamber after curing. A cooling fluid can also be circulated through cooling channels in at least one wall of the oven chamber to cool the chamber.
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Citations
14 Claims
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1. An apparatus for producing laminated integrated circuit cubes, comprising:
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a hermetically sealable oven chamber; a mechanical press device capable of applying pressure to the cube when the cube is inside the chamber; at least two conductive heaters for applying conductive heat to at least two portions of said cube, said heaters including an upper heater and a lower heater, each of said heaters comprising a heating element and a cover, said upper heater having structure for contacting said press device, said structure comprising a substantially semispherical surface; and
,means for creating a vacuum in the chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification