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Packaging for electronic power devices and applications using the packaging

  • US 5,892,279 A
  • Filed: 12/11/1995
  • Issued: 04/06/1999
  • Est. Priority Date: 12/11/1995
  • Status: Expired due to Term
First Claim
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1. A packaging for an electronic device comprising:

  • at least one electronic device having a heat generating surface;

    a direct bonded copper substrate having a first surface lying on a substrate portion of said direct bonded copper substrate;

    a heat sink in thermal contact with a second surface of said direct bonded copper substrate;

    a first solder connection directly connecting the first surface of said direct bonded copper substrate and the heat generating surface of said electronic device; and

    a second solder connection directly connecting the second surface of said direct bonded copper substrate and a first side of said heat sink,wherein the first surface extends beyond an edge of the substrate portion of said direct bonded copper substrate thereby forming a wing which is generally coplanar with the first surface.

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