Packaging for electronic power devices and applications using the packaging
First Claim
Patent Images
1. A packaging for an electronic device comprising:
- at least one electronic device having a heat generating surface;
a direct bonded copper substrate having a first surface lying on a substrate portion of said direct bonded copper substrate;
a heat sink in thermal contact with a second surface of said direct bonded copper substrate;
a first solder connection directly connecting the first surface of said direct bonded copper substrate and the heat generating surface of said electronic device; and
a second solder connection directly connecting the second surface of said direct bonded copper substrate and a first side of said heat sink,wherein the first surface extends beyond an edge of the substrate portion of said direct bonded copper substrate thereby forming a wing which is generally coplanar with the first surface.
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Accused Products
Abstract
A packaging for high-power devices such as Insulated Gate Bipolar Transistors includes a direct bonded copper substrate (DBC), such as beryllium oxide (BeO), soldered directly to a heat generating surface of the high-power device. The direct bonded copper substrate (DBC) is, in turn, soldered directly to a liquid cooled heatsink (HS). The packaging improves the thermal management of the heat generated by the high-power device, and is applicable for use in a switching circuit for a 3-phase electric traction motor (M). The assembly also provides for improved wirebonding design in order to use each high-power device to its fullest.
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Citations
48 Claims
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1. A packaging for an electronic device comprising:
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at least one electronic device having a heat generating surface; a direct bonded copper substrate having a first surface lying on a substrate portion of said direct bonded copper substrate; a heat sink in thermal contact with a second surface of said direct bonded copper substrate; a first solder connection directly connecting the first surface of said direct bonded copper substrate and the heat generating surface of said electronic device; and a second solder connection directly connecting the second surface of said direct bonded copper substrate and a first side of said heat sink, wherein the first surface extends beyond an edge of the substrate portion of said direct bonded copper substrate thereby forming a wing which is generally coplanar with the first surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A packaging for an electronic device comprising:
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at least one electronic device having a heat generating surface, wherein said at least one electronic device includes at least one first semiconductor power device; a direct bonded copper substrate having a first surface in thermal contact with the heat generating surface; a heat sink in thermal contact with a second surface of said direct bonded copper substrate; at least one second semiconductor power device having a heat generating surface; a second direct bonded copper substrate having a first surface soldered to the heat generating surface of said at least one second semiconductor power device; and a second heat sink soldered to a second surface of said second direct bonded copper substrate, wherein said at least one first semiconductor power device, said direct bonded copper substrate, and said heat sink form a first unit; and
said at least one second semiconductor power device, said second direct bonded copper substrate, and said second heat sink form a second unit, andfurther wherein each of said first and second units includes respective first and second common conduction pads, the first common conduction pad of the first unit being connected to the second common conduction pad of the second unit by a load connector. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. A packaging for an electronic device comprising:
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at least one electronic device having a heat generating surface; a direct bonded copper substrate having a first surface in thermal contact with the heat generating surface, wherein said at least one electronic device includes at least one semiconductor power device having a respective first connection point, the packaging further including; a second surface on said direct bonded copper substrate, said second surface including a copper layer forming a ring; a wirebond electrically connecting said second surface to the respective first connection point; and an electrically insulated lid secured directly to said second surface of said direct bonded copper substrate, the insulated lid forming a hermetic seal for the at least one semiconductor power device. - View Dependent Claims (37)
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38. A packaging for an electronic device comprising:
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at least one electronic device having a heat generating surface and a first connection point; a direct bonded copper substrate having a first surface in thermal contact with the heat generating surface; a second surface on said direct bonded copper substrate, said second surface including a copper layer forming a ring; a wirebond connection electrically connecting said second surface to the first connection point; and an insulated lid secured directly to said second surface of said direct bonded copper substrate, the insulated lid forming a hermetic seal for the at least one electronic device, wherein said insulated lid has a first length, and further wherein said first surface and said second surface of said direct bonded copper substrate extend to form a second length parallel to the first length, the second length being greater than the first length. - View Dependent Claims (39, 40, 41, 42)
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43. A packaging for an electronic device comprising:
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at least one electronic device having a heat generating surface; a direct bonded copper substrate having a first surface in thermal contact with the heat generating surface; a heat sink in thermal contact with a second surface of said direct bonded copper substrate; a first solder connection directly connecting the first surface of said direct bonded copper substrate and the heat generating surface of said electronic device; a second solder connection directly connecting the second surface of said direct bonded copper substrate and a first side of said heat sink; and a cover for covering the at least one electronic device, the cover including a cavity alone a first surface thereof, the cavity formed to accept the at least one electronic device, wherein the first surface is on a first side of said cover, and said cover includes a second cavity on a second side thereof, the second surface being parallel to the first surface of the cover, the second cavity being formed to accept the at least one electronic device of another packaging for another electronic device, such that said cover is sandwiched between said packagings.
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44. A wirebonded package for electronic devices comprising:
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at least first and second electronic devices arranged on a thermally conductive layer, each device having a respective connection point; a first common conduction pad disposed to one side of said connection points such that a shortest distance between an edge of said conduction pad to the connection point of said first electronic device differs from a shortest distance from the edge to the connection point of said second electronic device; and first and second wirebonds of equal length, each wirebond being attached to a respective connection point and to said first common conduction pad such that said first and second electronic devices are connected in parallel to said first common conduction pad. - View Dependent Claims (45, 46, 47, 48)
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Specification