Light-emitting apparatus and method of producing the same

• US 5,893,633 A
• Filed: 12/06/1996
• Issued: 04/13/1999
• Est. Priority Date: 12/13/1995
• Status: Expired due to Fees

• Current Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Original Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Inventors: Saito, Junichi, Yamagata, Kazuyoshi, Uchio, Masatoshi
• Primary Examiner(s): CARIASO, ALAN B
• Application Number:
  US08/759,651
• Time in Patent Office: 858 Days
• Field of Search: 313/500, 313/501, 313/510, 313/512, 362/226, 362/227, 362/249, 362/800, 362/267, 362/240, 362/244
• US Class Current: 362/244
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A light emitting device including a base with five planar surface sections formed at five different angles, with a plurality of receiving holes, which are spaced apart, passing through the planar surface sections; light-emitting diode chips mounted at about the center of their respective planar surface sections with a conductive paste such that they emit light in a direction perpendicular to the plane of their respective planar surface sections; terminals inserted into their respective receiving holes, with one end of each terminal being electrically connected to the corresponding LED chip; and a mold case which covers each LED chip.

Claims

1. A light-emitting apparatus, comprising:

a common base including a plurality of planar surface sections, at least two of the planar surface sections being oriented in different directional optical axes and a first group of terminals having light-emitting device chips positioned and fixed under the planar surface sections;

a second group of terminals respectively connected to each of said light-emitting device chips; and

a mold case having said common base and a part of the second group of terminals buried with resin to enclose an entire said light-emitting device chips.

3. A light-emitting apparatus according to claim 1, wherein said light-emitting device chips formed integrally with said base are disposed in a row.

5. A light-emitting device according to claim 1, wherein said light-emitting device chips formed integrally with said base are arranged in one row.

7. A light-emitting apparatus according to claim 1, wherein said planar surface sections of said common base are inclined in such a way that the optical axes may be directed toward at least four directions of upward, downward, leftward and rightward directions and an inclination angle of each of the optical axes is set to about a half-value angle to each other through the inclinations.

8. A light-emitting apparatus according to claim 1, wherein a front surface of said mold case has mold lenses having a central axis extending along an optical axis of each of said light-emitting device chips and said mold case and said mold lenses are filled with resin.

9. A light-emitting apparatus according to claim 1, wherein said common base is formed of conductive material to act as a part of said first group of terminals, and said second group of terminals and said common base are insulated by mold resin.

2. A method of producing a light-emitting apparatus, comprising:

a die bond step in which at least three of first groups of terminals are arranged at a common base and each of light-emitting device chips is fixed by conductive paste to end sections of said first groups of terminals;

a wire bond step in which each of said light-emitting device chips and the second terminal are connected via a connecting wire to a second terminal; and

a molding step in which said base is positioned within a cavity of a mold in such a way that the other ends of said first groups of terminals may be projected out of the mold and the other ends of said second groups of terminals may be projected out of the mold, resin is filled in said cavity to make an integral mold forming of said base and said second groups of terminals.

4. A method of producing a light-emitting apparatus according to claim 2, wherein said light-emitting device chips formed by molding are arranged in a row.

6. A method of producing a light-emitting apparatus according to claim 2, wherein said light-emitting device chips formed by molding are arranged in one row.