Optical viewing system for simultaneously viewing indicia located on top and bottom surfaces of a substrate

• US 5,894,530 A
• Filed: 09/05/1996
• Issued: 04/13/1999
• Est. Priority Date: 09/05/1996
• Status: Expired due to Term

• Current Assignee: Electro Scientific Industries Incorporated (MKS Instruments Incorporated)
• Original Assignee: Electro Scientific Industries Incorporated (MKS Instruments Incorporated)
• Inventors: Wilt, Donald R.
• Primary Examiner(s): Couso, Jose L.
• Application Number:
  US08/707,631
• Time in Patent Office: 950 Days
• Field of Search: 382/312, 382/313, 382/314, 382/315, 382/316, 382/317, 382/318, 382/319, 382/320, 382/321, 382/322, 382/323, 382/324, 382/100, 382/101, 382/112, 382/141, 382/143, 382/144 , 382/145, 382/147, 382/149, 382/151, 252/272, 356/237, 358/93
• US Class Current: 382/321
• CPC Class Codes: G06K 7/10594 Beam path
• CPC Class Codes: G06K 7/10722 Photodetector array or CCD scanning

Abstract

An optical system is disclosed that permits the viewing and reading of indicia, such as OCR scribes and/or barcodes, disposed on either side of a substrate, such as a semiconductor wafer, with a single camera. In one embodiment of the invention, optical elements are selectively positioned such that images of indicia fields disposed on either side of a substrate can be viewed (at the same magnification) whenever the substrate is in a given orientation, or such that images of indicia fields disposed on both sides of the substrate may be viewed at the same magnification, simultaneously. Optical paths may be folded to reduce the overall size of the optical viewing system.

Claims

1. An apparatus capable of simultaneously viewing indicia located on opposing sides of a semiconductor substrate that lies on a substrate plane that separates first and second regions such that a first indicia is located at a first indicia reading location on a first side of said semiconductor substrate in said first region and a second indicia is located at a second indicia reading location on a second side of said semiconductor substrate in said second region, comprising:

an image sensor having first and second different field of view sensor portions and being positioned at a sensor location in said first region;

a first optical path between said image sensor and said first indicia reading location on said first side of said semiconductor substrate, said first field of view sensor portion of said image sensor operative to receive a first image of first indicia at said first indicia reading location via said first optical path;

an optical light directing element positioned in said second region; and

a second optical path traversing said substrate plane and having at least first and second path components, said first path component being between said image sensor and said optical light directing element, said second path component being between said optical light directing element and said second indicia reading location on said second side of said semiconductor substrate, and said second field of view sensor portion of said image sensor operative to receive a second image of second indicia at said second indicia reading location via said second optical path at the same time that said image sensor is operative to receive said first image.

2. The apparatus of claim 1 wherein at least one of said first and said second optical paths includes at least two optical light directing elements.

3. The apparatus of claim 2 wherein at least one of said optical light directing elements includes a prism.

4. The apparatus of claim 1 wherein said first optical path includes at least one optical light directing element.

5. The apparatus of claim 4 wherein said first and second optical paths have substantially the same length.

6. The apparatus of claim 1 wherein said image sensor comprises a camera.

7. The apparatus of claim 6 wherein said camera comprises a video camera.

8. The apparatus of claim 1 wherein at least one path folding mirror is disposed in both said first and second optical paths.

9. The apparatus of claim 8 wherein at least two path folding mirrors are disposed in said first and second optical paths.

19. The apparatus of claim 1 in which said semiconductor substrate comprises a wafer.

20. The apparatus of claim 1 in which said first or second indicia comprise an OCR scribe or a bar code.

22. The apparatus of claim 1 in which said image sensor consists essentially of a single camera.

24. The apparatus of claim 1 in which said first path component traverses said substrate plane.

10. A method for viewing indicia located on opposing sides of a semiconductor substrate that lies on a substrate plane that separates first and second regions such that a first indicia is located at a first indicia reading location on a first side of said semiconductor substrate in said first region and a second indicia is located at a second indicia reading location on a second side of said semiconductor substrate in said second region, the method comprising the steps of:

receiving on a first field of view sensor portion of an image sensor a first image of said first indicia at said first indicia reading location on said first side of said semiconductor substrate, said image sensor being positioned in said first region, said first image propagating along a first optical path between said first indicia reading location and said first field of view sensor portion of said image sensor;

receiving on a second field of view sensor portion of said image sensor a second image of said second indicia at said second indicia reading location on said second side of said semiconductor substrate substantially simultaneously with receiving said first image, said second image propagating along a second optical path that traverses said substrate plane and has first and second path components such that said first path component connects said second indicia reading location and an optical light directing element positioned in said second region and such that said second optical path connects said optical light directing element and said second field of view sensor portion of said image sensor.

11. The method of claim 10 further including the step of folding at least one of said first and second optical paths.

12. The method of claim 11 wherein said first and second optical paths have respective first and second optical lengths and said step of folding at least one of said first and second optical paths comprises the step of folding at least one of said optical paths such that said first optical length is equal to said second optical length.

13. The method of claim 12 wherein said step of folding at least one of said first and second optical paths comprises the step of folding at least one of said first and second optical paths with at least two mirrors.

14. The method of claim 10 further including the step of folding at least one of said first and second optical paths with at least one prism such that the optical length of said first optical path is equal to the optical length of said second optical path.

15. The method of claim 10 further including the step of folding both of said first and second optical paths with at least one path folding mirror.

16. The method of claim 14 wherein said step of folding both of said first and second optical paths comprises the step of folding said first and second optical paths with at least two path folding mirrors.

17. The method of claim 10 in which said semiconductor substrate comprises a wafer.

18. The method of claim 10 in which said first or second indicia comprise an OCR scribe or a bar code.

21. The method of claim 10 in which said image sensor comprises a camera.

23. The method of claim 10 in which said image sensor consists essentially of a single camera.

25. The method of claim 10 in which said first path component traverses said substrate plane.