Method for fabricating piezoelectric resonators and product

• US 5,894,647 A
• Filed: 06/30/1997
• Issued: 04/20/1999
• Est. Priority Date: 06/30/1997
• Status: Expired due to Term

• Current Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Original Assignee: Qorvo Oregon, Inc. (Qorvo, Inc.)
• Inventors: Lakin, Kenneth Meade
• Primary Examiner(s): Eley, Timothy V.
• Assistant Examiner(s): Halpern, Benjamin M.
• Application Number:
  US08/885,270
• Time in Patent Office: 659 Days
• Field of Search: 29/25.35, 310/9.5
• US Class Current: 29/25.35
• CPC Class Codes: H03H 2003/0428 of an electrode
• CPC Class Codes: H03H 2003/0471 of a plurality of resonators at different frequencies
• CPC Class Codes: H03H 3/04 for obtaining desired frequency or temperature coefficient
• CPC Class Codes: H03H 9/02125 of parasitic elements
• CPC Class Codes: H03H 9/56 Monolithic crystal filters
• CPC Class Codes: H04R 17/00 Piezoelectric transducers; Electrostrictive transducers piezoelectric or electrostrictive elements in general H10N30/00; details of piezoelectric or electrostrictive motors, generators or positioners H10N30/00
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

A method for fabricating piezoelectric resonators on a substrate such that the resonant frequency of one resonator is shifted by a small amount from another of the resonators. By means of differential fabrication of the electrodes, the thickness of the metal in an electrode for one resonator is increased relative to that of another resonator to obtain the shift in resonant frequency. The frequency of a single resonator also may be adjusted to a specific frequency by the addition of a differential layer of metal to one of the electrodes comprising the resonator. Mask alignment errors in the differential fabrication process cause non-uniformities in the thickness of the metal in the electrode which non-uniformities significantly degrade the performance of the resonator. The areas of non-uniform thickness of electrode that degrade the performance are removed in this process.

Claims

1. A method for fabricating a piezoelectric resonator having a specified resonant frequency, the method comprising:

fabricating a substrate having a top and bottom surface and having a top electrode on the top surface of the substrate and having a bottom electrode on the bottom surface of the substrate, the substrate including a layer of piezoelectric material, the top electrode comprising a primary layer of conducting material,

a portion of the top electrode overlapping with a portion of the bottom electrode and said overlapping portions defining the resonator,

adding a differential layer of conducting material on top of the top electrode, said differential layer of conducting material shifting the resonant frequency of the resonator to approximately the specified resonant frequency,

removing from the top electrode portions of the top electrode that include, but are not necessarily limited to, those portions of the top electrode that overlap with a portion of the bottom electrode and that are not composed of a portion of both the primary layer of conducting material and the differential layer of conducting material.

9. The method of claim 1 in which the specified resonant frequency to which the resonant frequency of the resonator is shifted is specified as a specified shift in resonant frequency of the resonator relative to the resonant frequency of a second resonator fabricated as part of the same process set forth in claim 1.

2. A method for fabricating first and second piezoelectric resonators, the resonant frequency of the first resonator being shifted in frequency relative to the resonant frequency of the second resonator, the method comprising:

fabricating a substrate having a top and bottom surface and having first and second top electrodes on the top surface of the substrate and having first and second bottom electrodes on the bottom surface of the substrate, the substrate including a layer of piezoelectric material, the first and second top electrodes comprising a primary layer of conducting material, and the first and second bottom electrodes comprising a primary layer of conducting material and the first top electrode additionally comprising a differential layer of conducting material,

a portion of the first top electrode overlapping with a portion of the first bottom electrode and said overlapping portions defining the first resonator,

a portion of the second top electrode overlapping with a portion of the second bottom electrode and said overlapping portions defining the second resonator,

said differential layer of conducting material of said first top electrode shifting the resonant frequency of the first resonator relative to the resonant frequency of the second resonator,

removing from the first top electrode those portions of the first electrode that overlap with the first bottom electrode and that are not composed of a portion of both the layer of conducting material and the differential layer of conducting material.

3. The method of claim 2 wherein the step of fabricating a substrate having a top and bottom surface and having first and second top electrodes on the top surface of the substrate and having first and second bottom electrodes on the bottom surface of the substrate includes the steps of:

fabricating a primary layer of conducting material on the top surface of the substrate to form first and second top electrodes on the top surface of the substrate, and

fabricating a differential layer of conducting material upon the first top electrode so as to shift the resonant frequency of the first resonator relative to the resonant frequency of the second resonator.

4. The method of claim 2 wherein the step of fabricating a substrate having a top and bottom surface and having first and second top electrodes on the top surface of the substrate and having first and second bottom electrodes on the bottom surface of the substrate includes the steps of:

fabricating a differential layer of conducting material on the top surface of the substrate, and

fabricating a primary layer of conducting material on the top surface of the substrate to form first and second top electrodes on the top surface of the substrate, said differential layer of conducting material on the top surface of the substrate underlying the primary layer of conducting material of the first top electrode.

5. A piezoelectric resonator having specified resonant frequency fabricated by:

fabricating a substrate having a top and bottom surface and having a top electrode on the top surface of the substrate and having a bottom electrode on the bottom surface of the substrate, the substrate including a layer of piezoelectric material, the top electrode comprising a primary layer of conducting material,

a portion of the top electrode overlapping with a portion of the bottom electrode and said overlapping portions defining the resonator,

adding a differential layer of conducting material on top of the top electrode, said differential layer of conducting material shifting the resonant frequency of the resonator to approximately the specified resonant frequency,

removing from the top electrode those portions of the top electrode that overlap with a portion of the bottom electrode and that are not composed of a portion of both the primary layer of conducting material and the differential layer of conducting material whereby the remaining portion of the top electrode that overlaps with a portion of the bottom electrode has a substantially uniform thickness.

10. The piezoelectric resonator of claim 5 in which the specified resonant frequency of the resonator is specified as a specified shift in resonant frequency of the resonator relative to the resonant frequency of a second resonator fabricated as part of the same process set forth in claim 5.

6. A device comprising first and second piezoelectric resonators, the resonant frequency of the first resonator being shifted in frequency relative to the resonant frequency of the second resonator, fabricated by:

fabricating a substrate having a top and bottom surface and having first and second top electrodes on the top surface of the substrate and having first and second bottom electrodes on the bottom surface of the substrate, the substrate including a layer of piezoelectric material, the first and second electrodes comprising a primary layer of conducting material, and the first and second bottom electrodes comprising a primary layer of conducting material and the first top electrode additionally comprising a differential layer of conducting material,

a portion of the first top electrode overlapping with a portion of the first bottom electrode and said overlapping portions defining the first resonator,

a portion of the second top electrode overlapping with a portion of the second bottom electrode and said overlapping portions defining the second resonator,

said differential layer of conducting material of said first top electrode shifting the resonant frequency of the first resonator relative to the resonant frequency of the second resonator,

removing from the first top electrode those portions of the first electrode that overlap with the first bottom electrode and that are not composed of a portion of both the layer of conducting material and the differential layer of conducting material whereby the remaining portion of the first top electrode that overlaps with the first bottom electrode has a substantially uniform thickness.

7. The device of claim 6 wherein the step of fabricating first and second top electrodes on the top surface of the substrate includes the steps of:

fabricating a primary layer of conducting material on the top surface of the substrate to form first and second top electrodes on the top surface of the substrate, and

fabricating a differential layer of conducting material upon the first top electrode so as to shift the resonant frequency of the first resonator relative to the resonant frequency of the second resonator.

8. The device of claim 6 wherein the step of fabricating first and second top electrodes on the top surface of the substrate includes the steps of:

fabricating a differential layer of conducting material on the top surface of the substrate, and

fabricating a primary layer of conducting material on the top surface of the substrate to form first and second top electrodes on the top surface of the substrate, said differential layer of conducting material on the top surface of the substrate underlying the primary layer of conducting material of the first top electrode.