Encapsulation of organic light emitting devices using Siloxane or Siloxane derivatives

• US 5,895,228 A
• Filed: 03/20/1997
• Issued: 04/20/1999
• Est. Priority Date: 11/14/1996
• Status: Expired due to Term

• Current Assignee: InnoLux Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Biebuyck, Hans, Haskal, Eliav
• Primary Examiner(s): Picardat, Kevin M.
• Assistant Examiner(s): COLLINS, DEVEN M
• Application Number:
  US08/821,218
• Time in Patent Office: 761 Days
• Field of Search: 438/15, 438/26, 438/29, 438/99, 438/127, 438/763
• US Class Current: 438/99
• CPC Class Codes: H10K 50/841 Self-supporting sealing arrangements
• CPC Class Codes: H10K 50/8423 Metallic sealing arrangements
• CPC Class Codes: H10K 50/844 Encapsulations

Abstract

An organic light emitting device (10) is provided which is encapsulated by a Siloxane buffer layer (17.1). This Siloxane buffer layer (17.1) is applied to the diode (10) providing for protection against contamination, degradation, oxidation and the like. The Siloxane buffer layer (17.1) carries at least a second encapsulation layer (17.2).

Claims

1. Method for encapsulating an organic light emitting device by a transparent or semi-transparent stack of encapsulation layers, comprising the steps of:

applying a buffer layer which comprises Siloxane to said organic light emitting device such that said buffer layer is in conformal contact with said organic light emitting device, and

attaching a second layer to said buffer layer such that

it adheres to said buffer layer and

is separated from said organic light emitting device by said buffer layer.

2. The method of claim 1, whereby, said buffer layer is applied to said organic light emitting device carrying out the steps:

covering organic light emitting device with curable Siloxane, and

then curing it on said organic light emitting device, preferably curing it such that it remains tacky.

3. The method of claim 1, whereby said buffer layer is applied to said organic light emitting device in form of a flexible Siloxane film which was fabricated separately.

4. The method of claim 2, whereby said buffer layer is patterned when applying it such that at least one contact electrode of said organic light emitting device remains accessible.

5. The method of claim 3, whereby said buffer layer is structured after having been applied to said organic light emitting device such that at least one contact electrode of said organic light emitting device remains accessible.

6. The method of claim 1, whereby said stack of encapsulation layers is pressed onto said organic light emitting device.

7. The method of claim 1, whereby one of the layers of said stack of encapsulation layers is structured after having been applied to said organic light emitting device.