Microelectronic package including a polymer encapsulated die, and method for forming same

• US 5,895,229 A
• Filed: 05/19/1997
• Issued: 04/20/1999
• Est. Priority Date: 05/19/1997
• Status: Expired due to Term

• Current Assignee: North Star Innovations Inc. (Wi-LAN Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Melton, Cynthia M., Knapp, James Howard, Nelson, Keith E., Carney, Francis J., Carson, George Amos, Celaya, Phillip C., Fuerhaupter, Harry, Jones, Frank Tim, Klosterman, Donald H.
• Primary Examiner(s): Nguyen, Tuan H.
• Assistant Examiner(s): Thompson, Craig
• Application Number:
  US08/858,756
• Time in Patent Office: 701 Days
• Field of Search: 438/106, 438/107, 438/114, 438/127, 257/780, 257/782, 257/783
• US Class Current: 438/106
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/315 the encapsulation having a cavity
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA

Abstract

A microelectronic package (10) is formed and includes an integrated circuit die (12) attached to a substrate (14) by a plurality of solder bump interconnections (16) to form a preassembly (18). The integrated circuit die (12) has an active face (20) that faces the substrate (14) and is spaced apart therefrom by a gap (22). The integrated circuit die (12) also includes a back face (24) opposite the active face (20). The substrate (14) includes a die attach region (26) and a surrounding region (28) about the integrated circuit die (12). The solder bump interconnections (16) extend across the gap (22) and connect the integrated circuit die (12) and the substrate (14). A mold (30) is disposed about the preassembly (18) such that the mold (30) cooperates with the substrate (14) to define a mold cavity (32) that encloses the integrated circuit die (12). The mold (30) has a molding surface (34) that includes the surrounding region (28) and a mold surface (34) that faces the back face (24) and is spaced apart therefrom. A polymeric precursor (36) is dispensed into the mold cavity (32) and is formed against the molding surface (34) and the back face (24). The polymeric precursor (36) is then cured to form a polymeric encapsulant (38) that encapsulates the integrated circuit die (12).

Claims

1. A method for forming a microelectronic package comprising:

attaching an integrated circuit die to a substrate by a plurality of solder bump interconnections to form a preassembly, said integrated circuit die having an active face facing the substrate and spaced apart therefrom by a gap and a back face opposite the active face, said substrate including a die attach region and a surrounding region about the integrated circuit die, said plurality of solder bump interconnections extending across the gap and connecting the integrated circuit die and the substrate;

disposing a mold onto the preassembly such that the mold cooperates with the substrate to define a mold cavity that encloses the integrated circuit die, said mold having a molding surface that includes said surrounding region and an inner face facing the back face and spaced apart therefrom;

dispensing a polymeric precursor into the mold cavity, whereupon said polymeric precursor is formed against the molding surface and the back face; and

curing the polymeric precursor to form a polymeric encapsulant that encapsulates the integrated circuit die.

2. A method for forming a microelectronic package in accordance with claim 1, wherein the polymeric precursor flows into the gap.

3. A method for forming a microelectronic package in accordance with claim 2, wherein the polymeric precursor partially fills the gap.

4. A method for forming a microelectronic package in accordance with claim 2, wherein the polymeric precursor substantially fills the gap and encapsulates the plurality of solder bump interconnections.

5. A method for forming a microelectronic package in accordance with claim 1, wherein the plurality of solder bump interconnections are disposed about the perimeter of the integrated circuit die, and wherein the polymeric precursor encapsulates the plurality of solder bump interconnections.

6. A method for forming a microelectronic package comprising:

attaching at least two integrated circuit die to a substrate by a plurality of solder bump interconnections to form a preassembly, each said integrated circuit die having an active face and a back face opposite the active face, said active face facing the substrate and spaced apart therefrom by a gap, said substrate including a substrate region surrounding the integrated circuit die, said plurality of solder bump interconnections extending across the gap and connecting the plurality of integrated circuit die and the substrate;

disposing a mold onto the preassembly such that the mold cooperates with the substrate to define a mold cavity that encloses the plurality of integrated circuit die, said mold having a molding surface that includes said substrate region and a mold surface facing the back face and spaced apart therefrom;

injecting a polymeric precursor into the mold cavity, whereupon said polymeric precursor is shaped against the molding surface, the back face, and the surrounding region;

curing the polymeric precursor to form a polymeric encapsulant panel that encapsulates each of the integrated circuit die;

removing the mold from the preassembly; and

separating each of the plurality of integrated circuit die by cutting the polymeric encapsulant panel and the substrate to form a microelectronic package.

7. A method for forming a microelectronic package in accordance with claim 6, further comprising the step of forming a plurality of solder bumps onto the substrate, said solder bumps being formed on an exposed side of the substrate opposite the integrated circuit die.

8. A method for forming a microelectronic package in accordance with claim 6, wherein the polymeric precursor flows into the gap.

9. A method for forming a microelectronic package in accordance with claim 8, wherein the polymeric precursor partially fills the gap.

10. A method for forming a microelectronic package in accordance with claim 8, wherein the polymeric precursor substantially fills the gap and encapsulates the plurality of solder bump interconnections.

11. A method for forming a microelectronic package in accordance with claim 6, wherein the plurality of solder bump interconnections are disposed about the perimeter of the integrated circuit die, and wherein the polymeric precursor encapsulates the plurality of solder bump interconnections.