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Dust removing apparatus and dust removing method

  • US 5,895,521 A
  • Filed: 06/23/1997
  • Issued: 04/20/1999
  • Est. Priority Date: 06/21/1996
  • Status: Expired due to Fees
First Claim
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1. A dust removing method for removing fine powder contained in an exhaust gas discharged from a semiconductor production step using a single wafer processing atmospheric pressure CVD apparatus, which comprises continuously carrying out a filtration using filters each equipped with a filter element wherein a ratio (S2 /S1) of a surface area (S2) at a primary side of a filter membrane to an apparent external surface area (S1) of said filter element is from 1 to 5, and said filters are also each equipped with a pulse jet mechanism for a gas for back washing disposed in an air chamber at a secondary side of said filter element, without carrying out back washing until processing of a wafer fed in the CVD apparatus is completed, and carrying out back washing after completion of the processing of the wafer, wherein a jetting amount of the gas for said back washing is such that a value of a volume of gas per one pulse divided by a jetting time and an area of the filter membrane at a portion to be jetted is from 0.03 to 0.3 m3 /m2 ·

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