Method for applying materials to substrates

• US 5,895,678 A
• Filed: 01/30/1997
• Issued: 04/20/1999
• Est. Priority Date: 01/31/1996
• Status: Expired due to Fees

• Current Assignee: Ishida Company Limited
• Original Assignee: Ishida Company Limited
• Inventors: Sunter, Adrian M.
• Primary Examiner(s): Smith, Lynette F.
• Assistant Examiner(s): SALIMI, ALI REZA
• Application Number:
  US08/791,315
• Time in Patent Office: 810 Days
• Field of Search: 426/289, 426/292, 99/450.1, 99/450.3, 99/484, 77/119, 77/120, 77/122, 77/123
• US Class Current: 426/289
• CPC Class Codes: A21C 9/04 Apparatus for spreading granular material on, or sweeping or coating the surfaces of, pieces or sheets of dough coating baked articles A21C15/002

Abstract

A method and apparatus for applying a material to a substrate. A material application station includes a shutter assembly having at least one horizontally extending blade which is rapidly displaceable from a closed configuration in which an outlet path of the shutter assembly is obstructed to an open configuration in which the outlet path is open. While the blade of the shutter assembly is in the closed configuration, a coating material is applied to a first predetermined area on an upper surface of the shutter assembly. A substrate is located beneath the shutter assembly in the outlet path. The blade of the shutter assembly is rapidly opened so that the coating material falls onto the substrate over a second predetermined area on an upper surface of the substrate. The second predetermined area is substantially equal to the first predetermined area. The resulting deposit is of a controlled diameter. A rapid opening of the iris blade allows the deposit to fall a short distance onto a substrate such as a pizza base.

Claims

1. A method for applying a coating material using a shutter assembly, comprising the steps of:

disposing the shutter assembly in a closed configuration;

applying the coating material to a predetermined area of the shutter assembly;

locating a substrate in an outlet path of the shutter assembly; and

rapidly opening the shutter assembly to transfer the coating material over a predetermined area of the substrate substantially equal to said predetermined area of the shutter assembly.

2. The method according to claim 1, wherein said step of opening the shutter assembly is effected so that the coating material is substantially undisturbed.

3. The method according to claim 1, wherein the coating material is applied to the shutter assembly over an area bearing a predetermined relationship to an area of the substrate.

4. The method according to claim 1, wherein said step of applying said coating material to the shutter assembly includes the step of dropping a controlled amount of the coating material from a predetermined height.

5. The method according to claim 1, further comprising the step of controlling the application of the coating material to said predetermined area of the shutter assembly.

6. The method according to claim 1, wherein said step of applying said coating material to the shutter assembly includes the step of dropping said coating material from a second upper shutter assembly at a controlled height onto the shutter assembly.

7. The method according to claim 6, wherein said second upper shutter assembly has a smaller outlet path than said outlet path of said shutter assembly.

8. The method according to claim 1, further comprising the steps of automatically conveying a plurality of substrates through the outlet path and automatically detecting an arrival of each of the plurality of substrates at said outlet path.

9. The method according to claim 1, wherein the substrate includes a pizza base.

10. A method for applying a material to a substrate, comprising the steps of:

opening a first shutter assembly to transfer the material a predetermined distance to a second shutter assembly located under said first shutter assembly; and

rapidly opening said second shutter assembly to release said material onto a predetermined area of the substrate.

11. The method according to claim 10, said releasing step further comprising the steps of:

closing said second shutter assembly; and

applying said material to a first predetermined area on an upper surface of said second shutter assembly, wherein

said first predetermined area is approximately equal to the predetermined area of the substrate.

12. The method according to claim 11, further comprising the steps of:

automatically conveying a plurality of substrates under said second shutter assembly; and

automatically detecting an arrival of each of said plurality of substrates under said second shutter assembly.

13. The method according to claim 12, further comprising the step of:

controlling a timing of an opening and closing of said first shutter assembly and a timing of an opening and closing of said second shutter assembly based on said detecting step.

14. A method for applying a material to a substrate, comprising the steps of:

detecting the substrate;

opening a lower shutter assembly to release the material onto a predetermined area of the detected substrate;

closing the lower shutter assembly;

opening an upper shutter assembly to transfer material to a predetermined area of the lower shutter assembly approximately equal to the predetermined area of the substrate.