Method for applying materials to substrates
First Claim
1. A method for applying a coating material using a shutter assembly, comprising the steps of:
- disposing the shutter assembly in a closed configuration;
applying the coating material to a predetermined area of the shutter assembly;
locating a substrate in an outlet path of the shutter assembly; and
rapidly opening the shutter assembly to transfer the coating material over a predetermined area of the substrate substantially equal to said predetermined area of the shutter assembly.
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Accused Products
Abstract
A method and apparatus for applying a material to a substrate. A material application station includes a shutter assembly having at least one horizontally extending blade which is rapidly displaceable from a closed configuration in which an outlet path of the shutter assembly is obstructed to an open configuration in which the outlet path is open. While the blade of the shutter assembly is in the closed configuration, a coating material is applied to a first predetermined area on an upper surface of the shutter assembly. A substrate is located beneath the shutter assembly in the outlet path. The blade of the shutter assembly is rapidly opened so that the coating material falls onto the substrate over a second predetermined area on an upper surface of the substrate. The second predetermined area is substantially equal to the first predetermined area. The resulting deposit is of a controlled diameter. A rapid opening of the iris blade allows the deposit to fall a short distance onto a substrate such as a pizza base.
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Citations
14 Claims
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1. A method for applying a coating material using a shutter assembly, comprising the steps of:
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disposing the shutter assembly in a closed configuration;
applying the coating material to a predetermined area of the shutter assembly;locating a substrate in an outlet path of the shutter assembly; and rapidly opening the shutter assembly to transfer the coating material over a predetermined area of the substrate substantially equal to said predetermined area of the shutter assembly. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for applying a material to a substrate, comprising the steps of:
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opening a first shutter assembly to transfer the material a predetermined distance to a second shutter assembly located under said first shutter assembly; and rapidly opening said second shutter assembly to release said material onto a predetermined area of the substrate. - View Dependent Claims (11, 12, 13)
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14. A method for applying a material to a substrate, comprising the steps of:
- detecting the substrate;
opening a lower shutter assembly to release the material onto a predetermined area of the detected substrate; closing the lower shutter assembly; opening an upper shutter assembly to transfer material to a predetermined area of the lower shutter assembly approximately equal to the predetermined area of the substrate.
- detecting the substrate;
Specification