Chip-on-chip IC packages

• US 5,898,223 A
• Filed: 10/08/1997
• Issued: 04/27/1999
• Est. Priority Date: 10/08/1997
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: O'Connor, Kevin John, Frye, Robert Charles, Low, Yee Leng
• Primary Examiner(s): Saadat, Mahshid
• Assistant Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US08/946,980
• Time in Patent Office: 566 Days
• Field of Search: 257/777, 257/685, 257/686, 257/778, 257/772, 257/737, 257/738, 257/779, 257/780, 438/108-110, 228/180.22
• US Class Current: 257/777
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 23/5221 Crossover interconnections
• CPC Class Codes: H01L 23/5381 Crossover interconnections, e.g. bridge stepovers
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Abstract

The specification describes interconnection layouts for chip-on-chip packages using solder bump interchip connections as vias between a single level metal interconnection pattern on the lower support IC chip and another single level interconnection pattern on the upper IC chip. This arrangement allows for the formation of air isolated crossovers of features on either chip.

Claims

1. Integrated circuit package comprising:

a. a first integrated circuit chip containing a plurality of active semiconductor devices, said first integrated circuit chip having a length L₁, a width W₁, an upper planar surface with area A₁ equal to L₁ ×

W₁, and a lower planar surface with area A₁,

b. a first interconnection circuit on said upper planar surface of said first integrated circuit chip,

c. a second integrated chip supported by said first chip, said second integrated circuit chip containing a plurality of active semiconductor devices and having a length L₂, a width W₂, an upper planar surface with area A₂ equal to L₂ ×

W₂, and a lower planar surface with area A₂, and where A₂ <

A₁,

d. a plurality of bonding means for bonding said lower planar surface of said second integrated circuit chip to said upper planar surface of said first integrated circuit chip, leaving a space between said lower planar surface of said second integrated circuit chip and said upper planar surface of said first integrated circuit chip, and

e. a second interconnection circuit on the lower planar surface of said second integrated circuit chip, and

f. a plurality of runners in each of said first and second interconnection circuits and in which at least some of the runners in said first interconnection circuit electrically connect two of said plurality of bonding means and at least some of the runners in said second interconnection circuit electrically connect two of said plurality of bonding means.

2. The integrated circuit package of claim 1 wherein said plurality of bonding means comprises solder bumps.

3. The integrated circuit package of claim 1 wherein a first runner in said first interconnection circuit electrically connects with a first solder bump, said first solder bump electrically connects to a first runner in said second interconnection circuit, said first runner in said second interconnection circuit electrically connects to a second solder bump, and said second solder bump electrically connects to a second runner in said first interconnection circuit.

4. The integrated circuit package of claim 1 wherein a first runner in said second interconnection circuit electrically connects with a first solder bump, said first solder bump electrically connects to a first runner in said first interconnection circuit, said first runner in said first interconnection circuit electrically connects to a second solder bump, and said second solder bump electrically connects to a second runner in said second interconnection circuit.

5. The integrated circuit package of claim 1 in which the said first integrated circuit chip supports at least two integrated circuit chips.

6. The integrated circuit package of claim 2 additionally including under bump metallization between said solder bumps and said first and second interconnection circuits.

7. The integrated circuit of claim 3 further including a third runner in said first interconnection circuit extending along a first direction along said upper planar surface of said first integrated circuit chip and wherein said first runner in said second interconnection circuit extends in a second direction along said lower planar surface of said second integrated circuit chip and further wherein said first direction and said second direction intersect when viewed from a direction normal to said planar surfaces.

8. The integrated circuit of claim 4 further including a third runner in said second interconnection circuit extending along a first direction along said lower planar surface of said second integrated circuit chip and wherein said first runner in said first interconnection circuit extends in a second direction along said upper planar surface of said first integrated circuit chip and further wherein said first direction and said second direction intersect when viewed from a direction normal to said planar surfaces.

9. The integrated circuit package of claim 6 in which the under bump metallization comprises a layer of chromium and a layer of copper.

10. The integrated circuit of claim 9 in which the said first and second interconnection circuits comprise aluminum.

11. Integrated circuit package comprising:

a. a first integrated circuit chip, said first integrated circuit chip containing a plurality of active semiconductor devices and having a length L₁, a width W₁, an upper planar surface with area A₁ equal to L₁ ×

W₁, and a lower planar surface with area A₁,

b. a first interconnection circuit on said upper planar surface of said first integrated circuit chip,

c. a second integrated chip supported by said first chip, said second integrated circuit chip containing a plurality of active semiconductor devices and having a length L₂, a width W₂, an upper planar surface with area A₂ equal to L₂ ×

W₂, and a lower planar surface with area A₂, and where A₂ <

A₁,

d. a third integrated chip supported by said first chip, said third integrated circuit chip containing a plurality of active semiconductor devices having a length L₃, a width W₃, an upper planar surface with area A₃ equal to L₃ ×

W₃, and a lower planar surface with area A₃, and where A₃ <

A₁, and further where A₂ +A₃ <

A₁, L₂ +L₃ <

L₁, and W₂ and W₃ <

W₁,

e. a plurality of bonding means for bonding said lower planar surfaces of said second and third integrated circuit chips to said upper planar surface of said first integrated circuit chip, leaving space between said lower planar surfaces of said second and third integrated circuit chips and said upper planar surface of said first integrated circuit chip,

f. a second interconnection circuit on the lower planar surface of said second integrated circuit chip, and

g. a third interconnection circuit on the lower planar surface of said third integrated circuit chip, and

h. a plurality of runners in each of said first, second, and third interconnection circuits and in which at least some of the runners in said first, second and third interconnection circuit electrically connect two of said plurality of bonding means.

12. The integrated circuit package of claim 11 wherein said plurality of bonding means comprises solder bumps.

13. The integrated circuit package of claim 11 wherein a first runner in said first interconnection circuit electrically connects with a first solder bump, said first solder bump electrically connects to a first runner in said second interconnection circuit, said first runner in said second interconnection circuit electrically connects to a second solder bump, said second solder bump electrically connects to a second runner in said first interconnection circuit, said second runner in said first interconnection circuit electrically connects to a third solder bump, and said third solder bump electrically connects to a first runner in said third interconnection circuit.

14. The integrated circuit package of claim 11 wherein a first runner in said second interconnection circuit electrically connects with a first solder bump, said first solder bump electrically connects to a first runner in said first interconnection circuit, said first runner in said first interconnection circuit electrically connects to a second solder buimp, and said second solder bump electrically connects to a first runner in said third interconnection circuit.

15. The integrated circuit of claim 13 further including a third runner in said first interconnection circuit extending along a first direction along said upper planar surface of said first integrated circuit chip and wherein said first runner in said second interconnection circuit extends in a second direction along said lower planar surface of said second integrated circuit chip and further wherein said first direction and said second direction intersect when viewed from a direction normal to said planar surfaces.