Self aligning electrical component

• US 5,898,574 A
• Filed: 09/02/1997
• Issued: 04/27/1999
• Est. Priority Date: 09/02/1997
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Tan, Wiling, Song, Lian It, Tiong, Raymond Teh Wai
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Vigushin, John B.
• Application Number:
  US08/926,082
• Time in Patent Office: 602 Days
• Field of Search: 361/760, 361/767, 361/772-774, 361/777, 361/782, 361/783, 361/306.1, 174/250, 174/260, 174/261, 174/52.4, 228/180.21, 257/678, 257/686, 257/692, 257/693, 257/730, 257/779, 257/786
• US Class Current: 361/777
• CPC Class Codes: H01C 1/144 the terminals or tapping points being welded or soldered
• CPC Class Codes: H01C 17/006 adapted for manufacturing resistor chips
• CPC Class Codes: H05K 2201/0939 Curved pads, e.g. semi-circular or elliptical pads or lands
• CPC Class Codes: H05K 2201/09418 Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
• CPC Class Codes: H05K 2201/09809 Coaxial layout reduction of cross-talk, noise or interference by printed shielding conductors for shielding around a single via or around a group of vias H05K1/0222
• CPC Class Codes: H05K 2201/10643 Disc shaped leadless component
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An electrical device (400) includes a substrate (300) having solder pads (215, 220) formed thereon and a self aligning electrical component (200) mounted to the solder pads (215, 220). The self aligning electrical component (200) includes a body having a cylindrical shape, a first terminal (205) formed on an inner region of the body, and a second terminal (210) formed around outer regions of the body surrounding the first terminal (205).

Claims

1. An electrical device, comprising:

a substrate having solder pads formed thereon, the solder pads including a first circular pad surrounding a second circular pad, wherein the first and second circular pads are not in direct contact; and

a self aligning electrical component mounted to the solder pads, the self aligning electrical component comprising;

a body having a cylindrical shape;

a first terminal formed on inner regions of the body and coupled to the second circular pad; and

a second terminal formed around outer regions of the body surrounding the first terminal, the second terminal coupled to the first circular pad.

2. A self aligning electrical component, comprising:

a body having a cylindrical shape;

a first terminal formed on an inner region of the body; and

a second terminal formed on outer regions of the body and surrounding the first terminal;

wherein the self aligning electrical component is mounted to solder pads formed on a substrate, wherein the solder pads include a first circular pad surrounded by a second circular pad, and wherein the first and second circular pads are not in direct contact.

3. An electrical device, comprising:

a substrate having solder pads formed thereon; and

a self aligning electrical component mounted to the solder pads, the self aligning electrical component comprising;

a body having a cylindrical shape;

a first terminal formed on an inner region of the body; and

a second terminal formed around outer regions of the body surrounding the first terminal;

wherein the first terminal is formed around an axis through a center of the body;

wherein the self aligning electrical component is a diode.

4. An electrical device, comprising:

a substrate having solder pads formed thereon; and

a self aligning electrical component mounted to the solder pads, the self aligning electrical component comprising;

a body having a cylindrical shape;

a first terminal formed on an inner region of the body; and

a second terminal formed around outer regions of the body surrounding the first terminal;

wherein the first terminal is formed around an axis through a center of the body;

wherein the solder pads include a first circular pad surrounding a second circular pad, and wherein the first and second circular pads are not in direct contact.