Composition for forming high thermal conductivity polybenzoxazine-based material and method

• US 5,900,447 A
• Filed: 05/01/1997
• Issued: 05/04/1999
• Est. Priority Date: 05/01/1997
• Status: Expired due to Term

• Current Assignee: Edison Polymer Innovation Corporation, General Electric Company, Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Edison Polymer Innovation Corporation
• Inventors: Ishida, Hatsuo
• Primary Examiner(s): YOON, TAE H
• Application Number:
  US08/846,457
• Time in Patent Office: 733 Days
• Field of Search: 524/404, 524/401, 524/430, 524/493
• US Class Current: 524/404
• CPC Class Codes: C08K 2003/382 and nitrogen
• CPC Class Codes: C08K 3/38 Boron-containing compounds
• CPC Class Codes: C08L 79/04 Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors

Abstract

The present invention relates to a composition and method for forming a high thermal conductivity polybenzoxazine-based material. The composition comprises at least one benzoxazine resin and a filler material which includes particles of boron nitride in an amount sufficient to establish a thermal conductivity of between about 3 W/mK and 37 W/mK in the polybenzoxazine-based material.

Claims

1. A composition for use in forming a high thermal conductivity polybenzoxazine-based material comprising at least one benzoxazine resin and a filler material including particles of boron nitride.

2. A composition as defined in claim 1 wherein the amount of said filler material in said composition is at least equal to about 60 wt. %.

3. A composition as defined in claim 2 wherein said boron nitride is in an amount sufficient to establish a thermal conductivity for said polybenzoxazine-based material between about 3 W/mK and 37 W/mK.

4. A composition as defined in claim 3 wherein said boron nitride is in a size range extending from 10 to 700 microns.

5. A composition as defined in claim 4 wherein said filler material further comprises particles selected from the group consisting of aluminum oxide, aluminum nitride and silica.

6. A composition as defined in claim 4 wherein said benzoxazine resin is formed from benzoxazine and epoxy compounds, benzoxazine and phenolic resin(s), benzoxazine and amine(s) and mixed benzoxazines.

7. A composition as defined in claim 5 further comprising conventional additives selected from the group consisting of lubricants, coupling agents, surfactants and non-polymerizable diluents.

8. A composition as defined in claim 4 wherein said benzoxazine resin is selected from the following formulae:

Class 1 ##STR10## or an amino group;

Class 2 ##STR11## an amine, wherein n is an integer of FIGS. 1 to 18;

Class 3 ##STR12## wherein R₂ is as defined above, and the benzene rings are unsubstituted or are substituted by one or more groups selected from --CH₃ and --Br;

Class 4

Multifunctional benzoxazine monomers of the formulas ##STR13## Class 5 ##STR14## wherein R₂ is as defined for class 2.

9. A composition as defined in claim 5 consisting essentially of at least one benzoxazine resin and particles of boron nitride.

10. A composition as defined in claim 5 wherein boron nitride is filled to at least 68 volume % to yield a polybenzoxazine-based material having a thermal conductivity of above about 20 W/mK.

11. A composition as defined in claim 5 wherein boron nitride is filled to at least 72 volume % to yield a polybenzoxazine-based material having a thermal conductivity of above about 25 W/mK.

16. A high thermal conductivity polybenzoxazine-based material according to claim 1 which is cured by molding said composition under elevated pressure.

12. A method for forming a high thermal conductivity polybenzoxazine-based material comprising the steps of combining a filler material which includes particles of boron nitride with at least one benzoxazine resin to form a composition in which the filler material is loaded at a minimum concentration level of at least about 60 wt. % and curing the composition.

13. A method as defined in claim 12 wherein the curing takes place under elevated pressure.

14. A method as defined in claim 13 wherein said benzoxazine resin is synthesized without a solvent.

15. A high thermal conductivity polybenzoxazine-based material comprising particles of boron nitride in an amount sufficient to establish a thermal conductivity of between about 3 W/mK and 37 W/mK formed by combining a filler material which includes said particles of boron nitride with at least one benzoxazine resin.