Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame

• US 5,900,582 A
• Filed: 03/31/1998
• Issued: 05/04/1999
• Est. Priority Date: 06/05/1992
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Tomita, Yoshihiro, Abe, Shunichi, Ueda, Naoto, Ichiyama, Hideyuki, Nishinaka, Yoshirou
• Primary Examiner(s): Kincaid, Kristine
• Assistant Examiner(s): Ngo, Hung V.
• Application Number:
  US09/050,397
• Time in Patent Office: 399 Days
• Field of Search: 174/52.2, 174/52.4, 257/676, 257/666, 257/787, 257/672, 257/674, 257/667, 257/668, 257/669, 257/670
• US Class Current: 174/529
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/06136 Covering only the central area of the surface to be connected, i.e. central arrangements
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48253 connecting the wire to a potential ring of the item
• CPC Class Codes: H01L 2224/4826 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/83205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 2224/85207 Thermosonic bonding
• CPC Class Codes: H01L 2224/85399 : Material
• CPC Class Codes: H01L 23/49503 : characterised by the die pad
• CPC Class Codes: H01L 23/4951 : Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
• CPC Class Codes: H01L 23/49537 : Plurality of lead frames mounted in one device
• CPC Class Codes: H01L 23/49551 : characterised by bent parts
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01068 : Erbium [Er]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: Y10T 29/49121 : Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49172 : by molding of insulating material

Abstract

A leadframe for producing a semiconductor device having a lead-on chip (LOC) structure with leads extending across a semiconductor chip, the leadframe includes a frame for a die pad having an outer frame section, a die pad displaced from the outer frame section, and a suspending lead connecting the die pad to the outer frame section with the die pad disposed inside the outer frame section; and a frame for leads including an outer frame portion and leads extending from opposite sides of the outer frame portion, connected to the frame for a die pad, the die pad being connected to the frame for leads at the suspending lead, wherein one of the frame for a die pad and the frame for leads includes a projection and the other of the frame for a die pad and the frame for leads includes a hole, the hole receiving the projection, the projection being disposed parallel to the frame for leads, connecting the frame for a die pad to the frame for leads.

Claims

1. A leadframe for producing a semiconductor device having a lead-on chip (LOC) structure wherein leads extend across a semiconductor chip, said leadframe comprising:

a frame for a die pad comprising an outer frame section, a die pad displaced from said outer frame section, and a suspending lead connecting said die pad to said outer frame section wherein said die pad is disposed inside said outer frame section; and

a frame for leads comprising an outer frame portion and a plurality of leads extending from opposite sides of said outer frame portion, connected to said frame for a die pad, said die pad being connected to said frame for leads at said suspending lead, wherein one of said frame for a die pad and said frame for leads includes a projection and the other of said frame for a die pad and said frame for leads includes a hole, the hole receiving the projection, the projection being disposed parallel to said frame for leads, thereby connecting said frame for a die pad to said frame for leads.

2. A semiconductor device having a lead-on chip (LOC) structure, said semiconductor device comprising:

a semiconductor chip having first and second primary surfaces and a plurality of electrodes disposed on said first primary surface;

a frame for a die pad including a die pad and a suspending lead connected to said die pad, said semiconductor chip being bonded to said die pad at said second primary surface;

a frame for leads comprising an outer frame portion and a plurality of leads extending from opposite sides of said outer frame portion, said frame for a die pad and said frame for leads being connected at said outer frame portion so that said suspending lead is connected to said outer frame portion, said die pad is displaced from said outer frame portion, and inner lead portions of said leads extend across and are spaced from said first primary surface of said semiconductor chip, wherein one of said frame for a die pad and said frame for leads includes a projection and the other of said frame for a die pad and said frame for leads includes a hole receiving the projection, wherein the projection is parallel to said outer frame portion;

metal wires bonded to respective ones of said electrodes and corresponding ones of said inner lead portions; and

a resin encapsulating said semiconductor chip, said die pad, said wires, and said inner lead portions.