Package and semiconductor device

• US 5,901,042 A
• Filed: 04/20/1998
• Issued: 05/04/1999
• Est. Priority Date: 04/21/1997
• Status: Expired due to Fees

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Nakamura, Morio, Maeda, Masahiro, Morimoto, Shigeru, Ota, Yorito
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US09/062,752
• Time in Patent Office: 379 Days
• Field of Search: 361/704, 361/707, 361/709, 361/711, 361/718-720, 361/728, 361/736, 361/749, 257/675, 257/688, 257/706, 257/707, 257/713, 174/52.3, 174/52.2, 174/52.4
• US Class Current: 361/704
• CPC Class Codes: H01L 2223/6644 Packaging aspects of high-frequency amplifiers amplifiers per se H03F
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01031 Gallium [Ga]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/13063 : Metal-Semiconductor Field-Effect Transistor [MESFET]
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 : Multilayer substrate
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching

Abstract

A semiconductor chip is mounted on the central portion of a metal heat radiator. A pair of metal projecting members are provided on the heat radiator externally of the pair of opposed sides of the semiconductor chip to extend therealong beyond both ends of the semiconductor chip. A circuit board is mounted on the side of each of the pair of projecting members opposed to the semiconductor chip. The top surface of the semiconductor chip and the top surface of each of the projecting members are connected to each other by a third bonding wire for grounding.

Claims

1. A package for carrying a semiconductor chip, comprising:

a metal heat radiator having a square chip carrying region to be provided with said semiconductor chip;

a wall enclosing said chip carrying region mounted on said metal heat radiator; and

a pair of metal projecting members provided on said heat radiator and positioned between said semiconductor chip and said wall enclosing said chip carrying region.

2. A package for carrying a semiconductor chip, comprising:

a metal heat radiator having a square chip carrying region to be provided with said semiconductor chip;

a wall enclosing said chip carrying region mounted on said metal heat radiator;

a metal projecting member provided on said heat radiator and positioned between said semiconductor chip and said wall enclosing said chip carrying region; and

a groove formed in said heat radiator and positioned between said semiconductor chip and said wall enclosing said chip carrying region.

3. A semiconductor device comprising:

a metal heat radiator;

a semiconductor chip mounted on said heat radiator;

a pair of projecting members provided on said heat radiator externally of a pair of opposed sides of said semiconductor chip to extend therealong beyond both ends of said semiconductor chip; and

a bonding wire for grounding, said bonding wire providing electrical connection between a top surface of said semiconductor chip and a top surface of each of said pair of projecting members.

4. A semiconductor device according to claim 3, further comprising:

a circuit board mounted on said heat radiator to be located on the side of one of said pair of projecting members opposed to said semiconductor chip; and

a bonding wire for signal transmission, said bonding wire providing electrical connection between the top surface of said semiconductor chip and a top surface of said circuit board.

5. A semiconductor device comprising:

a metal heat radiator;

a metal chip carrier provided on said heat radiator, said chip carrier being composed of a bottom portion sufficiently large in size to carry said semiconductor chip and a pair of sidewall portions formed on both side edge portions of said bottom portion to have a recessed cross section;

a semiconductor chip mounted on said bottom portion of said chip carrier; and

a bonding wire for grounding, said bonding wire providing electrical connection between a top surface of said semiconductor chip and a top surface of each of said pair of sidewall portions of said chip carrier.

6. A semiconductor device according to claim 5, further comprising:

a circuit board mounted on said heat radiator externally of one of said pair of sidewall portions of said chip carrier; and

a bonding wire for signal transmission, said bonding wire providing electrical connection between the top surface of said semiconductor chip and a top surface of said circuit board.

7. A semiconductor device comprising:

a metal heat radiator;

a semiconductor chip mounted on said heat radiator;

a metal projecting member provided on said heat radiator externally of one of a pair of opposed sides of said semiconductor chip to extend therealong beyond both ends of said semiconductor chip;

a groove formed in said heat radiator externally of the other of said pair of opposed sides of said semiconductor chip to extend therealong beyond the both ends of said semiconductor chip; and

a bonding wire for grounding, said bonding wire providing electrical connection between a top surface of said semiconductor chip and a top surface of said projecting member.

8. A semiconductor device according to claim 7, further comprising:

a circuit board mounted on said heat radiator to be located on the side of said groove opposed to said semiconductor chip; and

a bonding wire for signal transmission, said bonding wire providing electrical connection between the top surface of said semiconductor chip and a top surface of said circuit board.

9. A semiconductor device according to claim 7, further comprising:

a circuit board mounted on said heat radiator to be located on the side of said projecting member opposed to said semiconductor chip; and

a bonding wire for signal transmission, said bonding wire providing electrical connection between the top surface of said semiconductor chip and a top surface of said circuit board.