Mini-module with upwardly directed leads

• US 5,901,044 A
• Filed: 07/10/1997
• Issued: 05/04/1999
• Est. Priority Date: 07/10/1997
• Status: Expired due to Fees

• Current Assignee: ILC Data Device Corporation
• Original Assignee: ILC Data Device Corporation
• Inventors: Marro, Len
• Primary Examiner(s): Tolin, Gerald P.
• Assistant Examiner(s): FOSTER, DAVID A
• Application Number:
  US08/889,932
• Time in Patent Office: 663 Days
• Field of Search: 361/728, 361/736, 361/748, 361/752, 361/760, 361/765, 361/772, 361/774, 361/777, 361/778, 361/730, 174/50, 174/50.51, 174/50.54, 174/50.6, 174/52.1, 174/52.2
• US Class Current: 361/728
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4903 Connectors having different sizes, e.g. different diameters
• CPC Class Codes: H01L 2224/49051 Connectors having different shapes
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49789 : Obtaining plural product pieces from unitary workpiece
• CPC Class Codes: Y10T 29/49796 : Coacting pieces

Abstract

A power module with leads extending upwardly. The circuit components and connections of the power module are arranged upon a substrate having interface leads attached thereto extending away from the undersurface of the substrate. The interface leads extend through openings in a form fitting molded case. The case has an open center region to facilitate performance of final assembly steps upon the module and is subsequently covered with a rugged lid and is encapsulated with a suitable potting material. The interior of the module is filled with a gel to provide moisture-proof protection.

Claims

1. A compact module, comprising:

an insulating substrate supporting a plurality of electronic components, one or more of said components being electrically interconnected;

a plurality of interface leads arranged at least one end of said substrate and extending along a mounting surface of the substrate;

said interface leads and a portion of the substrate supporting said interface leads being bent so as to be aligned transverse to said mounting surface, said leads having outwardly extending portions of said leads extending beyond an end of said substrate portion and being arranged substantially in a given array;

a molded case having a recess along a bottom surface thereof for receiving said substrate so that, when said substrate is mounted in said recess, a bottom surface of said substrate projects away from the bottom surface of the molded case;

the interior of said molded case being hollow;

said molded case having an open top to facilitate the performance of final assembly operations upon said substrate and the electrical components provided therein subsequent to assembly of said substrate and molded case to one another;

said molded case having openings along one end thereof, said openings having a configuration, which conform to the shape of said upwardly directed leads and being of a size slightly larger than the size of said leads to facilitate passage of said leads through said openings whereby upper free ends of said leads extend above an upper surface of said molded case to facilitate electrical connection with associated circuitry external to said module.

2. The apparatus of claim 1 wherein said molded case is provided with mounting surfaces on opposite ends thereof.

3. The apparatus of claim 2 wherein said mounting surfaces are each provided with openings for receiving fasteners to secure the module to a supporting surface.

4. The apparatus of claim 2 further comprising substantially triangular-shaped members integrally joined between said mounting surface and the main body of said molded case to enhance the structural strength thereof.

5. The apparatus of claim 1 wherein the interior of said molded case is filled with a gel covering circuitry on said substrate.

6. The apparatus of claim 1 wherein said molded case has a support ledge;

and

a lid arranged on said support ledge and covering said opening.

7. The apparatus of claim 1 wherein said lid is covered with a potting material.

8. The apparatus of claim 1 wherein an adhesive is provided to join a marginal portion of said substrate to an adjacent portion of said molded case.

9. The apparatus of claim 8 wherein said adhesive is a thixotropic adhesive.

10. The apparatus of claim 1 wherein said molded case is provided with a recess for receiving said vertically aligned substrate portion.

11. The apparatus of claim 7 wherein indicia is provided on an exposed surface of the potting material to facilitate identification of the module.

12. The compact module of claim 1 wherein said circuitry is a power circuit for driving a motor.