Mini-module with upwardly directed leads
First Claim
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1. A compact module, comprising:
- an insulating substrate supporting a plurality of electronic components, one or more of said components being electrically interconnected;
a plurality of interface leads arranged at least one end of said substrate and extending along a mounting surface of the substrate;
said interface leads and a portion of the substrate supporting said interface leads being bent so as to be aligned transverse to said mounting surface, said leads having outwardly extending portions of said leads extending beyond an end of said substrate portion and being arranged substantially in a given array;
a molded case having a recess along a bottom surface thereof for receiving said substrate so that, when said substrate is mounted in said recess, a bottom surface of said substrate projects away from the bottom surface of the molded case;
the interior of said molded case being hollow;
said molded case having an open top to facilitate the performance of final assembly operations upon said substrate and the electrical components provided therein subsequent to assembly of said substrate and molded case to one another;
said molded case having openings along one end thereof, said openings having a configuration, which conform to the shape of said upwardly directed leads and being of a size slightly larger than the size of said leads to facilitate passage of said leads through said openings whereby upper free ends of said leads extend above an upper surface of said molded case to facilitate electrical connection with associated circuitry external to said module.
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Abstract
A power module with leads extending upwardly. The circuit components and connections of the power module are arranged upon a substrate having interface leads attached thereto extending away from the undersurface of the substrate. The interface leads extend through openings in a form fitting molded case. The case has an open center region to facilitate performance of final assembly steps upon the module and is subsequently covered with a rugged lid and is encapsulated with a suitable potting material. The interior of the module is filled with a gel to provide moisture-proof protection.
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Citations
12 Claims
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1. A compact module, comprising:
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an insulating substrate supporting a plurality of electronic components, one or more of said components being electrically interconnected; a plurality of interface leads arranged at least one end of said substrate and extending along a mounting surface of the substrate; said interface leads and a portion of the substrate supporting said interface leads being bent so as to be aligned transverse to said mounting surface, said leads having outwardly extending portions of said leads extending beyond an end of said substrate portion and being arranged substantially in a given array; a molded case having a recess along a bottom surface thereof for receiving said substrate so that, when said substrate is mounted in said recess, a bottom surface of said substrate projects away from the bottom surface of the molded case; the interior of said molded case being hollow; said molded case having an open top to facilitate the performance of final assembly operations upon said substrate and the electrical components provided therein subsequent to assembly of said substrate and molded case to one another; said molded case having openings along one end thereof, said openings having a configuration, which conform to the shape of said upwardly directed leads and being of a size slightly larger than the size of said leads to facilitate passage of said leads through said openings whereby upper free ends of said leads extend above an upper surface of said molded case to facilitate electrical connection with associated circuitry external to said module. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification