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Method for production of a three-dimensional circuit arrangement

  • US 5,902,118 A
  • Filed: 12/20/1996
  • Issued: 05/11/1999
  • Est. Priority Date: 07/05/1994
  • Status: Expired due to Term
First Claim
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1. A method for production of a three-dimensional circuit arrangement, comprising the steps of:

  • providing a first substrate having in a region of a first main surface thereof at least one first component having first contacts, and a second substrate, having in a region of a second main surface at least one second component having second contacts;

    joining the first and second substrates together to form a stack such that the first main surface touches the second main surface and such that at least one first contact and one second contact touch one another;

    providing at least one of the main surfaces with an adhesive layer via which the first substrate and the second substrate are firmly connected to one another;

    providing at least one substrate of the first and second substrates with electrical connections;

    thinning the first substrate from a rear side thereof opposite the first main surface, the second substrate acting as a stabilizing supporting plate; and

    opening contact holes to the at least one first component in the rear side and providing the contact holes with rear-side contacts.

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