Method for production of a three-dimensional circuit arrangement

• US 5,902,118 A
• Filed: 12/20/1996
• Issued: 05/11/1999
• Est. Priority Date: 07/05/1994
• Status: Expired due to Term

• Current Assignee: Infineon Technologies AG
• Original Assignee: Siemens AG
• Inventors: Hubner, Holger
• Primary Examiner(s): Nguyen, Tuan H.
• Application Number:
  US08/765,088
• Time in Patent Office: 872 Days
• Field of Search: 438/107, 438/108, 438/109, 438/118, 438/455, 438/459, 438/612, 438/106
• US Class Current: 438/106
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06541 Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/31 Structure, shape, material or disposition of the layer connectors after the connecting process
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/0101 Neon [Ne]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01032 Germanium [Ge]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01049 Indium [In]
• CPC Class Codes: H01L 2924/01052 Tellurium [Te]
• CPC Class Codes: H01L 2924/01058 Cerium [Ce]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: Y10T 408/56343 : Base supported clamp
• CPC Class Codes: Y10T 408/62 : Coaxial

Abstract

In order to produce a three-dimensional circuit arrangement, two substrates (21, 26) which have components in the region of their boundary surfaces (22, 27) which touch one another are stacked one on top of the other. The substrates (21, 26) are firmly connected to one another via these boundary surfaces (22, 27). One of the substrates (21) can subsequently be thinned from the rear side (212) and can be provided with rear-side contacts (213), the other substrate (26) acting as a stabilizing supporting plate.

Claims

1. A method for production of a three-dimensional circuit arrangement, comprising the steps of:

providing a first substrate having in a region of a first main surface thereof at least one first component having first contacts, and a second substrate, having in a region of a second main surface at least one second component having second contacts;

joining the first and second substrates together to form a stack such that the first main surface touches the second main surface and such that at least one first contact and one second contact touch one another;

providing at least one of the main surfaces with an adhesive layer via which the first substrate and the second substrate are firmly connected to one another;

providing at least one substrate of the first and second substrates with electrical connections;

thinning the first substrate from a rear side thereof opposite the first main surface, the second substrate acting as a stabilizing supporting plate; and

opening contact holes to the at least one first component in the rear side and providing the contact holes with rear-side contacts.

2. The method as claimed in claim 1,

wherein first metal surfaces are applied to at least one of the first and second main surfaces,

wherein solder metal is applied as the adhesive layer to the first metal surfaces,

wherein the metal surfaces are soldered by heating to the adjacent main surface of the other substrate of the first and second substrates.

3. The method as claimed in claim 2, wherein one of tungsten or nickel is used for the metal surfaces and wherein one of gallium or indium is used for the solder metal.

4. The method as claimed in claim 2,

wherein additional metal surfaces which are respectively adjacent to the first metal surfaces, are applied to the other main surface of the first and second main surfaces,

wherein the first-mentioned metal surfaces are soldered to the adjacent additional metal surfaces.

5. The method as claimed in claim 2, wherein at least one further metal surface is formed for electrical connection of contacts in the first substrate and in the second substrate, which do not touch one another in a region of the main surfaces which are adjacent to one another, such that said further metal surface forms a conductor track between the two contacts.

6. The method as claimed in claim 1, wherein after production of the rear-side contacts, the stack having the first substrate and the second substrate is joined together with a third substrate which, in a region of a third main surface thereof, has at least one third component having third contacts, such that the third main surface touches the rear side of the first substrate and such that at least the third contact touches the rear-side contact,

wherein at least one of the rear side of the first substrate and the third main surface is provided with an adhesive layer via which the third substrate is firmly connected to the stack.

7. The method as claimed in claim 1, wherein the stack comprising the first substrate and the second substrate is joined together with an identical stack comprising a further first substrate and a further second substrate such that rear sides of the first substrate and the further first substrate touch one another and such that an electrical connection is produced between rear-side contacts of the first substrate and the further first substrate a further adhesive layer being applied at least to one of the rear sides of the first substrate and the further first substrate, via which further adhesive layer the two stacks are firmly connected to one another.

8. A method for production of a three-dimensional circuit arrangement, comprising the steps of:

providing a first substrate having in a region of a first main surface thereof at least one first component having first contacts, and a second substrate, having in a region of a second main surface at least one second component having second contacts;

joining the first and second substrates together to form a stack such that the first main surface touches the second main surface and such that at least one first contact and one second contact touch one another;

providing at least one of the main surfaces with an adhesive layer via which the first substrate and the second substrate are firmly connected to one another;

providing at least one substrate of the first and second substrates with electrical connections;

thinning the first substrate from a rear side thereof opposite the first main surface, the second substrate acting as a stabilizing supporting plate;

opening contact holes to the at least one first component in the rear side and providing the contact holes with rear-side contacts;

joining together the stack having the first substrate and the second substrate with a third substrate which, in a region of a third main surface thereof, has at least one third component having third contacts, such that the third main surface touches the rear side of the first substrate and such that at least the third contact touches the rear-side contact; and

providing at least one of the rear side of the first substrate and the third main surface with an adhesive layer via which the third substrate is firmly connected to the stack.

9. The method as claimed in claim 8,

wherein first metal surfaces are applied to at least one of the first and second main surfaces,

wherein solder metal is applied as the adhesive layer to the first metal surfaces,

wherein the metal surfaces are soldered by heating to the adjacent main surface of the other substrate of the first and second substrates.

10. The method as claimed in claim 9,

wherein one of tungsten or nickel is used for the metal surfaces and wherein one of gallium or indium is used for the solder metal.

11. The method as claimed in claim 9,

wherein additional metal surfaces which are respectively adjacent to the first metal surfaces, are applied to the other main surface of the first and second main surfaces,

wherein the first-mentioned metal surfaces are soldered to the adjacent additional metal surfaces.

12. The method as claimed in claim 9, wherein at least one further metal surface is formed for electrical connection of contacts in the first substrate and in the second substrate, which do not touch one another in a region of the main surfaces which are adjacent to one another, such that said further metal surface forms a conductor track between the two contacts.

13. A method for production of a three-dimensional circuit arrangement, comprising the steps of:

providing a first substrate having in a region of a first main surface thereof at least one first component having first contacts, and a second substrate, having in a region of a second main surface at least one second component having second contacts;

joining together the stack having the first substrate and the second substrate with an identical stack having a further first substrate and a further second substrate such that rear sides of the first substrate and the further first substrate touch one another and such that an electrical connection is produced between rear-side contacts of the first substrate and the further first substrate, a further adhesive layer being applied at least to one of the rear sides of the first substrate and the further first substrate, via which further adhesive layer and the two stacks are firmly connected to one another;

thinning the first substrate from a rear side thereof opposite the first main surface, the second substrate acting as a stabilizing supporting plate; and

opening contact holes to the at least one first component in the rear side and providing the contact holes with the rear-side contacts.

14. The method as claimed in claim 13,

wherein first metal surfaces are applied to at least one of the first and second main surfaces,

wherein solder metal is applied as the adhesive layer to the first metal surfaces,

wherein the metal surfaces are soldered by heating to the adjacent main surface of the other substrate of the first and second substrates.

15. The method as claimed in claim 14,

wherein one of tungsten or nickel is used for the metal surfaces and wherein one of gallium or indium is used for the solder metal.

16. The method as claimed in claim 14,

wherein additional metal surfaces which are respectively adjacent to the first metal surfaces, are applied to the other main surface of the first and second main surfaces,

wherein the first-mentioned metal surfaces are soldered to the adjacent additional metal surfaces.

17. The method as claimed in claim 14, wherein at least one further metal surface is formed for electrical connection of contacts in the first substrate and in the second substrate, which do not touch one another in a region of the main surfaces which are adjacent to one another, such that said further metal surface forms a conductor track between the two contacts.

18. A method for production of a three-dimensional circuit arrangement, comprising the steps of:

providing a first substrate having in a region of a first main surface thereof at least one first component having first contacts, and a second substrate, having in a region of a second main surface at least one second component having second contacts;

applying first metal surfaces to at least one of the first and second main surfaces;

applying solder metal as an adhesive layer to the first metal surfaces;

soldering together the first and second substrates together by heating to the adjacent main surface of the other substrate of the first and second substrates to form a stack such that the first main surface touches the second main surface and such that at least one first contact and one second contact tough one another;

providing at least one substrate of the first and second substrates with electrical connections;

thinning the first substrate from a rear side thereof opposite the first main surface, the second substrate acting as a stabilizing supporting plate; and

opening contact holes to the at least one first component in the rear side and providing the contact holes with rear-side contacts.

19. The method as claimed in claim 18,

wherein one of tungsten or nickel is used for the metal surfaces and wherein one of gallium or indium is used for the solder metal.

20. The method as claimed in claim 18,

wherein additional metal surfaces which are respectively adjacent to the first metal surfaces, are applied to the other main surface of the first and second main surfaces,

wherein the first-mentioned metal surfaces are soldered to the adjacent additional metal surfaces.

21. The method as claimed in claim 18, wherein at least one further metal surface is formed for electrical connection of contacts in the first substrate and in the second substrate, which do not touch one another in a region of the main surfaces which are adjacent to one another, such that said further metal surface forms a conductor track between the two contacts.

22. The method as claimed in claim 18, wherein the stack having the first substrate and the second substrate is joined together with an identical stack having a further first substrate and a further second substrate such that rear sides of the first substrate and the further first substrate touch one another and such that an electrical connection is produced between rear-side contacts of the first substrate and the further first substrate, a further adhesive layer being applied at least to one of the rear sides of the first substrate and the further first substrate, via which further adhesive layer the two stacks are firmly connected to one another.

23. A method for production of a three-dimensional circuit arrangement, comprising the steps of:

providing a first substrate having in a region of a first main surface thereof at least one first component having first contacts, and a second substrate, having in a region of a second main surface at least one second component having second contacts;

applying first metal surfaces to at least one of the first and second main surfaces;

applying solder metal as an adhesive layer to the first metal surfaces;

forming at least one further metal surface for electrical connection of contacts in the first substrate and in the second substrate, which do not touch one another in a region of the main surfaces which are adjacent to one another, such that said further metal surface forms a conductor track between the two contacts;

soldering the first and second substrates together by heating to the adjacent main surface of the other substrate of the first and second substrates to form a stack such that the first main surface touches the second main surface and such that at least one first contact and one second contact touch one another;

providing at least one substrate of the first and second substrates with electrical connections;

thinning the first substrate from a rear side thereof opposite the first main surface, the second substrate acting as a stabilizing supporting plate; and

opening contact holes to the at least one first component in the rear side and providing the contact holes with rear-side contacts.

24. The method as claimed in claim 23,

wherein one of tungsten or nickel is used for the metal surfaces and wherein one of gallium or indium is used for the solder metal.

25. The method as claimed in claim 23,

wherein additional metal surfaces which are respectively adjacent to the first metal surfaces, are applied to the other main surface of the first and second main surfaces,

wherein the first-mentioned metal surfaces are soldered to the adjacent additional metal surfaces.

26. The method as claimed in claim 23, wherein after production of the rear-side contacts, the stack having the first substrate and the second substrate is joined together with a third substrate which, in a region of a third main surface thereof, has at least one third component having third contacts, such that the third main surface touches the rear side of the first substrate and such that at least the third contact touches the rear-side contact,

wherein at least one of the rear side of the first substrate and the third main surface is provided with an adhesive layer via which the third substrate is firmly connected to the stack.

27. The method as claimed in claim 23, wherein the stack having the first substrate and the second substrate is joined together with an identical stack having a further first substrate and a further second substrate such that rear sides of the first substrate and the further first substrate touch one another and such that an electrical connection is produced between rear-side contacts of the first substrate and the further first substrate, a further adhesive layer being applied at least to one of the rear sides of the first substrate and the further first substrate, via which further adhesive layer the two stacks are firmly connected to one another.