Flexible optical circuit appliques

• US 5,902,435 A
• Filed: 12/31/1996
• Issued: 05/11/1999
• Est. Priority Date: 12/31/1996
• Status: Expired due to Term

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Company
• Inventors: Smith, Robert Travis, Smith, Terry Lee, Meis, Michael Alan, Goff, Dewain Robert, Henson, Gordon Dwight
• Primary Examiner(s): MAYES, MELVIN C
• Application Number:
  US08/775,849
• Time in Patent Office: 861 Days
• Field of Search: 156/166, 156/176, 156/178, 156/179, 156/276, 156/293, 156/230, 428/40.4, 428/41.8, 428/364, 428/369, 428/343, 428/347, 428/914, 428/915, 65/385, 385/114
• US Class Current: 156/230
• CPC Class Codes: G02B 6/3608 Fibre wiring boards, i.e. where fibres are embedded or attached in a pattern on or to a substrate, e.g. flexible sheets optical ribbon cables in support members G02B6/4401
• CPC Class Codes: G02B 6/3612 Wiring methods or machines
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: Y10S 428/914 Transfer or decalcomania
• CPC Class Codes: Y10T 428/28 Web or sheet containing structurally defined element or component and having an adhesive outermost layer
• CPC Class Codes: Y10T 428/2817 Heat sealable
• CPC Class Codes: Y10T 428/2913 Rod, strand, filament or fiber
• CPC Class Codes: Y10T 428/2922 Nonlinear [e.g., crimped, coiled, etc.]

Abstract

A preformed fiber optic applique having a backing layer is provided. The backing layer or film, has an adhesive coating applied thereon. At least one optical fiber is routed and bonded to the adhesive layer providing a continuous optical signal path from one end to another. A releasable liner is releasably attached to the adhesive layer and positioned to cover the backing layer including the at least one optical fiber. Microstructures are provided on the backing layer in one embodiment. The microstructures are crushable structures that prevent the adhesive from immediately adhering to a substrate.

Claims

1. A method of optically connecting a plurality of optical components on a substrate, the method comprising the steps of:

providing a backing layer;

providing at least one optical fiber coated with an adhesive;

placing the at least one optical fiber on the backing layer in a desired pattern releasably securing the at least one fiber to the backing layer;

placing the at least one fiber and the backing layer on a substrate in a desired position; and

fixedly adhering the at least one fiber to the substrate.

2. The method as in claim 1 further including the step of removing the backing layer while leaving the at least one fiber adhered to the substrate.

3. A method of fabricating an optical circuit applique having a backing layer, an adhesive coating and at least one optical fiber, the method including the steps of:

providing a supply of backing layer;

applying an adhesive coating to the backing layer;

forming a plurality of microstructures in the adhesive coating in a desired pattern to form a plurality of channels;

providing at least one optical fiber;

securing the at least one optical fiber in at least one of the plurality of channels;

forming a receiving cavity in the backing layer; and

placing a socket in the receiving cavity.

4. The method as in claim 3 further including the step of preparing the at least one fiber for termination in the sockets.

5. A preformed fiber optic applique for mounting to a substrate comprising:

a backing layer;

a temporarily repositionable adhesive layer applied to the backing layer; and

at least one fiber bonded to the temporarily repositionable adhesive layer, further comprising microstructures formed on the backing layer.

6. The applique as in claim 5 wherein the microstructures are positioned to form channels and wherein the at least one fiber is positioned in the channels.

7. A preformed fiber optic applique for mounting to a substrate comprising:

a backing layer;

a temporarily repositionable adhesive layer applied to the backing layer; and

at least one optical fiber bonded to the temporarily repositionable adhesive layer, further comprising microstructures formed on the backing layer.

8. The applique of claim 7 wherein the microstructures are crushable.

9. The applique as in claim 7, further comprising microstructures formed in the temporary repositionable adhesive layer.

10. The applique as in claim 9 wherein the microstructures are crushable.

11. The applique as in claim 9 wherein the microstructures are positioned to form channels and wherein the at least one fiber is positioned in the channel.

12. The applique as in claim 7 wherein the microstructures are positioned to form channels and wherein the at least one fiber is positioned in the channels.

13. A preformed fiber optic circuit for bonding to a substrate comprising:

a backing layer;

a plurality of microstructures formed on the backing layer in a desired pattern to form a plurality of channels;

an adhesive layer applied to the backing layer wherein the adhesive layer has a desired depth and wherein the plurality of microstructures protrude from the backing layer above the desired depth of the adhesive layer; and

at least one optical fiber bonded to the backing layer in at least one of the plurality of channels.

14. The applique as in claim 13 wherein the adhesive layer is a temporarily repositionable adhesive.

15. The applique as in claim 14 wherein the temporarily repositionable adhesive is selected from the group consisting of:

pressure sensitive adhesives, pressure sensitive adhesives having crushable microstructures, partially cured adhesives containing crushable microspheres with curing catalyst inside, light-curable adhesives, heat-curable adhesives, and hot melt adhesives.

16. The applique as in claim 13 where the at least one optical fiber is a silica fiber.

17. The applique as in claim 16 wherein the at least one optical fiber is routed to form a bend.

18. The applique as in claim 17 wherein the bend radius of the plurality of optical fibers is less than 3 inches.

19. The applique as in claim 18 wherein the bending stress of the plurality of optical fibers is less than 100K psi.

20. The applique as in claim 13 wherein the microstructures are crushable.

21. A preformed fiber optic applique comprising:

a cover with a top surface and a bottom surface;

a backing with a top surface and a bottom surface;

a first adhesive layer between the top surface of the backing and the bottom surface of the cover;

at least one optical fiber bonded to the first adhesive layer and between the cover and the backing; and

a second adhesive layer on the bottom surface of the backing; and

alignment microstructures on the bottom surface of the cover.

22. The applique as claimed in claim 21, further comprising crushable microstructures on the bottom surface of the backing.

23. A preformed fiber optic applique comprising:

a cover with a top surface and a bottom surface;

a backing with a top surface and a bottom surface;

a first adhesive layer between the top surface of the backing and the bottom surface of the cover;

at least one optical fiber bonded to the first adhesive layer and between the cover and the backing; and

a second adhesive layer on the bottom surface of the backing; and

further comprising alignment microstructures on the top surface of the backing.