Method and apparatus for machining material with a liquid-guided laser beam

• US 5,902,499 A
• Filed: 02/28/1997
• Issued: 05/11/1999
• Est. Priority Date: 05/30/1994
• Status: Expired due to Term

• Current Assignee: Synova Incorporated (Altimetrik Corp.)
• Original Assignee: Synova Incorporated (Altimetrik Corp.)
• Inventors: Richerzhagen, Bernold
• Primary Examiner(s): Mills, Gregory L.
• Application Number:
  US08/750,130
• Time in Patent Office: 802 Days
• Field of Search: 219/121.6, 219/121.61, 219/121.67, 219/121.68, 219/121.69, 219/121.72, 219/121.73, 219/121.75, 219/121.84, 219/121.85, 83/53, 83/177
• US Class Current: 219/121.84
• CPC Class Codes: B23K 26/06 Shaping the laser beam, e.g. by masks or multi-focusing
• CPC Class Codes: B23K 26/064 by means of optical elements, e.g. lenses, mirrors or prisms
• CPC Class Codes: B23K 26/0648 comprising lenses
• CPC Class Codes: B23K 26/0665 by beam condensation on the workpiece, e.g. for focusing
• CPC Class Codes: B23K 26/1423 the flow carrying an electric current
• CPC Class Codes: B23K 26/146 the fluid stream containing a liquid
• CPC Class Codes: G02B 1/06 made of fluids in transparent cells
• CPC Class Codes: G02B 6/032 with non solid core or cladding G02B6/02295 takes precedence
• CPC Class Codes: Y10T 83/0591 Cutting by direct application of fluent pressure to work
• CPC Class Codes: Y10T 83/364 By fluid blast and/or suction

Abstract

An arrangement for processing material with a liquid jet comprising a laser for emitting a laser beam. The arrangement includes a processing module having a nozzle duct connected to a liquid supply line for forming a liquid jet. The nozzle duct has an intake opening lying in an intake opening plane. An optical element couples the laser beam into the liquid jet, and the optical element of the laser beam is focused in a focusing point range and into the intake opening plane of the nozzle duct. The liquid supply line for the nozzle duct defines an area formed above the nozzle intake opening having a height dimensioned relative to the cross-sectional area of the intake opening such that the area above the nozzle intake opening does not include a liquid retaining chamber. The absence of the liquid retaining chamber producing a flow speed for the liquid in a focusing cone point range sufficiently high that, for a predetermined low radiation absorption coefficient for the liquid, the formation of a thermal lens in the liquid in the focusing cone point range is suppressed enough so that no portion of the radiation damages walls of the nozzle duct.

Claims

1. Method for processing material using a laser that emits a laser beam guided by a liquid jet comprised of liquid with a predetermined radiation absorption coefficient, with radiation from the laser beam being focussed in a focusing cone point range, the laser beam being directed at a nozzle having a nozzle duct provided with a nozzle intake opening disposed in a plane, the method comprising locating a radiation focusing point for coupling the laser beam into the liquid jet at the plane of the intake opening of the nozzle duct;

conducting the liquid jet in an area surrounding the nozzle intake opening in the absence of a retaining chamber such that a flow speed for said liquid with said predetermined radiation absorption coefficient in the focusing cone point range of the radiation is sufficiently high that a formation of a thermal lens in the focusing point range is suppressed.

2. Method according to claim 1, including surrounding the liquid jet formed at the nozzle intake opening with an air bolster to thereby insulate the walls of the nozzle.

3. Method according to claim 1, including using silicone oil as the liquid jet, the silicon oil being from the group of polymethylsiloxane, and including using laser radiation with a wave length between 0.25 μ

m and 2.1 μ

m.

4. Method according to claim 1, including recovering liquid during material processing of the work piece, filtering the recovered liquid and returning the filtered liquid to the nozzle.

5. Method according to claim 1, wherein a laser beam emitted from the laser is guided by a laser beam guide located completely external of the liquid surrounding the nozzle intake opening.

6. Arrangement for processing material with a liquid jet comprising a laser for emitting a laser beam, and a processing module that includes a nozzle having a nozzle duct connected to a liquid supply line for forming a liquid jet comprised of liquid with a predetermined radiation absorption coefficient, the nozzle duct having an intake opening possessing a cross-sectional area and lying in an intake opening plane, an optical element for coupling the laser beam into the liquid jet, the optical element of the laser beam being focused in a focusing point range and into the intake opening plane of the nozzle duct, and the liquid supply line for the nozzle duct defining an area formed above the nozzle intake opening, the area above the nozzle intake opening having a height dimensioned relative to the cross-sectional area of the nozzle intake opening such that the area above the nozzle intake opening is absent a liquid retaining chamber, and a flow speed for said liquid with said predetermined radiation absorption coefficient in a focusing cone point range is sufficiently high that a formation of a thermal lens in the liquid in the focusing cone point range is suppressed.

7. Arrangement according to claim 6, wherein a wall of the liquid feed line is defined by a cover that is transparent to the laser radiation.

8. Arrangement according to claim 6, wherein the nozzle duct and the intake opening have surfaces that make contact with the liquid, said surfaces as well as the liquid being electrically insulating and the flow speed of the liquid in the area of the intake opening and the nozzle duct being selected high enough so that an electrical charge of the liquid jet takes place increase a material stripping rate.

9. Arrangement according to claim 6, wherein the nozzle duct includes a liquid intake edge, the liquid intake edge of the nozzle duct having a radius smaller than 50 μ

m.

10. Arrangement according to claim 6, wherein the nozzle includes a nozzle discharge opening that is expanded relative to the intake opening.

11. Arrangement according to claim 6, wherein the laser is spatially removed from the processing module, the arrangement further including a radiation guide for feeding laser radiation from the laser to the optical element.

12. Arrangement according to claim 6, wherein the liquid is a silicone oil from the group of polymethylsiloxane and laser radiation from the laser being in a wave length range between 0.25 μ

m and 2.1 μ

m.

13. Arrangement according to claim 6, including a catch basin for catching the liquid that flows through a work piece opening during material processing of the work piece or for catching the liquid that runs off the work piece, and a pump connected to a filtering unit for filtering the liquid from the catch basin and for pumping the liquid back to the nozzle duct.

14. Arrangement according to claim 6, including a coupling element for installing the processing module on a spatially movable adjustment unit.

15. Arrangement according to claim 6, further comprising a laser beam guide for the laser beam emitted from the laser, wherein no portion of the laser beam guide is located in the liquid supply line.

16. An arrangement for processing material with a liquid jet, comprising:

a laser for emitting a laser beam;

a processing module that includes a nozzle having a nozzle duct connected to a liquid supply line for forming a liquid jet of a liquid, the nozzle duct having an intake opening lying in an intake opening plane;

an optical element for coupling the laser beam into the liquid jet, the optical element being focused into the intake opening plane of the nozzle duct; and

means for sufficiently suppressing the formation of a thermal lens in the liquid such that no portion of radiation of the laser damages walls of the nozzle duct.

17. Arrangement according to claim 16, further comprising a laser beam guide for the laser beam emitted from the laser, wherein no portion of the laser beam guide is located in the liquid supply line.