Micro-patch antenna connected to circuits chips

• US 5,903,239 A
• Filed: 05/26/1995
• Issued: 05/11/1999
• Est. Priority Date: 08/11/1994
• Status: Expired due to Term

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Fujita, Suguru, Takahashi, Kazuaki, Sagawa, Morikazu
• Primary Examiner(s): Lee, Benny T
• Application Number:
  US08/451,813
• Time in Patent Office: 1,446 Days
• Field of Search: 393/700 MS, 393/853, 333/247
• US Class Current: 343/700.0MS
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12032 Schottky diode
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 9/0428 radiating a circular polarised wave

Abstract

An antenna apparatus comprises: a first chip having: a substrate; a ground film on the substrate; a dielectric film on the ground film; a micro-patch antenna on the dielectric film; a microstrip line extending from the micro-patch antenna; and an in/output microstrip line on the dielectric film; a second chip having a circuit for effecting an operation with the antenna; and a connecting portion for fixing the second chip to the first chip by providing mechanical and electrical connection (flip-chip bonding) between the circuit and the microstrip line and between the circuit and the in/output microstrip line. The substrate comprises a silicon, a GaAs substrate, or a dielectric substrate. The antenna may be provided on the bottom surface of the substrate and be provided on a third substrate also connected by the flip-chip bonding wherein the second chip and the antenna is connected using a through hole. Instead of the through hole, the antenna is coupled to the circuit portion electromagnetically. The substrate may have a hollow portion and the second chip may be accommodated in the hollow portion and the antenna may be provided on a third chip covering the second chip.

Claims

1. An antenna apparatus comprising:

a first chip having;

a substrate;

a ground film on said substrate;

a dielectric film on said ground film;

a micro-patch antenna on said dielectric film;

an interconnection microstrip line, on said dielectric film, coupled to and extending from said micro-patch antenna; and

an input/output microstrip line on said dielectric film at a predetermined position;

a second chip having a circuit portion therein, including input and output terminals on a surface of the second chip, for effecting a predetermined operation with said micro-patch antenna; and

connecting means, including bumps, for fixing said second chip to said first chip by providing mechanical and electrical connection between said circuit portion and said interconnection microstrip line and between said circuit portion and said input/output microstrip line through said input and output terminals and said bumps.

2. An antenna apparatus as claimed in claim 1, wherein said substrate comprises a silicon substrate.

3. An antenna apparatus as claimed in claim 1, wherein said substrate comprises a GaAs substrate.

4. An antenna apparatus as claimed in claim 1, wherein said substrate comprises a dielectric substrate.

5. An antenna apparatus as claimed in claim 1, wherein said second chip further comprises a GaAs substrate.

6. An antenna apparatus as claimed in claim 1, wherein said circuit portion comprises a detection circuit for detecting, a radio signal from radiowaves received by said microstrip patch antenna.

7. An antenna apparatus as claimed in claim 1, wherein said circuit portion comprises a radiowave signal generation circuit for generating a radiowave signal from an input signal supplied through said input/output microstrip line.

8. An antenna apparatus comprising:

a first chip having;

a substrate;

a ground film on said substrate;

a dielectric film on said ground film;

an interconnection microstrip line on said dielectric film at a first predetermined position; and

an input/output microstrip line on said dielectric film at a second predetermined position;

a second chip having;

a dielectric substrate having a through. hole;

a micro-patch antenna on a first surface of said dielectric substrate; and

a feeding terminal on a second surface of said. dielectric substrate, said first surface being opposite to said. second surface, said through hole electrically connecting said. micro-patch antenna to said feeding terminal;

first connecting means, having a first bump, for fixing said second chip to said first chip by providing a first mechanical and electrical connection between said feeding terminal and said interconnection microstrip line through said first bump; and

a third chip having a circuit portion therein, including input. and output terminals on a surface of the second chip, for effecting a predetermined operation with said micro-patch antenna; and

second connecting means, having second bumps, for fixing said third chip to said first chip by providing second mechanical and electrical connections between said circuit portion and said interconnection microstrip line and between said circuit portion and said input/output microstrip line through said input and output;

terminals and said second bumps.

9. An antenna apparatus as claimed in claim 8, wherein said. substrate comprises a silicon substrate.

10. An antenna apparatus as claimed in claim 8, wherein said substrate comprises a GaAs substrate.

11. An antenna apparatus as claimed in claim 8, wherein said substrate comprises a dielectric substrate.

12. An antenna apparatus as claimed in claim 8, wherein said second chip further comprises a GaAs substrate.

13. An antenna apparatus as claimed in claim 8, wherein said circuit portion comprises a detection circuit for detecting a radio signal from radiowaves received by said microstrip patch antenna.

14. An antenna apparatus as claimed in claim 8, wherein said circuit portion comprises a radiowave signal generation circuit for generating a radiowave signal from an input signal supplied through said input/output microstrip line.

15. An antenna apparatus comprising:

a first chip having;

a dielectric substrate having a salient portion and a hollow portion having a flat area and a slope portion connecting said salient portion to said flat area on a first surface of said dielectric substrate;

a ground conductor film on a second surface of said dielectric substrate which is opposite to said first surface;

a microstrip line, on said first surface, extending from said salient portion to said flat area via said slope portion; and

an input/output strip line, on said first surface, extending from said salient portion to said flat area via said slope portion and electrically insulated from said microstrip line;

a second chip having;

a second dielectric substrate having a through hole;

a micro-patch antenna on a first surface of said second dielectric substrate; and

a feeding terminal on a second surface of said second dielectric substrate which is opposite to said first surface of said second dielectric substrate, said through hole electrically connecting said micro-patch antenna to said feeding terminal;

first connecting means, having a first bump for fixing said second chip to said first chip by providing first mechanical and electrical connection between said feeding terminal and said microstrip line on said salient portion through said first bump;

a third chip, arranged in said hollow portion, having;

a circuit portion therein for effecting a predetermined operation with said micro-patch antenna; and

first and second terminals on a surface of said third chip; and

second connecting means, having second bumps, for fixing said third chip to said first chip by providing second mechanical and electrical connections between said circuit portion and said microstrip line and between said circuit portion and said input/output microstrip line through said second bumps.

16. An antenna apparatus as claimed in claim 15, wherein. said circuit portion comprises a radiowave signal generation circuit for generating a radiowave signal from an input signal supplied through said input/output microstrip line.

17. An antenna apparatus as claimed in claim 15, wherein said circuit portion comprises a detection circuit for detecting a radio signal from radiowaves received by said microstrip patch antenna.

18. An antenna apparatus as claimed in claim 15, wherein said second chip further comprises a GaAs substrate.

19. An antenna apparatus comprising:

a first chip having;

a dielectric substrate;

a ground conductor film on a first surface of said substrate having a slot;

a dielectric film on said ground conductor film, said dielectric film being connected to said dielectric substrate through said slot;

a microstrip line on said dielectric film at a first predetermined position;

an input/output microstrip line on said dielectric film at a second predetermined position; and

a micro-patch antenna on a second surface of said dielectric substrate which is opposite to said first surface;

a second chip having a circuit portion therein, including input and output terminals on a surface of the second chip, for effecting a predetermined operation with said micro-patch antenna; and

connecting means, having bumps, for fixing said second chip to said first chip by providing mechanical and electrical connections between said circuit portion and said interconnection microstrip line and between said circuit portion and said input/output microstrip line through said input and output terminals and said bumps, wherein said micro-patch antenna, said slot, and said microstrip line are arranged such that said micro-patch antenna and said microstrip line are electromagnetically coupled through said slot;

wherein radiowaves received by said micro-patch antenna are directly coupled to said microstrip line through said slot.

20. An antenna apparatus as claimed in claim 19, wherein said second chip further comprises a GaAs substrate.

21. An antenna apparatus as claimed in claim 19, wherein said circuit portion comprises a detection circuit for detecting a radio signal from radiowaves received by said microstrip patch antenna.

22. An antenna apparatus as claimed in claim 19, wherein said circuit portion comprises a radiowave signal generation circuit for generating a radiowave signal from an input signal supplied through said input/output microstrip line.

23. An antenna apparatus comprising:

a first chip having;

a dielectric substrate;

a ground conductor film on a first surface of said substrate having a slot;

a dielectric film on said ground conductor film, said dielectric film being connected to said dielectric substrate through said slot;

an input/output microstrip line on said dielectric film at a predetermined position; and

a micro-patch antenna on a second surface of said dielectric substrate which is opposite to said first surface;

a second chip having a circuit portion therein, including a terminal and a microstrip line on a surface of said second chip connected to said circuit, for effecting a predetermined operation with said micro-patch antenna; and

connecting means, having bumps, for fixing said second chip to said first chip by providing a connection between said circuit portion and said input/output microstrip line through said terminal and said bumps, wherein said micro-patch antenna, said slot, and said microstrip line are arranged such that said micro-patch antenna and said microstrip line are electromagnetically coupled through said slot;

wherein radiowaves received by said micro-patch antenna are directly coupled to said microstrip line through said slot.

24. An antenna apparatus as claimed in claim 23, wherein said second chip further comprises a GaAs substrate.

25. An antenna apparatus as claimed in claim 23, wherein said circuit portion comprises a detection circuit for detecting a radio signal from radiowaves received by said microstrip patch antenna.

26. An antenna apparatus as claimed in claim 23, wherein said circuit portion comprises a radiowave signal generation circuit for generating a radiowave signal from an input signal supplied through said input/output microstrip line.

27. An antenna apparatus comprising:

a first chip having;

a substrate;

a ground film on said substrate;

a dielectric film on said ground film;

a microstrip patch antenna on a first surface of said dielectric film;

an input/output microstrip line on said first surface of said dielectric film at a predetermined position;

a plurality of second chips, each having;

a respective dielectric substrate; and

a respective active circuit for effecting a predetermined operation; and

respective connecting means, having corresponding bumps, for fixing said plurality of second chips to said first chip by providing mechanical and electrical connections between said microstrip patch antenna and said active circuit of at least one of said plurality of second chips, mechanical and electrical connections between said active circuits of said plurality of second chips, and a mechanical and electrical connection between at least one of said plurality of second chips and said input/output microstrip line through said bumps, wherein said active circuits of said plurality of second chips comprise at least two different kinds of semiconductor structures.