High-frequency composite part

• US 5,903,421 A
• Filed: 10/21/1997
• Issued: 05/11/1999
• Est. Priority Date: 10/21/1996
• Status: Expired due to Term

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Suzaki, Hidefumi, Furutani, Koji, Nakajima, Norio
• Primary Examiner(s): Vo, Nguyen
• Assistant Examiner(s): Appiah, Charles N.
• Application Number:
  US08/949,285
• Time in Patent Office: 567 Days
• Field of Search: 379/387, 379/392, 455/3-7, 455/90, 455/83, 455/3.1, 333/104, 333/246, 333/247, 361/58, 361/113, 361/766, 361/780, 361/792, 361/793, 361/794, 361/795, 174/255, 174/252
• US Class Current: 361/58
• CPC Class Codes: H01P 1/15 by semiconductor devices
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0298 Multilayer circuits

Abstract

A high-frequency composite part includes a high-frequency switch and an amplifier in a transmission circuit side among high-frequency parts constituting a PHS portable telephone. In the telephone, the high-frequency switch is used for switching between the connection of the transmission circuit Tx and an antenna, and the connection of a receiving circuit Rx and the antenna. The amplifier at the Tx side amplifies a signal to be transmitted which has been converted into an RF signal and passes through a filter at the Tx side, and sends it to the high-frequency switch. A high-frequency composite part may comprise: a multilayer board formed by laminating a plurality of dielectric layers; a high-frequency switch formed of a diode mounted on said multilayer board and a transmission line and a capacitor comprising interconnected electrodes formed on respective layers within said multilayer board; and an amplifier formed of a transistor mounted on said multilayer board and a transmission line and a capacitor comprising interconnected electrodes formed on respective layers within said multilayer board. In the high-frequency composite part, the amplifier may be comprised in a transmission circuit. The high-frequency composite part further may comprise a filter formed of a transmission line and a capacitor comprising interconnected electrodes formed on respective layers within said multilayer board. The multilayer board may comprise low-temperature baked ceramic material.

Claims

1. A high-frequency composite part comprising:

a multilayer board formed by a laminating a plurality of dielectric layers;

a high-frequency switch comprising a diode mounted on said multilayer board, said diode being connected to a transmission line and a capacitor comprising interconnected electrodes formed on respective layers within said multilayer board; and

an amplifier comprising a transistor mounted on the same said multilayer board, said transistor being connected to a transmission line and a capacitor comprising interconnected electrodes formed on respective layers within said same multilayer board;

wherein said interconnected electrodes of said high-frequency switch and said amplifier are integrally baked with said dielectric layers and connected to each other with in said multilayer board.

2. A high-frequency composite part according to claim 1, comprising a transmission circuit and a receiving circuit formed of interconnected electrodes formed on respective layers within said multilayer board, wherein said amplifier is comprised in said transmission circuit.

3. A high-frequency composite part according to claim 2, wherein said electrodes are connected directly to each other between said high-frequency switch and said amplifier.

4. A high-frequency composite part according to claim 2, further comprising a filter formed of a transmission line and a capacitor comprising interconnected electrodes formed on respective layers within said multilayer board.

5. A high-frequency composite part according to claim 4, wherein said multilayer board comprises low-temperature baked ceramic material.

6. A high-frequency composite part according to claim 4, wherein said electrodes are connected directly to each other between said high-frequency switch and said amplifier.

7. A high-frequency composite part according to claim 1, further comprising a filter formed of a transmission line and a capacitor comprising interconnected electrodes formed on respective layers within said multilayer board.

8. A high-frequency composite part according to claim 7, wherein said multilayer board comprises low-temperature baked ceramic material.

9. A high-frequency composite part according to claim 7, wherein said electrodes are connected directly to each other between said high-frequency switch and said amplifier.

10. A high-frequency composite part according to claim 1, wherein said multilayer board comprises low-temperature baked ceramic material.

11. A high-frequency composite part according to claim 1, wherein said electrodes are connected directly to each other between said high-frequency switch and said amplifier.