Diode laser component with cooling element and diode laser module

• US 5,903,583 A
• Filed: 10/15/1997
• Issued: 05/11/1999
• Est. Priority Date: 02/22/1995
• Status: Expired due to Fees

• Current Assignee: Christoph Ullman, Volker Krause
• Original Assignee: Christoph Ullman, Volker Krause
• Inventors: Ullman, Christoph, Krause, Volker
• Primary Examiner(s): Healy, Brian
• Application Number:
  US08/894,372
• Time in Patent Office: 573 Days
• Field of Search: 372/34, 372/35, 372/36, 372/43, 372/50
• US Class Current: 372/35
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes
• CPC Class Codes: H01S 3/005 Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping shaping laser beam for working metal or other materials B23K26/06; optical elements, systems or apparatus in general G02B
• CPC Class Codes: H01S 5/024 Arrangements for thermal management
• CPC Class Codes: H01S 5/02423 Liquid cooling, e.g. a liquid cools a mount of the laser
• CPC Class Codes: H01S 5/4025 Array arrangements, e.g. constituted by discrete laser diodes or laser bar H01S5/42 takes precedence

Abstract

A diode laser component has at least one cooling element and at least one laser diode arrangement provided on a mounting surface of the cooling element. The cooling element is produced as a multilayer material or substrate made of several stacked layers joined by their flat sides. These layers consist partially of a metal and partially of an insulating material and/or of a material with a smaller thermal expansion coefficient than metal. At least some of the layers form a cooling plane. At least one cooling channel through which a cooling medium flows is formed in the plane of at least one layer of said cooling plane by at least one recess formed in said layer. Passages or channels are provided for supplying and draining the cooling medium that flows through the cooling channel.

Claims

1. A diode laser comprising

a multilayer substrate;

a diode laser component having a coefficient of thermal expansion mounted on the multilayer substrate;

the multilayer substrate comprising a plurality of layers joined to one another forming a stack of layers including an upper and a lower layer and having a coefficient of thermal expansion;

openings and recesses in at least a part of the layers in between the upper layer and the lower layer, the openings and recesses are in communication forming a coolant distribution system inside multilayer substrate with a coolant inlet and a coolant outlet;

at least the layers with the recesses and openings forming the coolant distribution system being metal layers;

a means for matching the coefficient of thermal expansion of the multilayer substrate to the coefficient of thermal expansion of the diode laser component, the means being a layer or insert of a material which has a coefficient of thermal expansion which is much less than the coefficient of thermal expansion of the metal layers;

the arrangement and formation of layers of the multilayer substrate being symmetrical to a center plane (M) which runs parallel to the upper layer and the lower layer.

2. The diode laser of claim 1 wherein;

the metal layers of the multilayer substrate is copper.

3. The diode laser of claim 1 wherein;

the means for matching the coefficient of thermal expansion of the substrate to the coefficient of thermal expansion of the diode laser component is a layer of ceramic.

4. The diode laser of claim 3 wherein;

the ceramic is aluminum nitride.

5. The diode laser of claim 1 wherein;

the insert is diamond.

6. The diode laser of claim 1 wherein;

the insert is T-BN.

7. The diode laser of claim 1 wherein;

the upper layer is metal.

8. The diode laser of claim 7 wherein;

the upper layer is smaller than other layers in the substrate.

17. A diode laser of claim 1 wherein said means for matching the coefficient of thermal expansion of the substrate to the coefficient of thermal expansion of the diode laser component being a layer or insert of BeO.

9. a laser diode comprising;

a multilayer substrate;

a laser diode component mounted on the multilayer substrate having a first layer with a coolant inlet and a coolant outlet;

a second layer with a coolant outlet and a first coolant distribution system,

the first coolant distribution system having at least two channels, the at least two channels connecting with one another and extending all the way through the second layer;

a third layer having at least one coolant inlet and a coolant outlet;

a fourth layer having a second coolant distribution system having at least two channels, the two channels connecting with one another and extending all the way through the fourth layer.

10. The laser diode of claim 9 further comprising:

a fifth layer having a coolant inlet and a coolant outlet,

the fifth layer being between the first and second layer.

11. The laser diode of claim 9 wherein;

the first layer is ceramic.

12. The laser diode of claim 9 wherein;

the second, third and fourth layers are metal.

13. A diode laser module comprising;

a plurality of diode laser modules stacked on one another forming a stack;

a first connection element on top of the diode laser modules stack,

a second connection element on bottom of the diode laser module stack,

the first and second connection elements being made of electrically conductive material, each diode laser module comprising;

a cooling body,

a first layer of ceramic on top of the cooling body,

a second layer of ceramic on bottom of the cooling body,

an upper and lower coating on the exterior of the first and second ceramic layers, the upper and lower coating being electrically connected,

an insulating layer of top of the upper coating, the insulating layer containing a laser diode, and

a top metal layer above the insulating layer.

14. The diode laser module according to claim 13, wherein:

the cooling body is a plurality of metal plates.

15. The diode laser module according to claim 14 wherein;

the plurality of metal plates are spaced from one another.

16. The diode laser module according to claim 13 wherein;

each diode laser module has an inlet coolant channel and an outlet coolant channel.