Method for aligning and forming microelectromechanical systems (MEMS) contour surfaces
First Claim
1. A method for fabricating micron or less sized devices onto a contoured surface of a substrate comprising:
- fabricating a patterned mask on a surface of a flexible film while said flexible film is in a flat condition to provide a flexible mask;
disposing a photoresist layer onto said contoured surface of said substrate;
aligning said patterned mask conformally on said contoured surface of said substrate; and
exposing said mask and said photoresist on said contoured surface of said substrate to a developing field of energy so that selected portions of said photoresist on said contoured surface of said substrate are developed thereby transferring a pattern from said patterned mask to said photoresist layer on said contoured surface of said substrate.
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Accused Products
Abstract
An integrated circuit, or microelectromechanical structure is defined onto a contour surface by utilizing a flexible mask upon which photolithographic patterns are first defined using conventional planar photolithographic techniques. The contour surface is provided with a thin film uniformly distributed on the surface and then the flexible mask is aligned with the contour substrate. Alignments are made through multiple stages of yaw alignment, translation alignment and rotational alignment. Once the mask is aligned with contour substrate it is then subjected while rotating to developing field, such as uniform illumination of ultraviolet light shining on the side of the contour substrate as it is rotated in the illumination field. The developed photoresist layer disposed on the surface of the contour substrate is thus developed and the underlying film etched according to the patterned mask in a manner similar to a conventional planar photolithography. Multiple layers are thus disposed masked and etched to result in complex multilayered integrated circuit and/or microelectromechanical devices disposed on the contour surface of a macromechanical component or structure.
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Citations
19 Claims
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1. A method for fabricating micron or less sized devices onto a contoured surface of a substrate comprising:
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fabricating a patterned mask on a surface of a flexible film while said flexible film is in a flat condition to provide a flexible mask; disposing a photoresist layer onto said contoured surface of said substrate; aligning said patterned mask conformally on said contoured surface of said substrate; and exposing said mask and said photoresist on said contoured surface of said substrate to a developing field of energy so that selected portions of said photoresist on said contoured surface of said substrate are developed thereby transferring a pattern from said patterned mask to said photoresist layer on said contoured surface of said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for fabricating an integrated circuit/microelectromechanical (IC/MEMS) structure on a surface of a cylindrical substrate comprising:
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disposing a thin film on said surface of said cylindrical substrate by rotating said cylindrical substrate while said thin film is disposed thereon; providing an aligned pattern on said thin film of said cylindrical substrate, which pattern is formed by use of a flexible mask which is fabricated while substantially flat and curved to conform to said cylindrical substrate; and exposing said aligned pattern on said thin film of said cylindrical substrate while rotating said cylindrical substrate to selectively define said IC/MEMS structure in said thin film on said cylindrical substrate surface. - View Dependent Claims (16, 17, 18, 19)
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Specification