Multi-chip module development substrate

• US 5,905,383 A
• Filed: 08/29/1995
• Issued: 05/18/1999
• Est. Priority Date: 08/29/1995
• Status: Expired due to Term

• Current Assignee: Tektronix Incorporated (Fortive Corp.)
• Original Assignee: Tektronix Incorporated (Fortive Corp.)
• Inventors: Frisch, Arnold M.
• Primary Examiner(s): Ballato, Josie
• Assistant Examiner(s): KOBERT, RUSSELL MARC
• Application Number:
  US08/521,148
• Time in Patent Office: 1,358 Days
• Field of Search: 324/765, 324/731, 324/519, 324/679, 324/755, 438/18, 29/830, 29/831, 29/846, 29/850, 29/593, 361/700, 361/748, 361/782
• US Class Current: 324/756.05
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence

Abstract

A multi-chip module development substrate (12) contains embedded test circuitry (30). Vias (38) connect I/O channels (Cn) of the test circuitry with conductive runs in interconnect layers (16,18) that are part of an interconnect structure (17) of the development substrate. Integrated circuit chips (14) are then mounted on the multi-chip module development substrate in selected electrical contact with the conductive runs. The embedded test circuitry includes multiple timing analyzer circuits (TAn) and multiple analog probe circuits en). In a preferred embodiment, these timing analyzer circuits and analog probe circuits are provided in redundant pairs, with a pair of each associated with each of the I/O channels. Multiple pairs of each kind of circuit are grouped within test cells (70) physically arranged in rectangular areas. Adjacent test circuit cells may be rotated with respect to each other to achieve more efficient connections to interconnect structure. After verification testing for proper operation of the multi-chip module circuitry, production versions of the multi-chip module are fabricated on multi-chip module production substrates not containing the test circuitry, thereby removing the extra cost and complexity associated with the development substrate.

Claims

1. An integrated circuit multi-chip module test and development substrate, comprising:

a first inactive semiconductor substrate layer (34);

a test circuit layer (30) disposed above the first inactive substrate layer, the test circuit layer comprising signal measurement circuitry and a channel (C1) adapted to communicate electrical signals;

a second inactive semiconductor substrate layer (32) disposed above the test circuit layer;

an interconnect structure (17) disposed above the second inactive semiconductor substrate layer, the interconnect structure including a conductive run and being adapted to receive one or more integrated circuit chips, said integrated circuit chips being mounted thereon; and

an electrically conductive via (38) extending through the second inactive semiconductor substrate layer to connect the channel in the test circuit layer with the conductive run In the interconnect structure;

wherein said test circuit layer communicates said electrical signals for testing said integrated circuit chips after said integrated circuit chips are mounted on said test and development substrate.

2. The multi-chip module development substrate according to claim 1 wherein the interconnect structure comprises a single interconnect layer (16).

3. The multi-chip module development substrate according to claim 1 wherein the interconnect structure comprises a plurality of interconnect layers (16,18).

4. The multi-chip module development substrate according to claim 1 wherein the signal measurement circuitry comprises a timing analyzer circuit (TA1).

5. The multi-chip module development substrate according to claim 1 wherein the signal measurement circuitry comprises an analog probe circuit (P1).

6. The multi-chip module development substrate according to claim 1 wherein the signal measurement circuitry comprises a plurality of timing analyzer circuits (TA1) and a plurality of analog probe circuits (P1) and a plurality of channels (Cn) adapted to communicate electrical signals.

7. The multi-chip module development substrate according to claim 6 further comprising an IEEE 1149.1-type boundary scan interface (48) for programming the signal measurement circuitry in the test circuit layer.

8. The multi-chip module development substrate according to claim 6 wherein the signal measurement circuitry comprises a plurality of test cells each comprising a timing analyzer circuits (TAn) an analog probe circuit (Pn) and a channel (Cn) adapted to communicate electrical signals.

9. The multi-chip module development substrate according to claim 8 wherein each of the plurality of test cells is contained within a substantially square area (70).

10. The multi-chip module development substrate according to claim 9 wherein one of the test cells is rotated approximately 90 degrees with respect to another of the test cells.

11. The multi-chip module development substrate according to claim 8 wherein each of the test cells comprise at least two timing analyzer circuits and at least two analog probe circuits and means to select (G1) which timing analyzer circuit and which analog probe circuits are to be used at a particular time.

12. The multi-chip module development substrate according to claim 1 further comprising an IEEE 1149.1-type boundary scan interface (48) for programming the signal measurement circuitry in the test circuit layer.

13. A method for developing an integrated circuit multi-chip module test and development substrate, comprising:

embedding a test circuit layer (30) between a first inactive semiconductor substrate layer (34) and a second semiconductor substrate layer (32), the test circuit layer including signal measurement circuitry and a channel (C1) adapted to communicate electrical signals;

disposing an interconnect structure (17) above a second inactive semiconductor substrate layer (26), the interconnect structure including a conductive run and being adapted to receive one or more integrated circuit chips, said integrated circuit chips being mounted thereon; and

providing an electrically conductive via (38) extending through the second inactive semiconductor substrate layer to connect the channel of the test circuit layer with the conductive run of the interconnect structure;

said test circuit layer being used for testing said integrated circuit chips after said integrated circuit chips are mounted on said multichip module test and development substrate.

14. The method according to claim 13 wherein the interconnect structure comprises a single interconnect layer (16).

15. The method according to claim 13 wherein the interconnect structure comprises a plurality of interconnect layers (16,18).

16. The method according to claim 13 wherein the embedding step comprises the step of providing within the signal measurement circuitry redundant test circuits that are selectable to bypass inoperative test circuits.

17. The method according to claim 16 further comprising the step of:

testing the test circuits to identify inoperative test circuits; and

bypassing inoperative test circuits using redundant test circuits.