Lightweight antenna subpanel having RF amplifier modules embedded in honeycomb support structure between radiation and signal distribution networks

• US 5,907,304 A
• Filed: 01/09/1997
• Issued: 05/25/1999
• Est. Priority Date: 01/09/1997
• Status: Expired due to Term

• Current Assignee: Hanger Solutions, LLC (IP Investments Group LLC)
• Original Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Inventors: Wilson, Steven E., Granholm, Erik, Holaday, David M., Hillman, Kelly V., Whybrew, Walter M., Nichols, James B., Rief, Gary A., Beck, Donald J., Pigon, Brett A.
• Primary Examiner(s): Le, Hoanganh
• Assistant Examiner(s): Ho, Tan
• Application Number:
  US08/781,530
• Time in Patent Office: 866 Days
• Field of Search: 343/700 MS, 343/853, 343/893, 343/872, 343/906
• US Class Current: 343/700.0MS
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 21/0025 Modular arrays
• CPC Class Codes: H01Q 21/0087 Apparatus or processes specially adapted for manufacturing antenna arrays manufacturing waveguides H01P11/00
• CPC Class Codes: H01Q 21/065 Patch antenna array

Abstract

A modular antenna architecture includes a plurality of joined-together flat, laminate-configured antenna sub-panels, in which RF signal processing (RF amplifier) modules are embedded within a very lightweight, honeycomb-configured support member, upon which respective antenna sub-array and control, power and beam steering signal distribution networks are respectively mounted. The thickness of the honeycomb-configured support member-embedded is sized relative to the lengths of the RF signal processing modules such that input/output ports at opposite ends of the RF modules are substantially coplanar with conductor traces on the front and rear facesheets, so that the RF modules provide the functionality of RF feed-throughs to provide RF signal coupling connections between the rear and front facesheets of the antenna sub-panel.

Claims

1. An antenna architecture having a plurality of joined-together laminate-configured sub-panels, a respective laminate-configured sub-panel comprising:

a first, generally flat facesheet having a first surface which supports a plurality of antenna elements and feed conductors therefor;

a second, generally flat facesheet having a first surface which supports a signal distribution network for said plurality of antenna elements;

a facesheet support structure having first and second sides that are generally parallel to one another and supporting thereon said first and second facesheets, respectively; and

a plurality of RF signal processing circuit modules arranged in said facesheet support structure in a direction that is generally orthogonal to said first and second sides thereof, and having first signal-coupling ports thereof located in proximity of said feed conductors of said antenna elements supported on said first surface of said first facesheet, and second signal-coupling ports thereof located in proximity of conductors of said signal distribution network supported on said first surface of said second facesheet; and

wherein

said signal distribution network comprises;

a first substrate containing a first signal distribution network for coupling to said signal processing modules, and being supported on a first location of said first surface of said second facesheet that is spaced apart from said second signal-coupling ports of said signal processing modules, and

a plurality of second substrates containing signal coupling links and being supported at a second location of said first surface of said second facesheet that is between said first location and said second signal-coupling ports of said signal processing modules, and

conductors joining said coupling links of said plurality of second substrates with said second signal-coupling ports of said signal processing modules, and joining said coupling links of said plurality of second substrates with conductors of said first signal distribution network on said first substrate.

2. An antenna architecture according to claim 1, wherein said coupling links of said plurality of second substrates are generally coplanar with conductors of said first signal distribution network on said first substrate.

3. An antenna architecture according to claim 2, wherein said coupling links of said plurality of second substrates are generally coplanar with said second signal-coupling ports of said signal processing modules.

4. An antenna architecture according to claim 3, wherein said conductors join said coupling links of said plurality of second substrates with said second signal-coupling ports of said signal processing modules, and join said coupling links of said plurality of second substrates with conductors of said first signal distribution network on said first substrate comprise ribbon conductors.

5. An antenna architecture according to claim 3, wherein said first and second signal-coupling ports comprise wrap around metalizations formed on insulator material extending in a direction of orientation of said signal processing circuit modules arranged within said facesheet support structure, said wrap around metalizations including respective portions that are generally parallel to said first and second surfaces of said first and second facesheets, and wherein said conductors are joined between said coupling links of said second substrates and said respective portions of said metalizations that are generally parallel to said first and second surfaces of said first and second facesheets.

6. An antenna architecture according to claim 1, wherein said second substrates are removably attached to said signal processing circuit modules, to provide mechanically strength to said antenna architecture.

7. A method of manufacturing an antenna architecture comprising the steps of:

(a) providing a support structure having first and second sides that are generally parallel to one another and are spaced apart from one another by a distance proximate the length of signal processing circuit modules;

(b) attaching a first, generally flat facesheet having a first surface which supports a plurality of antenna elements and feed conductors therefor to a first side of said support structure, and attaching a second, generally flat facesheet having a first surface which supports a signal distribution network for said plurality of antenna elements to a second side of said support structure;

(c) installing a plurality of said signal processing circuit modules in said support structure in a direction that is generally transverse to said first and second sides thereof, such that first signal-coupling ports thereof are located in proximity of said feed conductors of said antenna elements supported on said first surface of said first facesheet, and second signal-coupling ports thereof are located in proximity of conductors of said signal distribution network supported on said first surface of said second facesheet; and

(d) providing connections between said first signal-coupling ports of said signal processing circuit modules and said feed conductors of said antenna elements, and between second signal-coupling ports of said signal processing circuit modules and said signal distribution network, and wherein

said signal distribution network supported on said second facesheet comprises a first substrate containing a first signal distribution network for coupling to said signal processing modules, and being supported on a first location of said first surface of said second facesheet that is spaced apart from said second signal-coupling ports of said signal processing circuit modules, and a plurality of second substrates containing signal coupling links and being supported at a second location of said first surface of said second facesheet that is between said first location and said second signal-coupling ports of said signal processing circuit modules, and wherein

step (d) comprises conductively joining said coupling links of said plurality of second substrates with said second signal-coupling ports of said signal processing circuit modules, and conductively joining said coupling links of said plurality of second substrates with conductors of said first signal distribution network on said first substrate.

8. A method according to claim 7, wherein said coupling links of said plurality of second substrates are generally coplanar with conductors of said first signal distribution network on said first substrate.

9. A method according to claim 8, wherein said coupling links of said plurality of second substrates are generally coplanar with said second signal-coupling ports of said signal processing modules.

10. A method according to claim 9, wherein step (d) comprises conductively joining said coupling links of said plurality of second substrates with said second signal-coupling ports of said signal processing circuit modules, and conductively joining said coupling links of said plurality of second substrates with conductors of said first signal distribution network on said first substrate comprise ribbon conductors.

11. A method according to claim 9, wherein of said first and second signal-coupling ports comprise wrap around metalizations formed on insulator material extending in a direction of orientation of said signal processing circuit modules arranged within said support structure, said wrap around metalizations including respective portions that are generally parallel to said first and second surfaces of said first and second facesheets, and wherein said conductors are joined between said coupling links of said second substrates and said respective portions of said metalizations generally parallel to said first and second surfaces of said first and second facesheets.

12. A method according to claim 7, wherein said second substrates are removably attached to said signal processing circuit modules, to provide mechanically strength to said antenna architecture.

13. An antenna architecture comprising:

a first facesheet having a first surface supporting a plurality of antenna elements;

a second facesheet having a first surface upon which a signal distribution network for said plurality of antenna elements is supported;

a support member arranged between and supporting said first and second facesheets in generally spaced apart parallel relationship; and

a plurality of signal processing circuit modules contained within said support member between said first and second facesheets, and having first signal-coupling ports located in proximity of said first surface of said first facesheet, and second signal-coupling ports located in proximity of said first surface of said second facesheet, said second signal-coupling ports comprising metalizations having surface portions that are generally parallel to said first surface of said second facesheet; and

wherein

said signal distribution network supported on said first surface of said second facesheet comprises

a first substrate containing a first signal distribution network for coupling to said signal processing circuit modules, and being supported on a first location of said first surface of said second facesheet that is spaced apart from said second signal-coupling ports of said signal processing circuit modules, and

a plurality of second substrates supported at a second location of said first surface of said second facesheet that is between said first location and said second signal-coupling ports of said signal processing circuit modules, containing signal coupling links having surfaces that are generally parallel to said surface portions of said metalizations of said second signal-coupling ports of said signal processing circuit modules, and are generally parallel to the surface of conductor material of said first signal distribution network of said first substrate, and

conductors joining said coupling links of said plurality of second substrates with said metalizations of said second signal-coupling ports of said signal processing circuit modules, and joining said coupling links of said plurality of second substrates with said conductor material of said first signal distribution network on said first substrate.

14. An antenna architecture according to claim 13, wherein said conductors joining said coupling links of said plurality of second substrates with said metalizations of said second signal-coupling ports of said signal processing circuit modules, and joining said coupling links of said plurality of second substrates with said conductor material of first signal distribution network on said first substrate comprise ribbon conductors.

15. An antenna architecture according to claim 14, wherein said ribbon conductors comprise thermosonically bonded ribbon conductors.

16. An antenna architecture according to claim 13, wherein said plurality of signal processing circuit modules are oriented within said support member so as to be generally orthogonal to said first and second facesheets, and wherein said first and second signal-coupling ports comprise wrap around metalizations formed on insulator material extending in a direction of orientation of said signal processing circuit modules as supported within said support structure between said first and second facesheets, said wrap around metalizations including first metalization portions that are generally orthogonal to said first surface of said first facesheet, and second metalization portions that are generally parallel to said first surface of said second facesheet.

17. An antenna architecture according to claim 13, wherein said first signal-coupling ports terminate adjacent to feed conductors of said antenna elements supported on said first surface of said first facesheet.

18. An antenna architecture according to claim 13, wherein said second substrates are removably attached to said signal processing circuit modules, to provide mechanically strength to said antenna architecture.

19. A signal interconnection architecture comprising:

a support member having a surface upon which a signal distribution network is supported; and

a signal processing circuit module supported adjacent to said support member and having first signal-coupling ports located in proximity of said surface of said support member, and comprising metalizations that are generally parallel to said surface of said support member; and

wherein

said signal distribution network comprises

a first substrate containing a first signal distribution network for coupling to said signal processing circuit module, and being supported on a first location of said surface of said support member that is spaced apart from said signal-coupling ports of said signal processing circuit module,

a second substrate supported at a second location of first surface of said support member that is between said first location and said second signal-coupling ports of said signal processing circuit module, and containing signal coupling links lying in surfaces that are generally parallel to surfaces of said metalizations of said second signal-coupling ports of said signal processing circuit module, and are generally parallel to surfaces of conductor material of said first signal distribution network of said first substrate, and

conductors joining said coupling links of said second substrate with said metalizations of said signal-coupling ports of said signal processing circuit module, and joining said coupling links of said second substrate with said conductor material of said first signal distribution network on said first substrate.

20. A signal interconnection architecture according to claim 19, wherein said conductors comprise ribbon conductors.

21. A signal interconnection architecture according to claim 19, wherein said signal-coupling ports comprise wrap around metalizations formed on insulator material extending in a direction of orientation of said signal processing circuit module as supported adjacent to said support member, said wrap around metalizations including metalization portions that are generally parallel to said surface of said support member.

22. A signal interconnection architecture according to claim 19, wherein said second substrate is removably attached to said signal processing circuit modules, to provide mechanically strength to said signal interconnection architecture.