Substrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an encapsulant

• US 5,907,477 A
• Filed: 03/11/1997
• Issued: 05/25/1999
• Est. Priority Date: 09/19/1995
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Communications, Inc. (Micron Technology, Inc.)
• Inventors: Mousseau, Joe P., Tuttle, Mark E., Lake, Rickie C., Cirino, Clay L.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Vigushin, John B.
• Application Number:
  US08/814,206
• Time in Patent Office: 805 Days
• Field of Search: 257/787, 257/778, 257/782, 257/783, 257/784, 257/679, 257/728, 174/52.4, 174/255, 174/250, 174/258, 174/260, 174/52.2, 361/756, 361/749, 361/765, 361/760, 361/737, 29/841, 29/832, 438/107, 438/108, 438/109, 438/127, 235/487, 235/491, 235/492, 343/700 MS, 343/702
• US Class Current: 361/760
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 23/58 Structural electrical arrangements for semiconductor devices not otherwise provided for , e.g. in combination with batteries H01L23/49593, H01L23/49596 take precedence
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19043 being a resistor
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.

Abstract

An enclosed electrical circuit and method for manufacturing the electrical circuit are provided. Initially a flexible substrate is formed with a plurality of electrical circuits. By way of example, each circuit can contain a conductive trace, a battery and a die, all in electrical communication. During the manufacturing process, a barrier is placed on the substrate and a curable encapsulant is poured into a cavity formed by the barrier and the substrate to encapsulate each circuit. The barrier can be formed as a compartmentalized dam having a separate cavity for each circuit, as a perimeter dam having a single cavity, or as a spacer sheet having a separate cavity for each circuit formed by a pattern of cut outs. Following the encapsulation step, the electrical circuits can be singulated into separate encapsulated circuits.

Claims

1. An electrical assembly comprising:

a substrate;

a plurality of electrical circuits on the substrate, each circuit comprising a semiconductor die, a battery in electrical communication with the die, and an antenna in electrical communication with the die;

a dam on the substrate comprising a plurality of cavities enclosing and separating the electrical circuits; and

an encapsulant in the cavities, at least partially covering the circuits and comprising a cured material formulated to allow the substrate with the electrical circuits thereon to flex.

2. The assembly of claim 1 wherein the substrate comprises a material selected from the group consisting of polyester and PET having a thickness between about 0.9 mils to 10 mils.

3. The assembly of claim 1 wherein the encapsulant comprises epoxy.

4. The assembly of claim 1 wherein the encapsulant comprises opaque epoxy.

5. An electrical assembly comprising:

a substrate comprising a material selected from the group consisting of polyester and PET, having a thickness of from 0.9 mil to 10 mils;

a plurality of electrical circuits on the substrate, each circuit comprising a semiconductor die for storing information, an antenna in electrical communication with the die for sending and receiving the information as rf signals, and a battery in electrical communication with the die;

a dam on the substrate comprising a plurality of cavities enclosing and separating the electrical circuits; and

an encapsulant in the cavities at least partially encapsulating the circuits, the encapsulant comprising epoxy formulated to allow the substrate with the circuits thereon to flex.

6. The assembly of claim 5 wherein the dam has a height substantially equal to a thickness of the encapsulant.

7. The assembly of claim 5 wherein the epoxy is opaque.

8. An electrical assembly comprising:

a substrate comprising a material selected from the group consisting of polyester and PET, having a surface and a thickness of from 0.9 mil to 10 mils;

a plurality of separate electrical circuits on the surface of the substrate, each circuit comprising a semiconductor die for storing information, an antenna in electrical communication with the die for sending and receiving the information as rf signals, and a battery in electrical communication with the die;

a compartmental dam on the substrate comprising a plurality of separate cavities, each cavity at least partially enclosing and separating an electrical circuit; and

a cured material formed in each cavity encapsulating the electrical circuits, the cured material formulated to allow the substrate with the electrical circuits thereon to flex.

9. The assembly of claim 8 wherein the cured material comprises epoxy.

10. The assembly of claim 8 wherein the dam has a height substantially equal to a thickness of the cured material.

11. The assembly of claim 8 further comprising a sheet attached to the dam comprising a material selected from the group consisting of polyester and PET.