Thermocouple array and method of fabrication

• US 5,909,004 A
• Filed: 04/17/1996
• Issued: 06/01/1999
• Est. Priority Date: 04/17/1996
• Status: Expired due to Term

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Kornrumpf, William Paul, Miller, Mark Lloyd, Hedengren, Kristina Helena Valborg
• Primary Examiner(s): Gorgos, Kathryn
• Assistant Examiner(s): Parsons, Thomas H.
• Application Number:
  US08/632,809
• Time in Patent Office: 1,140 Days
• Field of Search: 136/201, 136/213, 136/224, 136/225, 136/227, 136/230, 136/232, 136/233, 374/179
• US Class Current: 136/201
• CPC Class Codes: G01K 3/14 in respect of space
• CPC Class Codes: G01K 7/02 using thermoelectric elements, e.g. thermocouples
• CPC Class Codes: H10N 10/17 characterised by the structure or configuration of the cell or thermocouple forming the device
• CPC Class Codes: H10N 10/854 comprising only metals H10N10/852, H10N10/853 take precedence

Abstract

A thermocouple array includes a dielectric layer having via openings therethrough, a first patterned conductive layer facing one surface of the dielectric layer, and a second patterned conductive layer facing another surface of the dielectric layer. Portions of the second patterned conductive layer can extend through the via openings to couple respective portions of the first patterned conductive layer. The second patterned conductive layer has a different thermal emf than the first patterned conductive layer. The dielectric layer, the first patterned conductive layer, and the second patterned conductive layer can be surface-conformable.

Claims

1. A thermocouple array comprising:

a dielectric layer having via openings therethrough;

a first patterned conductive layer facing one surface of the dielectric layer and comprising a first series of electrical runs;

a second patterned conductive layer comprising a different material than the first patterned conductive layer, facing another surface of the dielectric layer, and comprising a second series of electrical runs, the second series of electrical runs of the second patterned conductive layer being coupled at thermocouple joints through the via openings to the first series of electrical runs of the first patterned conductive layer, the second patterned conductive layer having a different thermal emf than the first patterned conductive layer,

the dielectric layer, the first patterned conductive layer, and the second patterned conductive layer being conformable to a surface to be measured,

the first and second patterned conductive layers of the thermocouple array including patterns suitable for providing measurement signals indicative of temperatures at each thermocouple joint and temperature gradients in the surface to be measured.

2. The thermocouple array of claim 1, wherein a difference in thermal emf of the first and second patterned conductive layers ranges from 1 μ

v/°

C. to 67 μ

v/°

C.

3. The thermocouple array of claim 2, wherein portions of one of the first and second patterned conductive layers extend through the via openings to respective portions of an other of the first and second patterned conductive layers.

4. The thermocouple array of claim 2, wherein one of the first and second patterned conductive layers comprises constantan, the other of the first and second patterned conductive layer comprises copper, and the dielectric layer comprises a polyimide.

5. The thermocouple array of claim 2, wherein each thermocouple joint has first and second individual leads with the first lead comprising a respective one of the first series of electrical runs and the second lead comprising a respective one of the second series of electrical runs.

6. The thermocouple array of claim 2, wherein each thermocouple joint has a shared lead comprising a respective one of the first series of electrical runs and an individual lead comprising a respective one of the second series of electrical runs.

7. The thermocouple array of claim 2, further including an additional dielectric layer facing one of the first and second patterned conductive layers.

8. The thermocouple array of claim 7, wherein the additional dielectric layer faces the second patterned conductive layer and further including a first adhesive layer between the first pattern of electrical conductors and the dielectric layer and a second adhesive layer between the dielectric layer and the additional dielectric layer.

9. The thermocouple array of claim 1 wherein the first and second patterned conductive layers of the thermocouple array including patterns suitable for providing simultaneous measurement signals indicative of temperatures at each thermocouple joint and temperature gradients in the surface to be measured.

10. A method for fabricating a thermocouple array comprising the steps of:

providing a first patterned conductive layer facing one surface of a dielectric layer;

forming via openings through the dielectric layer;

providing a second patterned conductive layer comprising a different material than the first patterned conductive layer and facing another surface of the dielectric layer, portions of the second patterned conductive layer being coupled through the via openings to respective portions of the first patterned conductive layer, the second patterned conductive layer having a different thermal emf than the first patterned conductive layer, the dielectric layer, the first patterned conductive layer, and the second patterned conductive layer being conformable to a surface to be measured,

wherein providing the first and second patterned conductive layer includes forming patterns in each of the first and second patterned conductive layers suitable for providing measurement signals indicative of temperatures and temperature gradients in the surface to be measured.

11. The method of claim 10, further including applying a support layer on a support carrier and wherein the step of providing the first patterned conductive layer comprises applying the first patterned conductive layer on the support layer and applying the dielectric layer over the first patterned conductive layer.

12. The method of claim 10, further including applying an additional dielectric layer over the dielectric layer and the second patterned conductive layer.

13. The method of claim 10, wherein a difference in thermal emf of the first and second patterned conductive layers ranges from 1 μ

v/°

C. to 67 μ

v/°

C.

14. The method of claim 13, wherein the step of providing the second patterned conductive layer includes providing portions of the second patterned conductive layer extending through the via openings to respective portions of the first patterned conductive layer.

15. The method of claim 13, wherein each respective coupled portion of the first and second patterned conductive layers comprises a thermocouple joint of a respective via opening, and wherein each thermocouple joint has first and second leads with the first lead comprising a respective portion of the first patterned conductive layer and the second lead comprising a respective portion of the second patterned conductive layer.

16. The method of claim 15, wherein each thermocouple joint shares at least one of its first and second leads with at least one other thermocouple joint.

17. The method of claim 15, wherein the first and second leads of each thermocouple joint comprise individual first and second leads.

18. The method of claim 10 wherein providing the first and second patterned conductive layer includes forming patterns suitable for providing simultaneous measurement signals indicative of temperatures and temperature gradients in the surface to be measured.

19. A thermocouple array comprising:

a dielectric layer having via openings therethrough;

a first patterned conductive layer facing one surface of the dielectric layer;

a second patterned conductive layer comprising a different material than the first patterned conductive layer and facing another surface of the dielectric layer, portions of the second patterned conductive layer being coupled through the via openings to respective portions of the first patterned conductive layer, the second patterned conductive layer having a different thermal emf than the first patterned conductive layer,

the first and second patterned conductive layers of the thermocouple array including patterns suitable for collectively providing measurement signals indicative of temperatures and spatial temperature gradients in the surface to be measured;

a first additional dielectric layer facing the first patterned conductive layer and the one surface of the dielectric layer, the first additional dielectric layer having a thinness sufficient to prevent its thermal mass from interfering with the measurement signals; and

a second additional dielectric layer facing the second patterned conductive layer and the another surface of the dielectric layer, the second additional dielectric layer having a thickness sufficient to provide a thermal barrier from air flow,

the dielectric layer, the first patterned conductive layer, the second patterned conductive layer, the first additional dielectric layer, and the second additional dielectric layer being conformable to a surface to be measured.