×

Semiconductor device having plural chips with the sides of the chips in face-to-face contact with each other in the same crystal plane

  • US 5,909,052 A
  • Filed: 05/24/1995
  • Issued: 06/01/1999
  • Est. Priority Date: 03/12/1986
  • Status: Expired due to Term
First Claim
Patent Images

1. A semiconductor device comprising plural semiconductor chips in each of which semiconductor elements are to be formed on a semiconductor substrate surface so that each element is formed on the same surface side, wherein said plural chips are combined with their sides kept in face-contact to each other in the same {111} crystal plane to form a sheet of wafer, wherein all contact surfaces of said plural chips are each formed of a {111} crystal plane and all contacts of the contact surfaces are formed such that the {111} crystal planes are in direct contact with each other, and wherein said {111} crystal plane contact surface of each of said plural chips is established over the total length of the thickness of said chip such that said {111} crystal plane contact surface of each chip is flat over the total length of the thickness of said chip.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×