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Three dimensional inspection system

  • US 5,909,285 A
  • Filed: 10/21/1997
  • Issued: 06/01/1999
  • Est. Priority Date: 05/05/1997
  • Status: Expired due to Term
First Claim
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1. An apparatus for three dimensional inspection of electronic leads, the apparatus comprising:

  • a) a transparent reticle having a top surface, wherein the transparent reticle receives a part having electronic leads for inspection on a central portion of the top surface;

    b) a fixed optical element attached to the top surface of the transparent reticle, wherein the fixed optical element is positioned to reflect a side view of the part through the transparent reticle;

    c) a camera located below the transparent reticle positioned to receive an image, including a bottom view of the part through the transparent reticle and a side view of the part from the fixed optical element, wherein the camera has an image data output representative of the bottom view and the side view;

    d) a reference line located on the transparent reticle, wherein the reference line is positioned to provide a view to the camera of the reference line between the bottom view and the side view; and

    e) a processor connected to receive the image data output, wherein the processor performs a three dimensional analysis on the image data output to inspect the electronic leads, wherein the processor has an electronic lead inspection result.

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