Three dimensional inspection system
First Claim
1. An apparatus for three dimensional inspection of electronic leads, the apparatus comprising:
- a) a transparent reticle having a top surface, wherein the transparent reticle receives a part having electronic leads for inspection on a central portion of the top surface;
b) a fixed optical element attached to the top surface of the transparent reticle, wherein the fixed optical element is positioned to reflect a side view of the part through the transparent reticle;
c) a camera located below the transparent reticle positioned to receive an image, including a bottom view of the part through the transparent reticle and a side view of the part from the fixed optical element, wherein the camera has an image data output representative of the bottom view and the side view;
d) a reference line located on the transparent reticle, wherein the reference line is positioned to provide a view to the camera of the reference line between the bottom view and the side view; and
e) a processor connected to receive the image data output, wherein the processor performs a three dimensional analysis on the image data output to inspect the electronic leads, wherein the processor has an electronic lead inspection result.
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Accused Products
Abstract
A part inspection and calibration method for the inspection of integrated circuits includes a camera to image a precision pattern mask deposited on a transparent reticle. Small parts are placed on or above the transparent reticle to be inspected. A light source and overhead light reflective diffuser provide illumination. An overhead mirror or prism reflects a side view of the part under inspection to the camera. The scene of the part is triangulated and the dimensions of the system can thus be calibrated. A reference line is located on the transparent reticle to allow an image through the prism to the camera of the reference line between the side view and the bottom view. A precise reticle mask with dot patterns gives an additional set of information needed for calibration. By imaging more than one dot pattern the missing state values can be resolved using an iterative trigonometric solution. The system optics are designed to focus images for all perspectives without the need for an additional focusing element.
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Citations
33 Claims
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1. An apparatus for three dimensional inspection of electronic leads, the apparatus comprising:
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a) a transparent reticle having a top surface, wherein the transparent reticle receives a part having electronic leads for inspection on a central portion of the top surface; b) a fixed optical element attached to the top surface of the transparent reticle, wherein the fixed optical element is positioned to reflect a side view of the part through the transparent reticle; c) a camera located below the transparent reticle positioned to receive an image, including a bottom view of the part through the transparent reticle and a side view of the part from the fixed optical element, wherein the camera has an image data output representative of the bottom view and the side view; d) a reference line located on the transparent reticle, wherein the reference line is positioned to provide a view to the camera of the reference line between the bottom view and the side view; and e) a processor connected to receive the image data output, wherein the processor performs a three dimensional analysis on the image data output to inspect the electronic leads, wherein the processor has an electronic lead inspection result. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method for three dimensional inspection of electronic leads from a single image, the method comprising the steps of:
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a) providing a transparent reticle having a top surface; b) placing a part having electronic leads for inspection on a central portion of the top surface of the transparent reticle; c) providing fixed optical elements for providing a side perspective of the part; d) providing a camera located beneath the transparent reticle to receive an image of the part and the side perspective provided by the fixed optical elements wherein the camera provides image data; e) providing a reference line located on the transparent reticle, wherein the reference line is positioned to provide a view to the camera of the reference line between the bottom view and the side view; and f) processing the image data with a computer to provide a three dimensional analysis of the part. - View Dependent Claims (19, 20, 21)
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22. A method for providing three dimensional inspection of an object having electronic leads from a single image, the method comprising the steps of:
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a) waiting for an inspection signal; b) acquiring an image of the object including a bottom view and a side view; c) processing the image to find a reference line located on the transparent reticle, wherein the reference line is positioned to provide a view to the camera of the reference line between the bottom view and the side view, a rotation, x placement and y placement of the object; d) locating the electronic leads of the object in the bottom view; e) locating the electronic leads of the object in the side view; f) determining a reference point for each lead; g) converting pixel values to world values; h) converting world values to part values; i) converting part values to measurement values, wherein the measurement values are determined by comparing the part values to predetermined part values; and j) providing a part result based on the measurement values and predetermined tolerance values. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29)
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30. An apparatus for three dimensional inspection of electronic leads, the apparatus comprising:
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a) a light source; b) a transparent reticle having a top surface, wherein the transparent reticle receives a part having electronic leads for inspection on a central portion of the top surface; c) a light diffuser positioned above the transparent reticle, wherein the light diffuser receives illumination from the light source and provides diffused illumination; d) a fixed optical element attached to the top surface of the transparent reticle, wherein the fixed optical element is positioned to reflect a side view of the part through the transparent reticle; e) a camera located below the transparent reticle positioned to receive an image, including a bottom view of the part through the transparent reticle and a side view of the part from the fixed optical element, wherein the camera has an image data output representative of the bottom view and the side view; and f) a processor connected to receive the image data output, wherein the processor performs a three dimensional analysis on the image data output to inspect the electronic leads, wherein the processor has an electronic lead inspection result. - View Dependent Claims (31, 32, 33)
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Specification