Method for manufacturing a power bus on a chip
First Claim
1. A method for manufacturing a power bus on a chip, said method comprising the steps of:
- (a) locating said power bus on said chip;
(b) determining the number of power slits to be generated in said power bus, including the steps of,(i) determining a width for said power bus and a length for said power bus,(ii) dividing said width by a maximum width of the power slits plus a first spacing distance between the power slits, resulting in a first number indicating how many power slit(s) to generate in a width direction of said bus, and(iii) dividing said length by a minimum length of the power slits plus a second spacing distance between the power slits, resulting in a second value indicating how many power slit(s) to generate in a length direction of said bus; and
(c) generating said plurality of power slits on said power bus according to the results of said steps (b)(ii) and (b)(iii) utilizing said first and second spacing distance between each of said power slits in said width and said length directions of said power bus, respectively.
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Abstract
A method for manufacturing a power bus on a chip, where the power bus has slits generated therein. The present invention relates to a method to manufacture a power bus in which the reference to a layout data base shows the coordinate location of the power buses in the chip. A height and width for the power bus is calculated based on its coordinates. Based on the height and width of the power buses and the predetermined size and spacing between power slits, a number of power slits to be generated is determined. These power slits are then generated by adding the power slits to the power bus in the coordinates of the layout database. The method of the present invention also generates power slits for use in manufacturing power buses on a chip for cases in which the power buses overlap.
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Citations
11 Claims
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1. A method for manufacturing a power bus on a chip, said method comprising the steps of:
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(a) locating said power bus on said chip; (b) determining the number of power slits to be generated in said power bus, including the steps of, (i) determining a width for said power bus and a length for said power bus, (ii) dividing said width by a maximum width of the power slits plus a first spacing distance between the power slits, resulting in a first number indicating how many power slit(s) to generate in a width direction of said bus, and (iii) dividing said length by a minimum length of the power slits plus a second spacing distance between the power slits, resulting in a second value indicating how many power slit(s) to generate in a length direction of said bus; and (c) generating said plurality of power slits on said power bus according to the results of said steps (b)(ii) and (b)(iii) utilizing said first and second spacing distance between each of said power slits in said width and said length directions of said power bus, respectively. - View Dependent Claims (2, 3)
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4. A method for manufacturing power buses on a chip, said method comprising the steps of:
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(a) locating all power buses in a defined area on the chip; (b) determining the number of power slits to be generated in each of said power buses, including the steps of, (i) determining a width for one of said power buses and a length for said one of said power buses, (ii) dividing said width by a maximum width of the power slits plus a first spacing distance between the power slits, resulting in a first number indicating how many power slit(s) to generate in a width direction of said one of said power buses, (iii) dividing said length by a minimum length of the power slits plus a second spacing distance between the power slits, resulting in a second value indicating how many power slit(s) to generate in a length direction of said one of said power buses, and (iv) repeating said steps (i)-(iii) for all of said power buses in said defined area; (c) generating said plurality of power slits on each of said power buses according to the results of said steps (b)(i)-(iv) utilizing said first and second spacing distance between each of said power slits in said width and said length directions of each of said power buses, respectively; (d) identifying if any of said power buses in said defined area overlap to form an orthogonal cross section; (e) removing all of said power slits in said orthogonal cross section; (f) extending first pointer line(s) from a first power slit(s) of a first power bus to an opposite boundary side of said orthogonal cross section to connect said first power slit(s) of said first power bus; (g) extending second pointer line(s) from a power slit(s) of a second power bus to an opposite boundary side of said orthogonal cross section from said second power slits of said second power bus; (h) intersecting, logically, said first pointer line(s) with said second pointer line(s) forming a defined hole indicating where to generate said power slits; and (i) generating said power slit(s) where said defined holes are located. - View Dependent Claims (5, 6, 7, 8, 9, 10, 11)
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Specification