Die attach adhesive compositions

• US 5,912,282 A
• Filed: 12/16/1996
• Issued: 06/15/1999
• Est. Priority Date: 12/16/1996
• Status: Expired due to Fees

• Current Assignee: Shell Oil Company (Shell Plc)
• Original Assignee: Shell Oil Company (Shell Plc)
• Inventors: Wong, Pui Kwan, Iyer, Shridhar R.
• Primary Examiner(s): Cain, Edward J.
• Application Number:
  US08/767,057
• Time in Patent Office: 911 Days
• Field of Search: 523/176, 523/177
• US Class Current: 523/176
• CPC Class Codes: C08G 67/02 Copolymers of carbon monoxide and aliphatic unsaturated compounds
• CPC Class Codes: C09J 9/02 Electrically-conducting adhesives
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 23/49513 having bonding material between chip and die pad
• CPC Class Codes: H01L 24/28 Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 24/31 Structure, shape, material or disposition of the layer connectors after the connecting process
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01011 Sodium [Na]
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01021 Scandium [Sc]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01038 : Strontium [Sr]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: Y02P 20/582 : Recycling of unreacted starting or intermediate materials

Abstract

A novel thermally reworkable die attach adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises

(a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and

(b) at least one thermally and/or electrically conductive material present in an effective amount up to about 90% by weight of the die attach composition to provide a conducting medium.

Claims

1. A thermally reworkable die attach adhesive composition comprising:

(a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 1,5-dialkyl substituted furan-containing polymer, and

(b) at least one thermally and/or electrically conductive material present in an effective amount of about 60% to about 90% by weight of the die attach composition to provide a conducting medium.

2. The thermally reworkable die attach adhesive composition of claim 1 wherein the crosslinked resin is reworkable at a temperature within the range of from about 100°

C. to about 250°

C.

3. The thermally reworkable die attach adhesive composition of claim 2 wherein the dienophile is an alkyne having electron withdrawing groups attached to both sides of an ethyne moiety.

4. The thermally reworkable die attach adhesive composition of claim 2 wherein the dienophile is selected from the group consisting of compounds containing but-2-ene-1,4-dione moieties in 5-membered rings, and compounds containing but-2-ene-1,4-diene moieties in 6-membered rings.

5. The thermally reworkable die attach adhesive composition of claim 2 wherein the dienophile is a cyclic derivative of maleic anhydride.

6. The thermally reworkable die attach adhesive composition of claim 3 wherein the thermally reworkable resin further comprises a residue of a cross-linking agent selected from the group consisting of, bismaleimido-capped poly(alkylene oxide)s, bis-maleimido-capped polysiloxanes, bismaleimides of hydrazine, 2,4-diaminotoluene, hexamethylenediamine, dodecamethylenediamine, and substituted and unsubstituted diamines of the formula:

##STR6##

7. The thermally reworkable die attach adhesive composition of claim 1 wherein the 2,5-dialkyl substituted furan-containing polymer is produced by reacting carbon monoxide with at least one olefinically unsaturated compound.

8. The thermally reworkable die attach adhesive composition of claim 7 wherein the olefinically unsaturated compound is an aliphatic α

-olefin.

9. The thermally reworkable die attach adhesive composition of claim 8 wherein the α

-olefin is propene.

10. The thermally reworkable die attach adhesive composition of claim 2 wherein the polymer from which it is produced has a number average molecular weight in the range of 500-30,000.

11. The die attach adhesive composition of claim 4 wherein the 2,5-dialkyl furan-containing polymer has a furan groups to ketone groups ratio of from about 1:

16 to about 4;

1.

12. The thermally reworkable die attach adhesive composition of claim 2 wherein the 2,5-dialkyl substituted furan groups in the 2,5-dialkyl substituted furan-containing polymer and the dienophiles are combined in a molar ratio of from about 10:

1 to about 1;

5.

13. The thermally reworkable die attach adhesive composition of claim 2 wherein the dienophile is a crosslinking agent containing two or more dienophiles in its molecular structure.

14. The thermally reworkable die attach adhesive composition of claim 2 wherein the thermally reworkable crosslinked resin is produced by reacting at least one dienophile and two or more 2,5-dialkyl substituted furan-containing polymer.

15. The thermally reworkable die attach adhesive composition of claim 2 wherein the thermally reworkable crosslinked resin comprises moieties of a 2,5-dialkyl substituted furan and moieties of a dienophile.

16. The thermally reworkable die attach adhesive composition of claim 2 further comprising (c) a free radical inhibitor and/or an ion scavenger.

17. The thermally reworkable die attach adhesive composition of claim 1 wherein the amount of thermally and/or electrically conductive material is present in an effective amount of about 60%.

18. The thermally reworkable die attach adhesive composition of claim 1 wherein the thermally and/or electrically conductive material is silver powder.

19. The thermally reworkable die attach adhesive composition of claim 18 wherein the silver powder is an electrically conductive material.

20. The thermally reworkable die attach adhesive composition of claim 18 wherein the silver powder is present in an amount of about 60% by weight of the die attach composition.