Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
First Claim
1. A cooling system for cooling an electrical component of a computer system comprising:
- (1) a blower controlled by a thermal sensor to control speed of air flow passing through the blower, the blower further configured to be positioned in a location independent from surfaces of electrical components to be cooled;
(2) a first opposing bonded heat sink coupled to the electrical component, the first opposing bonded heat sink comprising;
(A) a first extruded heat sink comprising a first base portion and a first plurality of fins projecting transverse to the first base portion; and
(B) a second extruded heat sink identical to said first extruded heat sink comprising a second base portion and a second plurality of fins projecting transverse to the second base portion, the second extruded heat sink coupled to the first extruded heat sink such that the first and the second pluralities of fins interlock to form one or more ducts running through the first opposing bonded heat sink, the first and second plurality of fins having smooth surfaces, wherein the first opposing bonded heat sink further configured to be an air flow conduit as part of ducting system; and
(3) a first air duct coupling the blower to the one or more ducts of the first opposing bonded heat sink, the first air duct configured in an elbow shape to provide an air flow path therein, wherein the air flow path is directed substantially parallel to a direction in which the one or more ducts run through the first opposing bonded heat sink.
0 Assignments
0 Petitions
Accused Products
Abstract
A device and method for cooling an integrated circuit package--in particular, a microprocessor--within an enclosed computer system. The device comprises a blower, a first heat sink attached to the microprocessor, and a first air duct coupling the blower to the first heat sink. The blower has an air intake from the exterior of the computer system. The blower generates an air stream which flows through the first air duct to the first heat sink for cooling the first microprocessor. A second air duct connected to the first heat sink may be used to subsequently direct the air stream to a second heat sink for cooling a second microprocessor. An efficient ducted heat sink for use in this cooling system can be easily constructed by attaching two extruded heat sinks.
-
Citations
14 Claims
-
1. A cooling system for cooling an electrical component of a computer system comprising:
-
(1) a blower controlled by a thermal sensor to control speed of air flow passing through the blower, the blower further configured to be positioned in a location independent from surfaces of electrical components to be cooled; (2) a first opposing bonded heat sink coupled to the electrical component, the first opposing bonded heat sink comprising; (A) a first extruded heat sink comprising a first base portion and a first plurality of fins projecting transverse to the first base portion; and (B) a second extruded heat sink identical to said first extruded heat sink comprising a second base portion and a second plurality of fins projecting transverse to the second base portion, the second extruded heat sink coupled to the first extruded heat sink such that the first and the second pluralities of fins interlock to form one or more ducts running through the first opposing bonded heat sink, the first and second plurality of fins having smooth surfaces, wherein the first opposing bonded heat sink further configured to be an air flow conduit as part of ducting system; and (3) a first air duct coupling the blower to the one or more ducts of the first opposing bonded heat sink, the first air duct configured in an elbow shape to provide an air flow path therein, wherein the air flow path is directed substantially parallel to a direction in which the one or more ducts run through the first opposing bonded heat sink. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A cooling system for cooling an electrical component of a computer system comprising:
-
(1) a blower; (2) a first opposing bonded heat sink coupled to the electrical component, the first opposing bonded heat sink comprising (A) a first extruded heat sink comprising a first base portion and a first plurality of fins projecting transverse to the first base portion; and (B) a second extruded heat sink comprising a second base portion and a second plurality of fins projecting transverse to the second base portion, the second extruded heat sink coupled to the first extruded heat sink such that the first and the second pluralities of fins interlock to form one or more ducts running through the first opposing bonded heat sink, the first and second plurality of fins having smooth surfaces, the first and second extruded heat sinks having an aspect ration greater than 4 to 1; and (3) a first air duct cooling the blower to the one or more ducts of the first opposing bonded heat sink, the first air duct providing an air flow path therein, wherein the air flow path is directed substantially parallel to a direction in which the one or more ducts run through the first opposing bonded heat sink, the blower, the first air duct and the first opposing bonded heat sink coupled in an elbow shape configuration, wherein the elbow shape configuration guides an air flow in a direction substantially parallel to surfaces of electrical components to be cooled. - View Dependent Claims (9, 10, 11, 12, 13, 14)
-
Specification