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Lid wafer bond packaging and micromachining

  • US 5,915,168 A
  • Filed: 05/06/1998
  • Issued: 06/22/1999
  • Est. Priority Date: 08/29/1996
  • Status: Expired due to Term
First Claim
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1. A method for packaging individual die at the wafer level comprising the steps of:

  • forming a plurality of die in a device substrate, each die comprising at least one device selected from the group consisting of a microelectronic structure, a micromachine, a micromachine component;

    forming an insulating layer on a lid wafer comprising a semiconductor layer;

    patterning the insulating layer to form a plurality of cavities, each cavity corresponding to one of a different die on the device substrate;

    bonding the insulating layer to the device substrate to seal at least one of the devices inside one of the cavities and form a bonded structure of dice covered and sealed inside the corresponding lid cavities.

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