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Electronic wiring substrate with subminiature thru-holes

  • US 5,916,425 A
  • Filed: 05/16/1996
  • Issued: 06/29/1999
  • Est. Priority Date: 05/16/1996
  • Status: Expired due to Term
First Claim
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1. An electronic wiring substrate having a plurality of analyte sensors for measuring characteristics of a fluid, the substrate having at least a first side defined by a planar surface and a second side, the electronic wiring substrate including:

  • a plurality of analyte sensors deposited on the first side planar surface of the substrate;

    a plurality of subminiature thru-holes having a diameter between about 0.002 to about 0.006 inch, each subminiature thru-hole positioned to lie under one of the plurality of analyte sensors;

    conductive material disposed within at least one of said subminiature thru-holes, the conductive material is the same material from which the analyte sensor at the point of contact between the conductive material and the analyte sensor is made and the conductive material being in electrical contact with the analyte sensor which lies over the subminiature thru-hole within which the conductive material is disposed; and

    at least one electrical conductor forming a first layer of the second side of the substrate, at least one of said electrical conductors being associated with a corresponding one of the plurality of subminiature thru-holes and being electrically coupled to the conductive material disposed within the corresponding one of the plurality of subminiature thru-holes, such that an electrical pathway is formed between the analyte sensor positioned over the subminiature thru-hole and the conductor associated with the subminiature thru-hole.

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