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Compact microwave module

  • US 5,917,388 A
  • Filed: 04/03/1997
  • Issued: 06/29/1999
  • Est. Priority Date: 04/04/1996
  • Status: Expired due to Fees
First Claim
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1. A microwave module comprising:

  • a plurality of stacked elementary structures forming a unit, each elementary structure comprising a bottom dielectric layer (14a, 15a) on a top surface of which an integrated circuit (20,

         21) is disposed, and a top dielectric layer (14b, 15b) covering the circuit (20,

         21); and

    a connection line (30) for connecting a first integrated circuit (20) mounted on a dielectric layer of a first structure of said plurality of structures to a second integrated circuit (21) mounted on a dielectric layer of a second structure of said plurality of structures;

    wherein said connection line (20a, 30, 21a) comprises an input coplanar line (21a) disposed on the top surface of the bottom dielectric layer of the first structure, an output coplanar line (20a) disposed on the top surface of the bottom dielectric layer of the second structure, and a link coplanar line (30) connecting one end of the input coplanar line to one end of the output coplanar line;

    wherein a given elementary structure is separated from an immediately adjacent elementary structure by a ground element (10,

         11), and both said input coplanar line (21a) and said output coplanar line (20a) extend beyond planes including the respective edges of the ground element separating said first elementary structure and said second elementary structure, so that said link coplanar line (30) is offset outwardly relative to the ground element.

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