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Process for forming a semiconductor device with an antireflective layer

  • US 5,918,147 A
  • Filed: 03/29/1995
  • Issued: 06/29/1999
  • Est. Priority Date: 03/29/1995
  • Status: Expired due to Fees
First Claim
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1. A process for forming a semiconductor device comprising the steps of:

  • forming a first layer over a semiconductor substrate, wherein the first layer is conductive;

    forming an antireflective layer over the first layer, wherein;

    the antireflective layer includes a first location, a second location, and a third location lying between the first and second locations, wherein the third location has a higher absorption coefficient compared to each of the first and second locations;

    the first location includes a first element and nitrogen;

    the second location includes a second element and nitrogen;

    the antireflective layer has a first nitrogen content at a first portion that includes the first location and a second nitrogen content at a second portion that includes the second location; and

    the second nitrogen content is higher than the first nitrogen content;

    patterning the first layer and the antireflective layer to form a first member including a remaining portion of the first layer, wherein the remaining portion of the first layer is at least part of a gate electrode, a contact structure, or an interconnect; and

    forming a conductive member near the remaining portion of the first layer, wherein;

    the conductive member abuts the antireflective layer; and

    the conductive member is spaced apart from the remaining portion of the first layer.

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