Multichip module assembly having via contacts and method of making the same

• US 5,920,123 A
• Filed: 01/24/1997
• Issued: 07/06/1999
• Est. Priority Date: 01/24/1997
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Moden, Walter L.
• Primary Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US08/788,004
• Time in Patent Office: 893 Days
• Field of Search: 257/678, 257/774, 257/698, 257/668, 257/723, 257/784, 257/783, 257/786, 257/778, 257/777, 257/779, 29/832, 29/840, 174/260, 174/261, 361/760, 361/792, 361/767, 438/15, 438/67, 438/66, 438/107, 438/108, 438/109, 438/110
• US Class Current: 257/774
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/0665 Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A multichip module includes a printed circuit printed circuit board onto which traces of electrically conductive material are formed and into which groups of plated vias are formed. Each group of vias is associated with an integrated circuit to be mounted in the assembly and has a spacing pattern that is identical to the spacing pattern of the bond pads of the integrated circuit with which it is associated. A layer of insulative adhesive material is provided, one side of which is attached to the printed circuit board. A plurality of integrated circuits are attached to the other side of the adhesive material. Each of the integrated circuits has a plurality of bond pads in a spacing pattern. A conductive contact is disposed in each via to connect a bond pad to that via.

Claims

1. An integrated circuit carrier assembly for holding an integrated circuit having a bond pad, comprising:

a substrate having a first side and a second opposing side, said substrate having a conductive trace coupled thereto, said substrate having an opening formed therein;

a conductive plate disposed in said opening and being in electrical communication with said trace;

a conductive contact disposed in said opening and being in electrical communication with said conductive plate;

an insulative adhesive layer coupled to said substrate; and

an integrated circuit coupled to said insulative adhesive layer such that said bond pad is in electrical communication with said conductive contact.

2. The integrated circuit carrier assembly of claim 1, comprising a first conductive trace coupled to said first side of said substrate and a second conductive trace coupled to said second side of said substrate.

3. The integrated circuit carrier assembly of claim 1, wherein said conductive contact comprises conductive epoxy.

4. The integrated circuit carrier assembly of claim 1, wherein said conductive contact comprises solder.

5. The integrated circuit carrier assembly of claim 1, wherein said substrate comprises an alignment opening to facilitate placement of said integrated circuit.

6. A multichip module assembly comprising:

a printed circuit board onto which traces of electrically conductive material are formed and into which groups of plated vias are formed, each group of vias being associated with an integrated circuit to be mounted in the assembly and having a spacing pattern identical to the spacing pattern of the bond pads of the integrated circuit with which it is associated;

a layer of insulative adhesive material, one side of which is attached to the printed circuit board;

a plurality of integrated circuits that are attached to the other side of the adhesive material, each said integrated circuit having a plurality of bond pads in a spacing pattern; and

a conductive contact disposed in each via to connect a bond pad to that via, said conductive contact comprising one of conductive epoxy and solder.

7. The integrated circuit carrier assembly of claim 6, wherein said printed circuit board having a first side and a second opposing side, said traces being formed on said first side and said second side.

8. The integrated circuit carrier assembly of claim 6, wherein said printed circuit board substrate comprises an alignment opening for each of said group of vias to facilitate placement of said integrated circuit.

9. A method of forming an assembly containing at least one integrated circuit, comprising the steps of:

forming a plurality of groups of plated vias in a printed circuit board, each said group of vias being associated with one of the integrated circuits in the assembly and the spacing pattern of the vias in each group corresponding to the spacing pattern of the bond pads on the integrated circuit with which said group of vias is associated;

forming a plurality of traces of electrically conductive material on the printed circuit board;

attaching a layer of insulative adhesive material to one side of the printed circuit board;

attaching said at least one integrated circuit to said insulative material such that the bond pads of said at least one integrated circuit are aligned with the group of vias for that integrated circuit; and

filling each via with a conductive material.

10. The method of claim 9, wherein said conductive material comprises a conductive epoxy.

11. The method of claim 9, wherein said conductive material comprises a solder.

12. A multichip module assembly comprising:

an integrated circuit having a plurality of bond pads in a spacing and pattern;

a printed circuit board carrying traces of electrically conductive material and having at least one group of plated vias there through, said at least one group of vias being associated said integrated circuit to be mounted in the assembly and having a spacing and pattern identical to the spacing and pattern of bond pads said integrated circuit, said vias of said at least one group and said bond pads of said integrated circuit being in substantial registration;

a layer of non-conductive adhesive material, indisposed between said provided circuit board and said integrated circuit; and

a conductive material disposed in each via in contact with a bond pad substantially registered therewith, said conductive material comprising one of conductive epoxy and solder.

13. The integrated circuit carrier assembly of claim 12, wherein said printed circuit board having a first side and a second opposing side, said traces being formed on said first side and said second side.

14. The integrated circuit carrier assembly of claim 12, wherein said printed circuit board substrate comprises an alignment opening for each of said group of vias to facilitate placement of said integrated circuit.

15. A method of forming an assembly containing at least one integrated circuit comprising:

forming at least one group of plated vias through said printed circuit board providing a printed circuit board having a plurality of traces of electrically conductive material thereon, said at least one group of vias being associated with one of the integrated circuits in the assembly and the spacing and pattern of the at least one group of vias corresponding to the spacing and pattern of the bond pads on the integrated circuit with which said at least one group of vias is associated;

attaching a layer of insulative adhesive material to one side of the printed circuit board;

attached said at least one integrated circuit to the insulative material such that the bond pads of said at least one integrated circuit are aligned with the group of vias for that integrated circuit; and

filling each via with a conductive material.

16. The method of claim 15, wherein said conductive material comprises a conductive epoxy.

17. The method of claim 15, wherein said conductive material comprises a solder.