Resonant tag labels and method of making the same

• US 5,920,290 A
• Filed: 05/14/1997
• Issued: 07/06/1999
• Est. Priority Date: 03/04/1994
• Status: Expired due to Fees

• Current Assignee: FLEXcon Company Incorporated
• Original Assignee: FLEXcon Company Incorporated
• Inventors: Pennace, John R., McDonough, Neil
• Primary Examiner(s): Wimer, Michael C.
• Application Number:
  US08/856,023
• Time in Patent Office: 783 Days
• Field of Search: 343/872, 343/873, 340/551, 340/572, 340/570
• US Class Current: 343/873
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: G06K 19/0776 the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
• CPC Class Codes: G08B 13/2414 using inductive tags
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: G08B 13/242 Tag deactivation
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: G08B 13/244 Tag manufacturing, e.g. continuous manufacturing processes
• CPC Class Codes: G08B 13/2442 Tag materials and material properties thereof, e.g. magnetic material details
• CPC Class Codes: G08B 13/2445 Tag integrated into item to be protected, e.g. source tagging
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2203/0156 Temporary polymeric carrier or foil, e.g. for processing or transferring
• CPC Class Codes: H05K 3/20 by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: H05K 3/4682 Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil

Abstract

A frangible label which includes a plurality of integrally joined layers deposited successively on a removable carrier film. One or more of the layers are electrically conductive and configured to define an electrical circuit. The label is transferrable from the carrier film onto a receiving surface and is otherwise inseparable from the carrier film without attendant disruption of the circuit. In an alternative embodiment, the label includes an adhesive layer for applying the label to a substrate, such that the plurality of integrally joined layers including the electrical circuit are transferrable to the receiving surface and are otherwise inseparable from the carrier film without destruction of the electrical circuit.

Claims

1. A labeling system comprising:

a carrier film;

a first electrically conductive layer formed as a deposit on said carrier film;

a dielectric layer formed as a deposit on and at least partially covering said first electrically conductive layer;

a second electrically conductive layer formed as a deposit on and at least partially covering said dielectric layer, said first and second electrically conductive layers being integrally joined to said dielectric layer and being configured and arranged to provide a frangible composite label structure defining an operable resonant circuit, said label structure having oppositely facing sides with one of said sides being separably joined to said carrier film; and

adhesive means coacting with the other side of said label structure for separating and transferring said label structure from said carrier film directly onto a receiving surface, the frangibility of said label structure being such that said label structure is otherwise inseparable from said carrier film without attendant disruption of said resonant circuit.

2. The labeling system as claimed in claim 1 wherein said adhesive means comprises an adhesive coating applied to the said other side of said label structure.

3. The labeling system as claimed in claim 1 wherein said adhesive means comprises an adhesive coating applied to said receiving surface.

4. The labeling system as claimed in claim 1 wherein said composite label structure has a thickness of between 0.5 to 1.2 mils.

5. The labeling system as claimed in claim 1 wherein said first and second electrically conductive layers comprise conductive ink coatings.

6. The labeling system of claim 5 wherein said conductive ink coatings have thicknesses ranging from 0.05 to 0.5 mils.

7. The labeling system as claimed in claim 1 wherein said first and second electrically conductive layers comprise electrodeless depositions ranging in thickness from 0.001 to 0.1 mils.

8. The labeling system as claimed in claim 1 wherein said first and second electrically conductive layers comprise vacuum metalized deposits ranging in thickness from 3.0×

10^-4 to 6.0×

10^-3 mils.

9. The labeling system as claimed in claim 1 wherein said first and second electrically conductive layers comprise sputter depositions ranging in thickness from 25 to 1200 Å

.

10. The labeling system as claimed in claim 1 wherein said first and second electrically conductive layers comprise plasma depositions ranging in thickness from 50 to 10,000 Å

.

11. The labeling system as claimed in claim 1 wherein said dielectric layer comprises a polymeric coating ranging in thickness from 0.025 to 1.2 mils.

12. The labeling system as claimed in claim 2 wherein said adhesive coating has a thickness ranging from 0.1 to 1.0 mils.

13. The labeling system as claimed in claim 1 wherein said label structure is otherwise inseparable from said carrier film without attendant disruption of said resonant circuit.

14. A labeling system comprising:

a carrier substrate;

a first electrically conductive pattern formed on one side of said substrate; and

a first dielectric material and a second electrically conductive pattern formed on said first electrically conductive pattern such that said first and second electrically conductive patterns are separated by said first dielectric material and together form a frangible composite structure that is transferrable from said carrier substrate onto a receiving surface to form a label comprising a frequency tuned circuit, the thickness of said frangible composite structure being in the range of about 0.025 mils to about 2.2 mils.

15. A labeling system as claimed in claim 14, wherein said carrier substrate comprises a release material on a surface thereof adjacent said first electrically conductive pattern.

16. A labeling system as claimed in claim 14, wherein said carrier substrate comprises a breakcoat material on a surface thereof adjacent said first electrically conductive pattern.

17. A labeling system as claimed in claim 14, wherein said frangible composite structure further includes adhesive material for adhering said composite structure to a receiving surface and having a peel strength greater than that required to separate said carrier substrate from said composite structure.

18. A labeling system as claimed in claim 14, wherein said frangible composite structure further includes adhesive means for adhering said composite structure to a receiving surface.

19. A labeling system as claimed in claim 14, wherein said frangible composite structure further includes a second dielectric material adjacent said second electrically conductive pattern.

20. A labeling system as claimed in claim 19, wherein said frangible composite structure further includes a third electrically conductive pattern, and said second and third electrically conductive patterns are separated by said second dielectric material, and together form a second frangible composite structure that is transferrable from said carrier substrate onto a receiving surface to form a label comprising a frequency tuned circuit.

21. A labeling system as claimed in claim 14, wherein said first and second electrically conductive patterns are inductively coupled to one another.

22. A labeling system comprising:

a carrier substrate, and

a frangible composite structure on said carrier substrate, said composite structure including first and second electrically conductive layers at least partially separated by a dielectric material and having a thickness in the range of about 0.025 to 2.2 mils, said composite structure being at least partially transferable from said carrier substrate onto a receiving surface to form a resonant tag label.

23. A labeling system as claimed in claim 22, wherein said composite structure is integrally associated with first portions of said carrier substrate and separably associated with second portions of said carrier substrate.

24. A labeling system as claimed in claim 22, wherein said dielectric material is formed as a deposit.

25. A labeling system as claimed in claim 22, wherein said dielectric material is formed as a deposit to a thickness in the range of about 0.025 to 2.2 mils.

26. A labeling system as claimed in claim 22, wherein said dielectric material forms a continuous film when said frangible composite structure is coupled to said carrier substrate.

27. A labeling system as claimed in claim 22, wherein said dielectric material forms a discontinuous film when said frangible composite structure is coupled to said carrier substrate.

28. A labeling structure as claimed in claim 22, wherein said frangible composite structure further includes an adhesive material for adhering said composite structure to a receiving surface.

29. A labeling system as claimed in claim 28, wherein said adhesive material has a peel strength that is greater than the peel strength required to separate said carrier substrate from said composite structure.

30. A labeling system comprising:

a frangible composite structure including a dielectric material interposed between a first electrically conductive pattern and a second electrically conductive pattern, and having a thickness in the range of about 0.025 to 2.2 mils, said composite structure being transferred from a carrier substrate on which the frangible composite structure was formed and subsequently transferred to a receiving surface to form a resonant tag; and

adhesive material for adhering said frangible composite structure to said receiving surface.

31. A labeling system as claimed in claim 30, wherein said adhesive material has a peel strength that is greater than that required to separate said carrier substrate from said frangible composite structure.

32. A labeling system as claimed in claim 30, wherein said first electrically conductive pattern is formed as a deposit on said carrier substrate.

33. A labeling system comprising:

a receiving surface;

a frangible composite structure coupled to said receiving surface, said composite structure having a first electrically conductive pattern and a second electrically conductive pattern at least partially separate by a dielectric material, said frangible composite structure having been transferred from a carrier substrate on which the frangible composite structure was formed and subsequently transferred to said receiving surface; and

adhesive material arranged to coact with said frangible composite structure to apply said composite structure to the receiving surface, said frangible composite structure forming an operable resonant circuit on said receiving surface, said composite structure being otherwise inseparable from said carrier substrate without attendant disruption of said resonant circuit.

34. A labeling system comprising:

a receiving surface;

a resonant composite structure coupled to said receiving surface, said resonant composite structure having a first electrically conductive pattern and a second electrically conductive pattern at least partially separate by a dielectric material, said resonant composite structure being at least partially separated from a frangible composite structure and a carrier substrate on which the frangible composite structure was formed; and

adhesive material arranged to coact with said resonant composite structure to apply said resonant composite structure to said receiving surface, said resonant composite structure forming an operable resonant circuit on said receiving surface, said resonant composite structure being otherwise inseparable from said carrier substrate without attendant disruption of said resonant circuit.

35. A labeling system comprising:

a receiving surface;

a resonant composite structure coupled to said receiving surface, said resonant composite structure having a first electrically conductive pattern and a second electrically conductive pattern at least partially separate by a dielectric material, said resonant composite structure being at least partially separated from a frangible composite structure and a carrier substrate on which the frangible composite structure was formed, said frangible composite structure including first portions separably associated with said carrier substrate, said first portions of said frangible composite structure defining said resonant composite structure upon having been transferred to said receiving surface; and

adhesive material arranged to coact with said resonant composite structure to adhere said resonant composite structure to said receiving surface, said resonant composite structure forming an operable resonant circuit on said receiving surface, said resonant composite structure being otherwise inseparable from said carrier substrate without attendant disruption of said resonant circuit.