Red and blue stacked laser diode array by wafer fusion
First Claim
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1. A method of fabricating a monolithic integrated edge-emitting semiconductor laser structure comprising the steps of:
- fabricating an inverted first laser structure for emitting light of a first wavelength, said inverted first laser structure having a fusion layer as the uppermost semiconductor layer,fabricating a second laser structure for emitting light of a second wavelength,wafer fusing said fusion layer of said inverted first laser structure to the uppermost semiconductor layer of said second laser structure, andforming contacts which enable independently addressable biasing of said first laser structure to emit light of said first wavelength and said second laser structure to emit light of said second wavelength.
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Abstract
A red laser structure has an inverted or p-side down orientation. The red laser structure is inverted and wafer fused to a blue laser structure to form a red/blue monolithic integrated laser structure. The top semiconductor layer of the inverted red laser structure is a GaInP fusion bonding layer which will be wafer fused to the top semiconductor layer of the blue laser structure which is a GaN cladding/contact layer.
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Citations
7 Claims
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1. A method of fabricating a monolithic integrated edge-emitting semiconductor laser structure comprising the steps of:
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fabricating an inverted first laser structure for emitting light of a first wavelength, said inverted first laser structure having a fusion layer as the uppermost semiconductor layer, fabricating a second laser structure for emitting light of a second wavelength, wafer fusing said fusion layer of said inverted first laser structure to the uppermost semiconductor layer of said second laser structure, and forming contacts which enable independently addressable biasing of said first laser structure to emit light of said first wavelength and said second laser structure to emit light of said second wavelength. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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