Light-emitting diode having a curved side surface for coupling out light

• US 5,923,053 A
• Filed: 09/30/1996
• Issued: 07/13/1999
• Est. Priority Date: 09/29/1995
• Status: Expired due to Fees

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Fischer, Helmut, Jakowetz, Wolf
• Primary Examiner(s): Hardy, David B.
• Application Number:
  US08/723,975
• Time in Patent Office: 1,016 Days
• Field of Search: 257/94, 257/95, 257/97, 257/98, 257/100
• US Class Current: 257/95
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body
• CPC Class Codes: H01L 2924/10157 at the active surface
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate

Abstract

A semiconductor component includes a semiconductor body having a front side, a rear side and at least one curved side surface. As viewed from outside the semiconductor body, the at least one curved side surface is convex adjacent the rear side and concave adjacent the front side. The rear side has a greater area than the front side. A method is also provided for producing a plurality of the semiconductor components.

Claims

1. A light emitting diode semiconductor component, comprising:

a semiconductor body having a front side, a rear side and at least one curved side surface;

as viewed from outside said semiconductor body, said at least one curved side surface being convex adjacent said rear side and concave adjacent said front side;

said rear side being reflective and having a greater area than said front side; and

said semiconductor body having a total thickness and a given thickness being greater than half of said total thickness, and said at least one curved side surface being convex up to said given thickness.

2. The semiconductor component according to claim 1, wherein said semiconductor body has a shape similar to a calotte.

3. The semiconductor component according to claim 1, including a plastic encapsulation applied directly to said semiconductor body.

4. The semiconductor component according to claim 1, wherein said semiconductor body is formed of III/V semiconductor material.

5. The semiconductor component according to claim 4, including a plastic encapsulation being applied directly to said semiconductor body and being transparent to light.

6. A light emitting diode semiconductor component, comprising:

a semiconductor body having a front side, a rear side and at least one curved side surface;

said at least one curved side surface having a convex shape adjacent said rear side and a concave shape adjacent said front side;

said at least one curved side surface having an inflection point; and

said rear side being reflective and having a greater area than said front side.